Abstract: A system for producing a product is disclosed. The system includes a production facility for producing a product using a chemical process involving chemical reactions, and an information processing device comprising a computer processor that simulates, using a hybrid model, the chemical reactions in the chemical process that produces the product to obtain a predicted output, wherein the hybrid model is a combination of a first-principles model and a data-driven model, determines, using an observer model, expected concentrations and levels of all substrates for the simulated process, sets derived optimal conditions for the chemical process based on the estimated concentrations and levels of all substrates, and predicts future production results based on a current status of the production facility.

Abstract: A moisture curable composition, and a method of application and a substrate including the same are disclosed herein. In some embodiments, a curable composition includes a component (A) comprising an organic polymer containing reactive silicon groups represented by the general formula (1), a component (B) comprising an organic polymer having a viscosity lower than 10,000 cP at 23° C. containing reactive silicon groups represented by the general formula (2), and a component (C) comprising a polyolefin polymer. The moisture curable composition has universal adhesiveness to an adhesion-resistant substrate, such as PVC, EPDM, and TPO. The substrates can be smooth-back or fleece-back substrates.

Abstract: A thermoplastic resin composition, including: 100 parts by weight of a thermoplastic resin (A); and 0.1 to 30 parts by weight of a processing aid (B). The processing aid (B) has a styrene-equivalent weight average molecular weight of from 300,000 to 8,000,000, and contains 60 wt % or more of a polymer (B1) obtained by polymerizing monomers comprising from 40 to 99.9 wt % of styrene, 0.1 to 10 wt % of an acid group-containing monomer, and 0 to 59.9 wt % of a vinyl monomer.

Abstract: A composition including a medium and surfactant-free nanoparticles (SFNPs) at different dispersion state or aggregation form. The composition includes: (a) a composition of a medium and surfactant-free nanoparticles in primary form, wherein the dielectric constant value (DE value) of the medium is equal to or larger than the intrinsic dielectric constant value (IDE) of the SFNPs and smaller than about 1.

Abstract: A moisture curable composition, a method of applying the same, and a composition including the same are disclosed herein. In some embodiments, a curable composition, comprises: a component (A) having an organic polymer containing reactive silicon groups represented by the following general formula (1): —Si(R13-a)Xa (1) wherein R1 represents an alkyl group having 1 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, or an aralkyl group having 7 to 20 carbon atoms, wherein X represents a hydrolyzable group, wherein each X is the same or different when two or more X are present, a is an integer from 1 to 3, when a is 1, each R1 may be the same or different, and when a is 2 or 3, each X may be the same or different; a component (B) having a chlorinated polyolefin polymer; and a component (C) having a carboxylic acid metal salt.

Abstract: A viscosity modifier for a condensation polymer may include a chain extender comprising at least one reactive monomer and at least one vinyl monomer copolymerizable with the reactive monomer, the chain extender being present in an amount ranging from 15 to 70 wt % of the viscosity modifier; and a non-condensation carrier resin present in an amount ranging from 30 to 85 wt % of the viscosity modifier. Condensation polymer compositions, methods of forming viscosity modifiers, and methods of molding condensation polymer compositions are also provided.

Abstract: A system for monitoring and responding to a cerebrovascular accident includes a computer, including a computer processor and a computer transceiver, a storage that stores personal medical information and a risk level, and a portable device attached to a user. When the computer transceiver receives personal medical information of the user, the computer processor calculates the risk level of a cerebrovascular accident based on the personal medical information. When the computer transceiver receives acceleration information, the computer processor determines whether to contact a predetermined contact based on the risk level and the personal medical information. The portable device includes an acceleration sensor, a position receiver, a clock, a portable transceiver, and a portable processor.

Abstract: A moisture curable composition, and a method of application and a substrate including the same are disclosed herein. In some embodiments, a curable composition includes a component (A) comprising an organic polymer containing reactive silicon groups represented by the general formula (1), a component (B) comprising an organic polymer having a viscosity lower than 10,000 cP at 23° C. containing reactive silicon groups represented by the general formula (2), and a component (C) comprising a polyolefin polymer. The moisture curable composition has universal adhesiveness to an adhesion-resistant substrate, such as PVC, EPDM, and TPO. The substrates can be smooth-back or fleece-back substrates.

Abstract: The present invention discloses a polyamic acid resin composition in a REACH-approved solvent system for use in wire coating applications. The polyamic acid resin composition comprises a molecular weight greater than 8,000 grams per mole, more preferably greater than 20,000 grams per mole. The REACH-approved solvent system comprising a primary REACHapproved solvent with one or more optional secondary REACH-approved co-solvents. The secondary REACH-approved co-solvent can be reactive or non-reactive with dianhydride. The present invention also discloses the elimination of solvents in polyamic acid resin to produce a REACH-approved polyamic acid resin powder.

Abstract: An amide acid oligomer (AAO) solution, methods of making the same, powder, AAO solution prepregs, AAO dry prepreg, imide prepregs, and fiber reinforced polyimide composites with high temperature resistance and excellent mechanical properties are disclosed herein. In some embodiments, a method of making an AAO solution includes dissolving an aromatic diamine and an aromatic tetracarboxylic compound in a solvent to form a mixture, wherein the solvent has a boiling point of less than 150° C.; stirring the mixture at a temperature ranging from about 5° C. to about 60° C. for about I hour to about 24 hours to form a reaction solution; adding unsaturated acid anhydride to the reaction solution; and stirring the reaction solution at a temperature ranging from about 5° C. to about 60° C. for about 1 minute to about 180 minutes to form an amide acid oligomer solution, the amide acid oligomer solution having amide acid oligomer in the solvent.

Abstract: A production system includes an information processing device that carries out the processes of: (i) generating one or more production condition candidates each of which is a candidate for a production condition under which the product is produced; (ii) determining, using a prediction model, a prediction of a production result of a case in which the product is produced under each of the one or more production condition candidates; and (iii) generates, by evaluating a result of the prediction based on a predetermined evaluation standard, an evaluation of each of the one or more production condition candidates. The information processing device repeats the process (ii) while changing between the one or more production condition candidates, and determines a production condition candidate, the evaluation of which in the process (iii) satisfies a predetermined standard, to be the production condition under which the product is produced.

Abstract: A thermoplastic resin composition, including: 100 parts by weight of a thermoplastic resin (A); and 0.1 to 30 parts by weight of a processing aid (B). The processing aid (B) has a styrene-equivalent weight average molecular weight of from 300,000 to 8,000,000, and contains 60 wt % or more of a polymer (B1) obtained by polymerizing monomers comprising from 40 to 99.9 wt % of styrene, 0.1 to 10 wt % of an acid group-containing monomer, and 0 to 59.9 wt % of a vinyl monomer.

Abstract: Methods may include coating a substrate with a polyimide precursor composition prepared from a reaction of a diamine component and a dianhydride component, wherein the reaction includes: a diamine component containing one or more diamines having the formula: wherein R3 is selected from hydrogen, methyl, and halogen; a dianhydride component containing one or more dianhydrides, wherein the one or more dianhydrides include 4,4?-bisphenol A dianhydride (BPADA); and at least one comonomer selected from: one or more additional diamine comonomers, wherein the one or more additional diamine comonomers are present at 1 to 40 mol % of the diamine component; and/or one or more additional dianhydride comonomers, wherein the one or more additional dianhydride comonomers are present at 1 to 40 mol % of the dianhydride component; and curing the polyimide precursor composition to generate a polyimide adhesive on the substrate.

Abstract: A production system includes an information processing device that carries out the processes of: (i) generating one or more production condition candidates each of which is a candidate for a production condition under which the product is produced; (ii) determining, using a prediction model, a prediction of a production result of a case in which the product is produced under each of the one or more production condition candidates; and (iii) generates, by evaluating a result of the prediction based on a predetermined evaluation standard, an evaluation of each of the one or more production condition candidates. The information processing device repeats the process (ii) while changing between the one or more production condition candidates, and determines a production condition candidate, the evaluation of which in the process (iii) satisfies a predetermined standard, to be the production condition under which the product is produced.

Abstract: A two-component moisture curable composition, a membrane system including the same, and a structure including the same are disclosed herein. In some embodiments, a structure includes a substrate, and a membrane system disposed on the substrate, wherein the membrane system comprises a single layer prepared from a two-component moisture curable composition comprising a reactive organic polymer containing a reactive silyl function group and an epoxy resin, wherein the single layer functions as a primer and a base coat, the single layer disposed on the substrate, and a top coat disposed on the single layer on a surface of the single layer opposite that of the substrate. The moisture curable composition can be applied directly to an adhesion-resistant substrate without the higher number of application steps and/or other chemical treatment required with conventional compositions.

Abstract: A composition including a medium and surfactant-free nanoparticles (SFNPs) at different dispersion state or aggregation form. The composition includes: (a) a primary form, wherein the dielectric constant value (DE value) of the medium is equal to or larger than the intrinsic dielectric constant value (IDE) of the SFNPs and smaller than about 1.5 times of the IDE of the SFNPs; (b) a reaction-limited aggregation form of SFNPs, wherein the DE value of the medium is much larger than the IDE of the surfactant-free nanoparticles; (c) a diffusion-limited aggregation form of SFNPs, wherein the DE value of the medium is smaller than the IDE of the surfactant-free nanoparticles; and (d) a redispersible aggregation form of surfactant-free nanoparticles, wherein the surfactant-free nanoparticles are induced to aggregate in the diffusion-limited fashion in a medium with a DE value that is smaller than the IDE of the surfactant-free nanoparticles.

Abstract: A composition including a medium and surfactant-free nanoparticles (SFNPs) at different dispersion state or aggregation form. The composition includes: (a) a composition of a medium and surfactant-free nanoparticles in primary form, wherein the dielectric constant value (DE value) of the medium is equal to or larger than the intrinsic dielectric constant value (IDE) of the SFNPs and smaller than about 1.