Abstract: According to the embodiment, an optical inspection method includes: emitting, acquiring, and comparing. The emitting includes emitting light beams having a first wavelength and a second wavelength toward an imaging unit in accordance with light beam directions from a subject, with light beam intensities of the first wavelength and the second wavelength being in a complementary relationship. The acquiring includes acquiring each of information of a first image related to the first wavelength and information of a second image related to the second wavelength with the imaging unit. The comparing includes comparing the information of the first image and the information of the second image to extract unevenness information of the subject.

Abstract: Disclosed is a method for the quantitative analysis of a metal element contained in a resin material, which permits quantitatively analyzing the harmful substance such as lead contained in a resin material, comprising decomposing the resin material within a container having at least the inner surface formed of a glassy carbon in the presence of an aqueous solution of an oxidizing acid, heating the organic residue of the decomposed resin material so as to convert the residue into an ash, and quantitatively measuring the metal element contained in the organic residue converted into the ash.

Abstract: According to one embodiment, an optical disc apparatus includes a calculation unit that calculates a tilt of a disc, a determining unit that determines whether or not the tilt of the disc calculated by the calculation unit is larger than a preset predetermined reference value, and a correction unit that corrects the tilt of the disc calculated by the calculation unit.

Abstract: A LSI package encompasses: an interposer having board-connecting joints, which facilitate connection with a printed wiring board, and module-connecting terminals, part of the module-connecting terminals are assigned as interposer-site monitoring terminals; a signal processing LSI mounted on the interposer; and an I/F module having a plurality of interposer-connecting terminals, which are arranged to correspond to arrangement of the module-connecting terminals, and a transmission line to establish an external interconnection of signal, which is transmitted from the signal processing LSI, part of the interposer-connecting terminals are assigned as module-site monitoring terminals. The interposer-site and module-site monitoring terminals are configured to flow a monitoring current to confirm electric contact between the signal processing LSI and the I/F module.