Patents Assigned to Kaken Tech Co., Ltd.
-
Patent number: 10615144Abstract: Provided are: a conductive paste in which sinterability of silver particles the conductive paste can be easily controlled by using silver particles having predetermined crystal transformation characteristics defined by an XRD analysis, and after a sintering treatment, excellent electrical conductivity and thermal conductivity can be stably obtained; and a die bonding method using the conductive paste. Disclosed is a conductive paste which includes silver particles having a volume average particle size of 0.1 to 30 ?m as a sinterable conductive material, and a dispersing medium for making a paste-like form, and in which when the integrated intensity of the peak at 2?=38°±0.2° in the X-ray diffraction chart obtainable by an XRD analysis before a sintering treatment of the silver particles is designated as S1, and the integrated intensity of the peak at 2?=38°±0.2° in the X-ray diffraction chart obtainable by an XRD analysis after a sintering treatment (250° C.Type: GrantFiled: October 10, 2017Date of Patent: April 7, 2020Assignee: KAKEN TECH CO., LTD.Inventors: Shigeo Hori, Hirohiko Furui, Akira Fujita
-
Patent number: 10508255Abstract: Provided are a cleaner composition that can exhibit excellent cleaning ability by including a predetermined amount of water, and can also effectively suppress metal corrosion; and a cleaning method thereof. Disclosed is a cleaner composition in a white turbid state including first to fourth organic solvents and water, in which the first organic solvent is a hydrophobic aromatic compound or the like; the second organic solvent is a hydrophobic monoalcohol compound; the third organic solvent is a predetermined hydrophilic nitrogen-containing compound or the like; the fourth organic solvent is a hydrophilic amine compound; the amount of incorporation of water is adjusted to a value within the range of 50 to 3,900 pbw with respect to 100 pbw of the total amount of the organic solvents, and when the cleaner composition is subjected to phase separation, the water concentration in the oil phase is adjusted to a value of 5 wt. % or less.Type: GrantFiled: December 2, 2016Date of Patent: December 17, 2019Assignee: KAKEN TECH CO., LTD.Inventors: Shigeo Hori, Hiroki Nakatsukasa, Yuki Akamatsu
-
Publication number: 20190048294Abstract: Provided are a cleaner composition that can exhibit excellent cleaning ability by including a predetermined amount of water, and can also effectively suppress metal corrosion; and a cleaning method thereof. Disclosed is a cleaner composition in a white turbid state including first to fourth organic solvents and water, in which the first organic solvent is a hydrophobic aromatic compound or the like; the second organic solvent is a hydrophobic monoalcohol compound; the third organic solvent is a predetermined hydrophilic nitrogen-containing compound or the like; the fourth organic solvent is a hydrophilic amine compound; the amount of incorporation of water is adjusted to a value within the range of 50 to 3,900 pbw with respect to 100 pbw of the total amount of the organic solvents, and when the cleaner composition is subjected to phase separation, the water concentration in the oil phase is adjusted to a value of 5 wt. % or less.Type: ApplicationFiled: December 2, 2016Publication date: February 14, 2019Applicant: c/o KAKEN TECH Co., Ltd.Inventors: Shigeo HORI, Hiroki NAKATSUKASA, Yuki AKAMATSU
-
Patent number: 10071420Abstract: Provided are a flaky-like silver powder having a low bulk density as well as a predetermined average particle size (D50) and the like, which is obtainable by using a predetermined wet reduction method, a conductive paste obtainable using such a flaky-like silver powder, and a method for producing such a flaky-like silver powder. Disclosed are a flaky-like silver powder obtainable by a wet reduction method, a conductive paste obtainable using a flaky-like silver powder, and a method for producing a flaky-like silver powder, in which the average particle size (D50) as an equivalent circle diameter obtainable when the flaky-like silver powder particles are viewed planarly is adjusted to a value within the range of 1.1 to 30 ?m, the thickness of the flaky-like silver powder particles is adjusted to 0.01 to 2 ?m, and the bulk density of the flaky-like silver powder is adjusted to a value within the range of 0.1 to 4 g/cm3.Type: GrantFiled: May 27, 2014Date of Patent: September 11, 2018Assignee: KAKEN TECH CO., LTD.Inventors: Shigeo Hori, Hirohiko Furui
-
Patent number: 9818718Abstract: Provided are: a conductive paste in which sinterability of silver particles the conductive paste can be easily controlled by using silver particles having predetermined crystal transformation characteristics defined by an XRD analysis, and after a sintering treatment, excellent electrical conductivity and thermal conductivity can be stably obtained; and a die bonding method using the conductive paste. Disclosed is a conductive paste which includes silver particles having a volume average particle size of 0.1 to 30 ?m as a sinterable conductive material, and a dispersing medium for making a paste-like form, and in which when the integrated intensity of the peak at 2?=38°±0.2° in the X-ray diffraction chart obtainable by an XRD analysis before a sintering treatment of the silver particles is designated as S1, and the integrated intensity of the peak at 2?=38°±0.2° in the X-ray diffraction chart obtainable by an XRD analysis after a sintering treatment (250° C.Type: GrantFiled: August 20, 2013Date of Patent: November 14, 2017Assignee: KAKEN TECH CO., LTD.Inventors: Shigeo Hori, Hirohiko Furui, Akira Fujita
-
Patent number: 9085751Abstract: Provided is a liquid concentrate for cleaning composition which could exhibit excellent environmental safety etc. by adding afterward a predetermined amount of water, and also has excellent regeneration efficiency, and provided are a cleaning composition and a cleaning method thereof. Disclosed is a liquid concentrate for cleaning composition which is used as a mixture with water and is intended for cleaning an object to be cleaned in a clouded state, with a predetermined amount of water having been added thereto, the liquid concentrate for cleaning composition including, a first organic solvent which is a predetermined hydrophobic glycol ether compound or the like, and a second organic solvent which is a predetermined hydrophilic amine compound.Type: GrantFiled: May 31, 2011Date of Patent: July 21, 2015Assignee: KAKEN TECH CO., LTD.Inventors: Shigeo Hori, Hiroki Nakatsukasa, Yuki Akamatsu
-
Publication number: 20150115018Abstract: Provided are: a conductive paste in which sinterability of silver particles the conductive paste can be easily controlled by using silver particles having predetermined crystal transformation characteristics defined by an XRD analysis, and after a sintering treatment, excellent electrical conductivity and thermal conductivity can be stably obtained; and a die bonding method using the conductive paste. Disclosed is a conductive paste which includes silver particles having a volume average particle size of 0.1 to 30 ?m as a sinterable conductive material, and a dispersing medium for making a paste-like form, and in which when the integrated intensity of the peak at 2?=38°±0.2° in the X-ray diffraction chart obtainable by an XRD analysis before a sintering treatment of the silver particles is designated as S1, and the integrated intensity of the peak at 2?=38°±0.2° in the X-ray diffraction chart obtainable by an XRD analysis after a sintering treatment (250° C.Type: ApplicationFiled: August 20, 2013Publication date: April 30, 2015Applicant: KAKEN TECH CO., LTD.Inventors: Shigeo Hori, Hirohiko Furui, Akira Fujita
-
Publication number: 20130096044Abstract: Provided is a liquid concentrate for cleaning composition which could exhibit excellent environmental safety etc. by adding afterward a predetermined amount of water, and also has excellent regeneration efficiency, and provided are a cleaning composition and a cleaning method thereof. Disclosed is a liquid concentrate for cleaning composition which is used as a mixture with water and is intended for cleaning an object to be cleaned in a clouded state, with a predetermined amount of water having been added thereto, the liquid concentrate for cleaning composition including, a first organic solvent which is a predetermined hydrophobic glycol ether compound or the like, and a second organic solvent which is a predetermined hydrophilic amine compound.Type: ApplicationFiled: May 31, 2011Publication date: April 18, 2013Applicant: Kaken Tech Co., Ltd.Inventors: Shigeo Hori, Hiroki Nakatsukasa, Yuki Akamatsu
-
Patent number: 7799408Abstract: The present invention provides an Ag or Ni conductive powder, which can show the high conductivity even in condition that a resin is included and can has the narrow particle size distribution, and a conductive composition using the same, and a producing method of the same. In such an Ag or Ni conductive powder, a conductive composition and a producing method of the conductive powder, the conductive powder having a convex radially extended and a concave, wherein a core material which is at least one particle selected from the group consisting of an organic type particle, a metal type particle and a ceramic type particle is included into the conductive powder.Type: GrantFiled: April 26, 2006Date of Patent: September 21, 2010Assignee: Kaken Tech Co. Ltd.Inventors: Shigeo Hori, Hirohiko Furui, Tadashi Kubota, Yoshiaki Kubota
-
Patent number: 7776808Abstract: The present invention provides a cleaning agent for removing the solder flux and method for cleaning the solder flux which exhibit the excellent cleaning property even at the time of cleaning a lead-free soldering flux, a high-melting-point solder flux or the like and, at the same time, exhibits the excellent rinsing property in the rinsing using an alcoholic solvent in a next step. Accordingly, the present invention provides a cleaning agent for removing the solder flux which sets a content of benzyl alcohol to a value which falls within a range of 70 to 99.9 weight % and a content of amino alcohol to a value which falls within a range of 0.1 to 30 weight % when a content of a glycol compound is below 1 weight % with respect to a total amount of the cleaning agent for removing the solder flux, and sets a content of benzyl alcohol to a value which falls within a range of 15 to 99 weight % and a content of amino alcohol to a value which falls within a range of 0.Type: GrantFiled: August 5, 2008Date of Patent: August 17, 2010Assignee: Kaken Tech Co., Ltd.Inventors: Shigeo Hori, Hisakazu Takahashi, Hirohiko Furui, Hiroki Nakatsukasa
-
Patent number: 7435711Abstract: The present invention provides a cleaning agent for removing the solder flux and method for cleaning the solder flux which exhibit the excellent cleaning property even at the time of cleaning a lead-free soldering flux, a high-melting-point solder flux or the like and, at the same time, exhibits the excellent rinsing property in the rinsing using an alcoholic solvent in a next step. Accordingly, the present invention provides a cleaning agent for removing the solder flux which sets a content of benzyl alcohol to a value which falls within a range of 70 to 99.9 weight % and a content of amino alcohol to a value which falls within a range of 0.1 to 30 weight % when a content of a glycol compound is below 1 weight % with respect to a total amount of the cleaning agent for removing the solder flux, and sets a content of benzyl alcohol to a value which falls within a range of 15 to 99 weight % and a content of amino alcohol to a value which falls within a range of 0.Type: GrantFiled: August 10, 2004Date of Patent: October 14, 2008Assignee: Kaken Tech Co., Ltd.Inventors: Shigeo Hori, Hisakazu Takahashi, Hirohiko Furui, Hiroki Nakatsukasa
-
Publication number: 20030201427Abstract: The present invention provides a conductive powder, which can show the high conductivity even in condition that a resin is included, and a conductive composition using the same.Type: ApplicationFiled: May 1, 2003Publication date: October 30, 2003Applicant: KAKEN TECH CO., LTD.Inventors: Shigeo Hori, Hirohiko Furui, Tadashi Kubota, Yoshiaki Kubota
-
Patent number: 5017303Abstract: A paint peeling composition contains as effective components thereof 17 to 25 weight percent of polyvinylalcohol or 2 to 12 weight percent of an acrylic resin or polyvinyl acetate and a subsstance which when heated is in the form of minute shells enclosing a gas or vapor, the shells being thermally expandable without rupturing.Type: GrantFiled: May 1, 1989Date of Patent: May 21, 1991Assignee: Kaken Tech Co., Ltd.Inventors: Keisaku Komatsu, Takashi Yamada, Toshimi Owatari