Patents Assigned to Kasai Koyco Co., Ltd
  • Die assembly device for molding laminated assemblies
    Patent number: 5776509
    Abstract: In a method and die assembly device for molding a laminated assembly comprising a resin core member and a surface skin member covering a part of the surface of the resin core member, the shifting and creasing of the surface skin member is avoided, the molding precision is increased during the mold press forming process, and the external appearance of the assembly is improved.
    Type: Grant
    Filed: March 27, 1996
    Date of Patent: July 7, 1998
    Assignee: Kasai Koyco Co., Ltd
    Inventors: Tetsuyuki Ota, Masahiko Hara