Patents Assigned to Kaken Co., Ltd.
  • Patent number: 6629777
    Abstract: The buffer packing bag comprises an air-supplying passage, which is made of plastic films placed one on another and bonded at desirable spots, and an air-inflatable section formed beside the air-supplying passage, which is divided into individual air-inflatable parts, formed by heat-bonded at multiple spots, and check valves, which allow and stop air flow between each of individual air-inflatable parts and the air-supplying passage, and space-making folds, made in both of the divided portions of the air-inflatable section by heat-bonding to make at least two lines in each portions crossing the individual air-inflatable parts, with the formation to make a loading slit by folding inward from both of the width ends along the length side of the base and heat-bonding both of the overlapped areas of the length sides.
    Type: Grant
    Filed: November 30, 2001
    Date of Patent: October 7, 2003
    Assignees: Sun A. Kaken Co., Ltd., Matsushita Electric Industrial Co., Ltd., Yamato-Esulon Co., Ltd.
    Inventors: Mikio Tanaka, Kazuhiko Hosokawa, Sayuri Nakata, Yoshihito Takechi
  • Patent number: 6573321
    Abstract: An anti-contamination coating composition is obtained by mixing a tetraalkoxysilane condensate having an average condensation degree of 4 to 20 and has an alkyl group having 1 to 2 carbon atoms and an alkyl group having 3 to 10 carbon atoms, or an alkyl group having 1 to 3 carbon atoms and an alkyl group having 4 to 12 carbon atoms, the alkyl group having 3 to 10 carbon atoms or 4 to 12 carbon atoms present in the amount of 5 to 50% by equivalent based on all alkyl groups in the condensate, with a polyurethane resin, an acrylic copolymer resin or a silicone-acrylic copolymer resin in the amount of 1.0 to 40.0 parts by weight in term of SiO2 relative to 100 parts by weight of the polyol compound. The addition of a hydrophilic alkoxysilane having a poly alkylene oxide chain compound is also suitable.
    Type: Grant
    Filed: July 23, 2001
    Date of Patent: June 3, 2003
    Assignee: Sk Kaken Co., Ltd.
    Inventors: Hidehito Karuga, Shigeto Kamimura, Hiroshi Nakai, Hisashi Suzuki, Tadahiko Ikeuchi, Kenichi Ishigaki, Kensuke Kurimoto, Takanori Nakashoya
  • Publication number: 20020187225
    Abstract: A packaging body that the fabrication of the bag or filling, tight sealing of the contents and packaging can be easily performed as well as the burst of the packaging body at the time of cooking by heating can be prevented and a packaged food or the like can be manufactured at low cost is provided.
    Type: Application
    Filed: August 24, 2001
    Publication date: December 12, 2002
    Applicant: SUN A. KAKEN CO., LTD.
    Inventors: Takuji Sugiyama, Daisuke Uratani, Tomohito Hayama, Masafumi Oishi, Souichirou Katayama
  • Patent number: 6433076
    Abstract: There is provided a low-staining agent which can outstandingly improve an anti-staining property and a property of preventing penetration of a staining substance when it is added to an aqueous paint, which does not affect a weather resistance and a water resistance of the paint, and which has an excellent compatibility with the aqueous paint. The present invention also relates to a low-staining aqueous paint composition to which said low-staining agent is added. The present invention relates to an aqueous paint low-staining agent which is a modified condensation product of alkoxysilane having at least one polyoxyalkylene group and an alkoxyl group, wherein a repetition unit of said polyoxyalkylene group has 1 to 4 carbon atoms, and said alkoxyl group has 1 to 4 carbon atoms. In particular, it is preferable that the polyoxyalkylene group is a polyoxyethylene group and the alkoxyl group is an ethoxy group.
    Type: Grant
    Filed: July 16, 1999
    Date of Patent: August 13, 2002
    Assignee: SK Kaken Co., Ltd.
    Inventors: Shigeto Kamimura, Hiroyoshi Ono, Yoshifumi Asada, Hisashi Suzuki
  • Publication number: 20020077397
    Abstract: An anti-contamination coating composition is obtained by mixing a tetraalkoxysilane condensate having an average condensation degree of 4 to 20 and has an alkyl group having 1 to 2 carbon atoms and an alkyl group having 3 to 10 carbon atoms, or an alkyl group having 1 to 3 carbon atoms and an alkyl group having 4 to 12 carbon atoms, the alkyl group having 3 to 10 carbon atoms or 4 to 12 carbon atoms present in the amount of 5 to 50% by equivalent based on all alkyl groups in the condensate, with a polyurethane resin, an acrylic copolymer resin or a silicone-acrylic copolymer resin in the amount of 1.0 to 40.0 parts by weight in term of SiO2 relative to 100 parts by weight of the polyol compound. The addition of a hydrophilic alkoxysilane having a poly alkylene oxide chain compound is also suitable.
    Type: Application
    Filed: July 23, 2001
    Publication date: June 20, 2002
    Applicant: SK Kaken Co., Ltd.
    Inventors: Hidehito Karuga, Shigeto Kamimura, Hiroshi Nakai, Hisashi Suzuki, Tadahiko Ikeuchi, Kenichi Ishigaki, Kensuke Kurimoto, Takanori Nakashoya
  • Patent number: 6271293
    Abstract: The present invention relates to a coating composition, which forms an anti-contamination coat having hydrophilicity on the surface, soil-release effect and excellent stain resistance to oil, and which is also suitable for outside wall coating of buildings, having excellent interlaminar adhesion when multiple coating is performed. A conventional anti-contamination coating was insufficient in stainproofing performance immediately after formation of the coat, and there was no coating which is superior in stain resistance to oil and interlaminar adhesion.
    Type: Grant
    Filed: August 27, 1998
    Date of Patent: August 7, 2001
    Assignee: SK Kaken Co., Ltd.
    Inventors: Hidehito Karuga, Shigeto Kamimura, Hiroshi Nakai, Hisashi Suzuki, Tadahiko Ikeuchi, Kenichi Ishigaki, Kensuke Kurimoto, Takanori Nakashoya
  • Patent number: 6156462
    Abstract: For instance, when a washing-free yet low-residue type of flux is coated on a solder resist film, soldering can be carried out while no solder balls remain on a circuit substrate.A photosensitive resin composition comprises a photopolymerizable and photosensitive resin having at least one of a carboxyl group and an onium group, a photopolymerizable reactive diluent, a photopolymerization initiator, a thermosetting component, and an inorganic powder having an average particle size of 2 .mu.m to 20 .mu.m. A cured film thereof is used as a solder resist film for circuit substrate fabrication.A washing-free yet low-residue type of flux is so uniformly coated on the solder resist film that soldering can be carried out in the absence of any solder ball.
    Type: Grant
    Filed: August 14, 1998
    Date of Patent: December 5, 2000
    Assignee: Tamura Kaken Co., Ltd.
    Inventors: Makoto Yanagawa, Rinzo Tachibana, Hiroshi Yamamoto, Tetsuji Ishikawa, Tetsuo Kurokawa, Kohichi Ishida
  • Patent number: 5996187
    Abstract: A slider 1 for engaging at least two fasteners provided inside of opposed edge portions of a bag defining an opening. The fasteners each includes a male fastener member strip and provided on the inner surface of one of the edge portions and a female fastener member strip and provided on the inner surface of the other edge portion in opposed relation with the male fastener member. The slider 1 includes a slider body 2 and a clamp member 3 for the slider body 3. The slider body 2 includes two opposite plates 2a, 2a interconnected by a base portion 4 and foldable over each other at the base portion. At least one of plates 2a is formed in an inner surface thereof with at least two grooves 5, 5 arranged in parallel for fitting therein respective fastener portions of the bag for the plates 5, 5 to press and engage the fasteners from outside.
    Type: Grant
    Filed: November 18, 1998
    Date of Patent: December 7, 1999
    Assignees: Sun A Kaken Co., Ltd., Piaru Corporation
    Inventors: Mikio Tanaka, Akira Ishizaki
  • Patent number: 5863355
    Abstract: The invention provides a soldering flux for mounting circuit substrates, which is free from any organic solvent attributable to air pollution and dispenses with any washing step. The soldering flux is obtained by dissolving a rosin modified by an unsaturated organic acid according to the Diels-Alder reaction in an aqueous solvent. A volatile basic agent may further be contained in the flux.
    Type: Grant
    Filed: February 27, 1996
    Date of Patent: January 26, 1999
    Assignee: Tamura Kaken Co., Ltd.
    Inventors: Takao Ohno, Shouichi Saito, Satoshi Shinohara, Kazuyuki Takakuwa
  • Patent number: 5853957
    Abstract: For instance, when a washing-free yet low-residue type of flux is coated on a solder resist film, soldering can be carried out while no solder balls remain on a circuit substrate.A photosensitive resin composition comprises a photopolymerizable and photosensitive resin having at least one of a carboxyl group and an onium group, a photopolymerizable reactive diluent, a photopolymerization initiator, a thermosetting component, and an inorganic powder having an average particle size of 2 .mu.m to 20 .mu.m. A cured film thereof is used as a solder resist film for circuit substrate fabrication.A washing-free yet low-residue type of flux is so uniformly coated on the solder resist film that soldering can be carried out in the absence of any solder ball.
    Type: Grant
    Filed: May 8, 1996
    Date of Patent: December 29, 1998
    Assignee: Tamura Kaken Co., Ltd
    Inventors: Makoto Yanagawa, Rinzo Tachibana, Hiroshi Yamamoto, Tetsuji Ishikawa, Tetsuo Kurokawa, Kohichi Ishida
  • Patent number: 5723261
    Abstract: The present invention relates to a photopolymerizable composition; more specifically, the present invention relates to a photopolymerizable composition useful as photoimageable solder mask of one component type, which can form image by ultraviolet exposure and development in an aqueous solution of dilute alkali after film formation and which has excellent ultraviolet curability and heat resistance of solder. The composition contains a reaction product, a diluent and a sensitizer, the reaction product being produced by adding epoxy group-containing acrylic acid ester or epoxy group-containing methacrylic acid ester to a part of the carboxyl group of the copolymer of acrylic acid ester or methacrylic acid ester with acrylic acid or methacrylic acid.
    Type: Grant
    Filed: January 28, 1997
    Date of Patent: March 3, 1998
    Assignee: Tamura Kaken Co., Ltd.
    Inventors: Makoto Yanagawa, Shinji Santoo
  • Patent number: 5681974
    Abstract: Mo adsorbent for .sup.99 Mo-.sup.99m Tc generators has a skeleton structure having mainly repeating units represented by the general formula; ##STR1## wherein X is a halogen atom or alkoxide group having one to six carbon atoms, 10% or more of X is halogen, R is an alkylene, polymethylene, or carbon chain having unsaturated bond, repeating unit (D) is bonded to any one of repeating units (A), (B), and (C), the branch structure is controlled by the content of repeating units (A), (B), and (C), the adsorbent is insoluble in water and adsorbs selectively only Mo from an aqueous solution containing Mo, and elutes .sup.99m Tc generated from a radioactive isotope .sup.99 Mo. This Mo adsorbent uses .sup.99 Mo obtained from natural Mo by (n, .gamma.) method, therefore, a generator having the same size as conventional .sup.99m Tc generators is realized.
    Type: Grant
    Filed: May 20, 1996
    Date of Patent: October 28, 1997
    Assignees: Kaken Co., Ltd., Japan Atomic Energy Research Institute
    Inventors: Yoshio Hasegawa, Mizuka Nishino, Taketoshi Takeuchi, Katsuyoshi Tatenuma, Masakazu Tanase, Kiyoyuki Kurosawa
  • Patent number: 5181921
    Abstract: A detachable balloon with two self-sealing valves mounted at the opposite ends thereof. A guide wire and catheter can be inserted through one end of the balloon, and the guide wire extends all the way through the balloon and beyond the balloon out the other end of the balloon, so as to provide easy guidance of the balloon to any desired location in a blood vessel by use of the guide wire. The balloon can also include a material which can be detected by X-rays.
    Type: Grant
    Filed: May 24, 1991
    Date of Patent: January 26, 1993
    Assignee: Kaken Co., Ltd.
    Inventors: Kohzoh Makita, Tohru Machida
  • Patent number: 5100767
    Abstract: The present invention provides a photopolymerizable composition useful as a liquid photoimageable solder mask comprising (a) a reaction product obtained by reacting epoxy resin A containing at least two terminated epoxy groups with 0.8 to 1.2 mol, per 1 epoxy equivalent of epoxy resin A, of an .alpha.,.beta.-unsaturated carboxylic acid and then reacting same with 0.2 to 1.0 mol, per 1 epoxy equivalent of epoxy resin A, of polybasic acid anhydride, (b) diluent, (c) sensitizer, (d) epoxy resin B consisting of tris (2,3-epoxypropyl) isocyanurate whose melting point is 130.degree. C. or less, and (e) an epoxy resin curing agent represented by the general formula [I:] ##STR1## wherein R is --H, halogen, --NH.sub.2, --SH, aromatic hydrocarbon, a C.sub.1 -C.sub.4 alkyl group or NHR' (R' is a C.sub.1 -C.sub.4 alkyl group having --CN or NH.sub.2 C.dbd.NH).
    Type: Grant
    Filed: December 19, 1989
    Date of Patent: March 31, 1992
    Assignee: Tamura Kaken Co., Ltd.
    Inventors: Makoto Yanagawa, Shinji Santo
  • Patent number: 5098504
    Abstract: The present invention provides a refractory coating composition comprising:(i) 100 parts by weight of a hydraulic cement,(ii) 3 to 50 parts by weight of a re-emulsion type powdery resin,(iii) 50 to 600 parts by weight of a mixture of 15 to 85% by weight of aluminum hydroxide powder and 85 to 15% by weight of carbonate decomposable at a temperature of 300.degree. to 1000.degree. C., and(iv) 20 to 300 parts by weight of a lightweight aggregate having open cells at a ratio of at least 50% based on the total cells.
    Type: Grant
    Filed: June 29, 1990
    Date of Patent: March 24, 1992
    Assignee: SK Kaken Co., Ltd.
    Inventor: Hideo Motoki
  • Patent number: 4994326
    Abstract: A solder powder is coated with an agent that protects the powder from oxidation. The coating agent is substantially insoluble in a vehicle used to make solder pastes. Thus, pastes made with the coated powders also resist oxidation even when exposed to air. A method for making the coated solder powders is also disclosed and claimed.
    Type: Grant
    Filed: October 27, 1988
    Date of Patent: February 19, 1991
    Assignee: Tamura Kaken Co., Ltd.
    Inventors: Takashi Shimmura, Yoshihiro Miyano, Nobuo Tajima, Makoto Inoue
  • Patent number: 4826373
    Abstract: A pin for injecting a grout material comprising an upper structure (I) into which an upper half portion (1') wherein a screw thread (2) and a lengthwise hole (3) are formed, a packing (4), a washer (5) and a knock pin (11) for knocking a grout pin (10) are inserted, and a lower structure (II) into which a lower half portion (1"), both tongued pieces (7', 7") of a slit wherein said slit (7) and a knurling portion (8) are formed and in the space formed by both tongued pieces (7', 7"), through the lengthwise hole (3) of said upper structure, the grout pin and the knock pin for knocking said grout pin are inserted.
    Type: Grant
    Filed: April 16, 1987
    Date of Patent: May 2, 1989
    Assignee: Leo Kaken Co., Ltd.
    Inventor: Masahiro Nakano
  • Patent number: 4773583
    Abstract: A soldering device wherein the article to be soldered is moved into contact with molten solder which flows in the direction counter to the direction of movement of said article is characterized by including a nozzle for flowing said molten solder and a flow path of a channel shape provided contiguous thereto for circulating said molten solder flowed out of said nozzle, said flow path having side-wall plates which are vertically adjustable.
    Type: Grant
    Filed: December 11, 1986
    Date of Patent: September 27, 1988
    Assignees: Tamura Kaken Co., Ltd., Hitachi Ltd., Tamura Corporation
    Inventors: Ginya Ishii, Yoshihiro Miyano
  • Patent number: 4764452
    Abstract: The present invention provides a photosensitive resin composition comprising (a) 10-60 wt. % of a styrene--maleic acid copolymer or its partially esterified product having a molecular weight of 1,000-3,000 and an acid value of 50-500, (b) 1-30 wt. % of acrylate or methacrylate having a tetrahydrofurfuryl group or a hydroxyl group, (c) 1-30 wt. % of diacrylate or dimethacrylate of polyethyleneglycol or polypropylene glycol, (d) 1-40 wt. % of a monoester compound represented by the following general formula (I), (II), (III), (IV) or (V). ##STR1## (wherein, X stands for a divalent organic group, preferably an alkylene group having carbon atoms of 1-4 or --C.sub.n H.sub.2n O--.sub.p CH.sub.2 group wherein n is an integer of 2-6 and p is an integer of 1-19; Y stands for hydrogen atoms or a methyl group; and Y' stands for hydrogen atoms or an alkyl group having carbon atoms of 1-4.).
    Type: Grant
    Filed: June 19, 1987
    Date of Patent: August 16, 1988
    Assignee: Tamura Kaken Co., Ltd.
    Inventor: Takao Ohno
  • Patent number: 4293636
    Abstract: A photosensitive composition comprising polyester, a half-esterified hydroxy alkyl acrylate (or methacrylate) of polybasic acid (or its anhydride), an ethylenic unsaturated bond-having vinyl monomer and a photo-polymerization initiator is especially useful for processing printed circuit boards.
    Type: Grant
    Filed: August 14, 1980
    Date of Patent: October 6, 1981
    Assignee: Tamura Kaken Co., Ltd.
    Inventor: Ken Okuya