Abstract: An ultrasonic oscillating device comprising a base plate and an ultrasonic transducer attached to the base plate. The thickness of the base plate is an integer multiple of approximately a half-wavelength of an oscillation of the base plate in the direction of its thickness under a driving frequency. The base plate may be a quadrilateral such as a square and a rectangle with a length of one side of the quadrilateral being at least a quarter-wavelength of the oscillation. The base plate may be a circle with a length of a diameter of the circle being at least a quarter-wavelength of the oscillation. An ultrasonic washing apparatus comprising a cleaning tank, an ultrasonic multi-frequency oscillator, and the ultrasonic oscillating device is also provided.

Abstract: A socket structure for mounting an ultrasonic gas flow measuring device with respect to a gas flow pipe which is capable of effectively preventing condensed moisture from being collected in a gap between a socket and a probe head received in the socket. The socket structure includes a pair of sockets each provided at a gas flow pipe to receive therein a probe head in such a manner that a gap may be defined between the socket and the probe head, and a moisture collection preventing construction provided at each of the sockets. The moisture collection preventing construction serves to prevent condensed moisture from being collected in the gap to form a bridge between the socket and the probe head and may be formed by a plurality of grooves formed on an inner surface of the socket which surrounds the probe head, thus allowing condensed moisture collected in the gap to escape therethrough to the gas flow pipe.

Abstract: A semiconductor device inspection system capable of objectively accomplishing visual image inspection of a semiconductor device and minimizing error in the inspection, to thereby effectively carry out the inspection with high accuracy and at high speed. The system includes a low magnification image pickup mechanism which consists of a plurality of low magnification image pickup units each carrying out low magnification image pickup of a semiconductor device to generate an image signal. The system also includes a signal processing system for processing the image signal to judge the correctness of the semiconductor device. In the image pickup units, their light receptors are each arranged in parallel to an inspected surface of the semiconductor device and their central axes intersect together on the inspected surface.

Abstract: A socket structure for mounting an ultrasonic gas flow measuring device with respect to a gas flow pipe which is capable of effectively preventing condensed moisture from being collected in a gap between a socket and a probe head received in the socket. The socket structure includes a pair of sockets each provided at a gas flow pipe to receive therein a probe head in such a manner that a gap may be defined between the socket and the probe head, and a moisture collection preventing construction provided at each of the sockets. The moisture collection preventing construction serves to prevent condensed moisture from being collected in the gap to form a bridge between the socket and the probe head and may be formed by a plurality of grooves formed on an inner surface of the socket which surrounds the probe head, thus allowing condensed moisture collected in the gap to escape therethrough to the gas flow pipe.

Abstract: An ultrasonic transreceiver is disclosed which is capable of substantially preventing the formation of a gas boundary layer between a piezoelectric transducer and a housing and the breakage of the transducer due to thermal stress and ensuring satisfied electrical connection in the transreceiver. The ultrasonic transreceiver includes a spring for downwardly forcing the piezoelectric transducer arranged in the housing against a bottom surface of the housing. The transreceiver may include a viscous or elastic member arranged between the housing and the piezoelectric transducer to prevent a gas boundary layer from being formed therebetween. Also, the transreceiver may include a coiled spring laterally arranged between the housing and the piezoelectric transducer to forcedly press them apart from each other and electrically connect them to each other.

Abstract: A gas flow rate measuring device which is capable of removing a probe from a probe socket for inspection and/or replacement at the same time that while gas is flowing through a pipe. The gas flow rate measuring device includes a gas seal mechanism sealedly arranged between the probe socket and a probe coupler. The gas seal mechanism is formed therein with a hollow passage sufficient to allow the probe and a probe support to be moved therein and serves to hermetically seal the probe socket when the probe is removed from the probe socket. The gas flow rate measuring device may also include a ring member fitted on the probe support in a manner to be interposed between the probe support and the probe socket, arranged to prevent the transmission of a roundabout ultrasonic wave.

Abstract: In apparatus for measuring the propagation time of ultrasonic waves by counting the number of clock pulses occurring within the period of time from the transmission of an ultrasonic pulse to the receiving of the pulse, a receiving circuit receives a transmitted pulse and a received pulse and provides an output which continues from transmission until reception of the pulse. A time-difference detection circuit detects pulses occurring during a time interval t.sub.1 starting at the leading edge of the transmission pulse and ending at the leading edge of the first clock pulse thereafter and a time interval t.sub.2 starting at the leading edge of the received pulse and ending at the leading edge of the first clock pulse thereafter. The duration of the time interval t between transmission and reception is determined in accordance with the equationt=[A+1/m(B-C)].times.