Abstract: A semiconductor integrated circuit package, a printed circuit board, a semiconductor apparatus, and a power supply wiring structure that allow attainment of stable power source and ground wiring without causing resonance even in a high-frequency bandwidth are provided. In an interior portion of the package, a power source wiring and a ground wiring constitute a pair wiring structure in which the power source wiring and the ground wiring are juxtaposed at a predetermined interval so as to establish electromagnetic coupling therebetween. A plurality of pair wiring structures are combined in such a manner that, when viewed in a section perpendicular to a wiring extending direction, the pair wiring assembly assumes a staggered (checkered) configuration. It is preferable that, each of the silicon chip and the printed circuit board, like the package, has pair wiring structures disposed inside.
Type:
Grant
Filed:
September 4, 2008
Date of Patent:
March 15, 2011
Assignees:
Kyocera Corporation, Oki Electric Industry Co., Ltd., Kabushiki Kaisha Toshiba, Fuji Xerox Co., Ltd., Fujitsu Microelectronics Limited, Renesas Technology Corp., Ibiden Co., Ltd., Kanji Otsuka, Yutaka Akiyama
Abstract: An electronic circuit device having a power-supply structure capable of supporting fast signals in and above a GHz band is offered. A driver transistor is formed in a surface of a semiconductor substrate. Power-supply/ground pair transmission lines which provide the driver transistor with power and signal/ground pair transmission lines which transmit signals to a receiver are formed on the semiconductor substrate. The power-supply/ground pair transmission lines are connected to a drain layer of the driver transistor and a P+ layer in a P well. The signal/ground pair transmission lines are connected to a source layer of the driver transistor and a P+ layer in the P well.
Type:
Application
Filed:
February 20, 2004
Publication date:
October 21, 2004
Applicants:
Kanji OTSUKA, Tamotsu USAMI, Sanyo Electric Co., Ltd, Oki Electric Industry Co., Ltd, Sharp Kabushiki Kaisha, Sony Corporation, Kabushiki Kaisha Toshiba, NEC Corporation, Hitachi, Ltd., Matsushita Electric Industrial Co., Ltd., Mitsubishi Denki Kabushiki Kaisha, Fujitsu Limited, Rohm Co., Ltd.
Abstract: In a semiconductor chip are arranged power pads, ground pads and signal pads. A ground line is provided which is formed as one in the vicinity of the chip and branches off at some distance from the chip. Signal lines and power lines are each formed over one of the branched ground lines. The signal lines and the power lines are extended radially together with the underlying ground lines. Each of the signal lines and the power lines are extended together with the corresponding ground line to form a stacked pair line.
Type:
Grant
Filed:
July 10, 2001
Date of Patent:
September 23, 2003
Assignees:
Kabushiki Kaisha Toshiba, Fujitsu Limited, Hitachi Ltd., Matsushita Electric Industrial Co., Ltd., Mitsubishi Electric Corp., NEC Corporation, Oki Electric Industry Co., Ltd., Kanji Otsuka, Rohm Co., Ltd., Sanyo Electric Co., Ltd., Sharp Kabushiki Kaisha, Sony Corporation, Tamotsu Usami
Abstract: An electronic device includes a wiring board, and at least one pair of signal lines that is provided on the wiring board in parallel and has an equal length. A chip is mounted on the wiring board and includes at least one differential driver which outputs complementary digital transmit signals to said at least one of lines. A pair of power system lines is provided to supply first and second power supply voltages to the above-mentioned at least one differential driver. The power system lines are parallel to each other and have an equal length.