Abstract: An apparatus for automatically aligning a semiconductor wafer with a mask in the manufacture of integrated circuit devices is disclosed. The mask and wafer are each provided with alignment patterns, the alignment pattern on the wafer cooperating with the alignment pattern on the mask in a unique visual mannner to signify alignment. A scanning mechanism is provided for automatically scanning the alignment pattern areas and producing output signals indicative of the relative positions of the alignment patterns on the wafer and mask. Logic circuitry is provided for operating in response to any misalignment represented by the scan output signals to compute formulae which are utilized to produce control signals for driving motor drive mechanisms to produce relative movement between the mask and wafer to bring them into alignment. Several separate alignment cycles are provided, if needed, for zeroing in on finalized alignment.

Abstract: An apparatus for automatically aligning a semiconductor wafer with a mask in the manufacture of integrated circuit devices is disclosed. The mask and wafer are each provided with alignment patterns, the alignment pattern on the wafer cooperating with the alignment pattern on the mask in a unique visual manner to signify alignment. A scanning mechanism is provided for automatically scanning the alignment pattern areas and producing output signals indicative of the relative positions of the alignment patterns on the wafer and mask. Logic circuitry is provided for operating in response to any misalignment represented by the scan outout signals to compute formulae which are utilized to produce control signals for driving motor drive mechanisms to produce relative movement between the mask and wafer to bring them into alignment. Several separate alignment cycles are provided, if needed, for zeroing in on finalized alignment.

Abstract: A multiple apparent source optical imaging system is provided having a paraboloidal assembly of plane mirrors uniformly distributed in a ring about an anisotropic light source. The assembly compensates for source anisotropy and for diffraction effects by providing uniform distribution of light, as if the light originated from multiple apparent sources uniformly distributed in a selected annular fashion in a common apparent source plane. The assembly also includes a variable focus projection lens which, in conjunction with a selected source beam divergence angle, serves to minimize line-width error when objects, such as a mask and a semiconductor substrate, with a finite separation are illuminated. Substantially no loss in image intensity is occasioned by the system.

Abstract: Systems for handling discs, such as semiconductor wafers and the like, using both stationary and movable air track assemblies include an elongate track member, a flat surface formed to extend along the underside of the track member, ports disposed along the flat undersurface for the discharge of air at an angle to the vertical, and provision for discharging a sufficient flow of air from the ports to create a differential in the air pressure above and below the discs so as to lift the discs toward the flat undersurface as a result of the air flow. The angle has a sufficient horizontal vectorial component to urge the discs along the flat undersurface of the track member in the direction of such component. In one embodiment, the air track member extends between a pair of holders which respectively supply and receive discs carried by the track member. The discs may be carried to a predetermined fixed point, released, and subsequently retrieved from the same position.

Abstract: A carrier having a plurality of transport channels arranged in stacked parallel relationship for receiving semiconductive wafers is provided with a pair of oppositely facing recessed regions extending partially into the transport channels. In each of these recessed regions a stop member is pivotally mounted and spring-loaded for automatic movement between an inoperative position out of the transport channels to permit passage of the semiconductive wafers therethrough, when the carrier is set down, and an operative position protruding into the transport channels and blocking passage of the semiconductive wafers therethrough to impede spillage of any semiconductive wafers contained in the carrier, when the carrier is picked up.

Abstract: An apparatus is provided for transferring semiconductor wafers from one conveying or transport mechanism to another in a manner that substantially reduces wafer damage. The apparatus comprises first and second sensors; first, second and third rollers; a motor with a drive shaft coupled to the first and second rollers for applying a rotational force thereto; and a pneumatic unit coupled to a movable platform on which the rollers are mounted and operable for applying a lifting force to or removing a lifting force from the movable platform. The rollers are mounted parallel to and coplanar with each other and are positionable above or below the belts of a two-belt conveyor mechanism, the first roller being disposed for vertical movement between the belts of the conveyor mechanism, and the second and third rollers being coupled by two belts forming a transport mechanism for transporting wafers to or from the conveyor mechanism.

Abstract: A carrier having a plurality of transport channels arranged in stacked parallel relationship for receiving semiconductive wafers is provided with a pair of oppositely facing recessed regions extending partially into the transport channels. In each of these recessed regions a separate spring-loaded stop member is pivotally mounted for automatic movement to a raised inoperative position, where itis pivoted out of the transport channels to permit passage of the semiconductive wafers therethrough, when the carrier is set down, and for automatic movement to a lowered operative position, where it is pivoted into the transport channels to block passage of the semiconductive wafers therethrough and thereby impede spillage of any semiconductive wafers contained in the carrier, when the carrier is picked up.

Abstract: An apparatus for automatically aligning a semiconductor wafer with a mask in the manufacture of integrated circuit devices is disclosed. The mask and wafer are each provided with alignment patterns, the alignment pattern on the wafer cooperating with the alignment pattern on the mask in a unique visual manner to signify alignment. A scanning mechanism is provided for automatically scanning the alignment pattern areas and producing output signals indicative of the relative positions of the alignment patterns on the wafer and mask. Logic circuitry is provided for operating in response to any misalignment represented by the scan output signals to compute formulae which are utilized to produce control signals for driving motor drive mechanisms to produce relative movement between the mask and wafer to bring them into alignment. Several separate alignment cycles are provided, if needed, for zeroing in on finalized alignment.

Abstract: A wafer-bearing chuck, an annular reference plate, a copy lens system, and a mask-bearing holder are mounted on a floating unit so that the copy lens system produces an image of a pattern-bearing surface of the mask at a plane positioned between the annular reference plate and the wafer chuck and produces an image of a selected pattern-bearing region of a photosensitive-film-bearing surface of the wafer at the pattern-bearing surface of the mask. The wafer chuck is movably mounted for positioning the photosensitive-film-bearing surface of the wafer in abutment with the annular reference plate in a plane parallel to the image plane of the pattern-bearing surface of the mask and for subsequently positioning the selected pattern-bearing surface region of the wafer in the image plane of the pattern-bearing surface of the mask.

Abstract: An apparatus for automatically aligning a semiconductor wafer with a mask in the manufacture of integrated circuit devices is disclosed. The mask and wafer are each provided with alignment patterns, the alignment pattern on the wafer cooperating with the alignment pattern on the mask in a unique visual manner to signify alignment. A scanning mechanism is provided for automatically scanning the alignment pattern areas and producing output signals indicative of the relative positions of the alignment patterns on the wafer and mask. Logic circuitry is provided for operating in response to any misalignment represented by the scan output signals to compute formulae which are utilized to produce control signals for driving motor drive mechanisms to produce relative movement between the mask and wafer to bring them into alignment. Several separate alignment cycles are provided, if needed, for zeroing in on finalized alignment.

Abstract: A wafer-bearing chuck, an annular reference plate, a copy lens system, and a mask-bearing holder are mounted on a floating unit so that the copy lens system produces an image of a pattern-bearing surface of the mask at a plane positioned between the annular reference plate and the wafer chuck and produces an image of a selected pattern-bearing region of a photosensitive-film-bearing surface of the wafer at the pattern-bearing surface of the mask. The wafer chuck is movably mounted for positioning the photosensitive-film-bearing surface of the wafer in abutment with the annular reference plate in a plane parallel to the image plane of the pattern-bearing surface of the mask and for subsequently positioning the selected pattern-bearing surface region of the wafer in the image plane of the pattern-bearing surface of the mask.