Abstract: An efficient process for partial electroless plating that causes plating film to deposit only a specific part of substrate which needs plating, without requiring the corrosion step. The process includes five steps of forming a coating film on which electroless plating is performed, activating said coating film, imparting a catalyst to said coating film, activating said catalyst, and performing electroless plating, and said coating film is formed from any one of the following four resin compositions:1. composed of a low-molecular weight compound having an N--H bond, an adhesive polymer having a C.dbd.C double bond, and a polybasic acid having a C.dbd.C double bond;2. composed of an adhesive polymer dense with N--H bonds, and a polybasic acid compatible with said polymer or a monobasic acid having a C.dbd.C double bond;3. composed of a resin component which gives rise to an N--H bond upon curing reaction, and a polybasic acid having a C.dbd.C double bond; or4.