Abstract: A laminate including a resin layer and a metal layer, the resin layer being obtained by modifying at least part of the surface of a resin film including a thermoplastic cyclic olefin resin by ionizing irradiation, and the metal layer being formed on the modified area of the surface of the resin film by plating, a method of producing the same, and an electronic circuit board including a circuit formed by etching the metal layer of the laminate by photolithography, are disclosed. The laminate ensures that the insulating resin layer (flat surface) exhibits high adhesion to the conductor layer.

Abstract: A nonconductor product is soaked in a solution suspending a semiconducting powder and is subjected to light irradiation in the solution so that polar group is formed on the surface of the nonconductor product, and then electroless plating is performed on the surface on which the polar group is formed. A resin product is subjected to electroless plating after ultraviolet treatment in which ultraviolet rays are irradiated through water or a solution is performed. Further, electroless plating or electroplating with a different or the same kind of metal is performed on the electroless-plated layer formed by electroless plating.

Abstract: Provided is a method of plating a non-conductive product comprising the steps of: forming a coating film on a surface of the non-conductive product with a conductive paint having the following composition of solid ingredients: (a) a resin vehicle in 20 to 80 weight %, and (b) a conductive whisker in 80 to 20 weight %; and executing electroless plating on a surface of the coating film. Also provided are products produced by this method.

Abstract: The present invention relates to a nickel plating solution to which a salt of an element in Group IIa in the periodic table is added, a method of copper-nickel-chromium or nickel-chromium bright electroplating and a film obtained by such a plating method. The nickel plating film is a bright electroplating film having excellent corrosion resistance.

Abstract: This invention is directed to a method of copper-nickel-chromium bright electroplating which provides excellent corrosion resistance, characterized in that said bright electroplating film comprises copper and nickel plating levers formed on a basis material or a nickel plating layer directly formed on a basis material, a microporous layer of a thickness of 0.2-2 .mu.m codeposited on said nickel plating layer by adding calcium salt and titanium oxide to Watts bath type of nickel plating bath, chromium plating layer with a thickness of 0.01-0.25 .mu.m on said microporous layer and a chromium plating surface with micropores of 20000-500000/cm.sup.2, and is directed to the plating films obtained by the method.

Abstract: A process for regenerating electroless plating bath comprising the steps of:(i) continuously or intermittently taking out a part or the whole of chelating agent-containing copper electroless plating bath from an electroless plating tank, followed by removing off the copper ion content from said bath;(ii) acidifying the thus obtained solution for precipitating the chelating agent therefrom and recovering the precipitated chelating agent;(iii) supplying said recovered chelating agent to an anodic cell separated by an exchange membrane from a cathodic cell having cathode, said anodic cell having copper anode, wherein in case a neutral or alkaline electrolyte solution is supplied to said cathodic cell said partitioning membrane is an anion exchange membrane or cation exchange membrane, while in case an acidic electrolyte solution is supplied to said cathodic cell said partitioning membrane is a cation exchange membrane, and applying direct current between both electrode; and(iv) then, recycling the solution withi