Patents Assigned to Kan Electronics Co., Ltd.
  • Wire bonder system
    Patent number: 5377894
    Abstract: A wire bonder system comprising mounting a tool for ultrasonic bonding onto a transducer and the tool is protruded from the transducer with its bonding side to supply the high frequency electric power to the transducer. The protruded length of the tool is adjusted so as to avoid the length protruded from the transducer to minimize the high frequency electric power.
    Type: Grant
    Filed: August 31, 1993
    Date of Patent: January 3, 1995
    Assignee: Kan Electronics Co., Ltd.
    Inventors: Kiyoshi Mizoguchi, Ryoetsu Sato, Morikazu Gotoh