Abstract: Disclosed are assemblies, systems, devices and methods, including an assembly to determine an angular position of a rotatable structure external to the assembly. The assembly includes a sensor including a rotatable member, a main winding set and at least one auxiliary winding, and also a coupling element to couple the sensor to the external rotatable structure to cause rotation of the rotatable member of the sensor in response to rotation of the external rotatable structure. Resultant voltages at the main winding set and at the at least one auxiliary winding are produced based, at least in part, on an angular position of the rotatable member of the sensor. The angular position of the external rotatable structure is determined based on the resultant voltages at the main winding set and at the at least one auxiliary winding.

Abstract: A surface relief structure includes a recording medium configured to be structurally modified when exposed to interfering and non-interfering portions of radiation beams, the structurally modified recording medium including, when viewed in a two-dimensional cross-section along one of the axes of the recording medium a plurality of equally spaced steps of fine-sized periodicity superimposed upon a plurality of deep depressions of substantially coarse-sized periodicity. The structurally modified recording medium is configured to produce in reflection single and multiple colors in a broad spectral range when illuminated by a source of light.

Abstract: Disclosed are devices, systems, assemblies, couplers, and other implementations, including a coupler that includes a first coupling element matingly engaged to a second coupling element, each of the first and second coupling elements including a plate defining an opening, a projection extending from a first surface of the plate, and a socket extending from a second surface of the plate and configured to receive a rotatable member. The projection of the first coupling element is received in the opening of the plate of the second coupling element, and the projection of the second coupling element is received in the opening of the plate of the first coupling element. The matingly engaged coupling elements are configured to rotate in response to rotation of a first rotatable member of a first device received in the socket of the first coupling element.

Abstract: A differential capacitive pressure sensor of an embodiment of the present invention has first and second diaphragms positioned on opposing sides of a single substrate. Each diaphragm of the pressure transducer is configured to be exposed to a transient fluid, with the first and second pressure transducers being arranged with their respective deflection surfaces directed outwardly from each other. The differential capacitive pressure sensor may be configured to output representations of differential and common mode pressure of the transient fluids, where a representation of a common mode is cancelled in generating the representation of the differential pressure. The transient fluids may be the same fluid at different locations within a flow path. The diaphragms may be constructed from a ceramic material to be able to withstand exposure to corrosive or caustic fluids.

Abstract: A capacitive pressure transducer of an embodiment of the present invention capacitively couples two electrodes on a substrate with a diaphragm electrode to form a transducing circuit without the need for a physical connection between the electrodes. Embodiments of the present invention have a substrate with a coupling electrode and a sensing electrode and an attached diaphragm with a diaphragm electrode. A spacer positioned between the substrate and the diaphragm provides for a cavity that defines a gap between the sensing electrode and the diaphragm electrode. A dielectric spacer may be positioned over the coupling electrode to increase the capacitance between the coupling electrode and the diaphragm electrode. The capacitive pressure transducer has similar electrical characteristics as existing capacitive pressure transducers, is easier to manufacture, and has long-term reliability and durability improvements brought about by the elimination of mechanical interconnects and additional conductive materials.

Abstract: Disclosed are assemblies, systems, devices, methods, and other implementations, including an assembly that includes a moveable mechanical structure (e.g., a lever), and a gate to control movement of the moveable mechanical structure. The gate include a rotatable body, and at least two appendages extending from the rotatable body, including a first appendage configured to stop rotational movement of the gate in a first direction beyond a first angular position when the first appendage contacts a blocking structure, and a second appendage configured to contact the moveable mechanical structure that, when the moveable mechanical structure contacts the second appendage, actuates the gate to cause rotation of the gate.

Abstract: Disclosed are devices, systems, assemblies, couplers, and other implementations, including a coupler that includes a first coupling element matingly engaged to a second coupling element, each of the first and second coupling elements including a plate defining an opening, a projection extending from a first surface of the plate, and a socket extending from a second surface of the plate and configured to receive a rotatable member. The projection of the first coupling element is received in the opening of the plate of the second coupling element, and the projection of the second coupling element is received in the opening of the plate of the first coupling element. The matingly engaged coupling elements are configured to rotate in response to rotation of a first rotatable member of a first device received in the socket of the first coupling element.

Abstract: Described herein is a housing comprising an inside and at least one sidewall, wherein the at least one sidewall comprises inner and outer surfaces. An etch stop deposit is disposed over at least a portion of the housing, and a diaphragm material deposit is disposed over at least a portion of the etch stop deposit.

Abstract: Described herein is a sensor assembly that can be calibrated after manufacture and a method for calibrating that assembly. The assembly comprises a sense element, microprocessor and a protection circuit. The assembly can use pins on the existing connector to input calibration data. The present invention also is a method of calibrating sensor outputs using an assembly that contains a protection circuit to prevent the sensor assembly from electrostatic discharge and high and reverse voltage.

Abstract: Described herein is a method for integrating MEMS with submicron semiconductor electrical circuits such as CMOS to provide more complex signal processing, on-chip calibration and integration with RF technologies. A MEMS sensor is provided having an upper layer, an insulating layer into which a cavity has been formed and a handle layer. The upper layer acts as both the substrate of the semiconductor electrical circuit and as the active MEMS element. The remainder of the circuitry is fabricated either in or on the upper layer. In a preferred method of the present invention a first wafer assembly and a second wafer assembly are fabricated such that a MEMS sensor and the substrate of at least one semiconductive electrical circuit is formed.

Abstract: Described herein is a method for integrating MEMS with submicron semiconductor electrical circuits such as CMOS to provide more complex signal processing, on-chip calibration and integration with RF technologies. A MEMS sensor is provided having an upper layer, an insulating layer into which a cavity has been formed and a handle layer. The upper layer acts as both the substrate of the semiconductor electrical circuit and as the active MEMS element. The remainder of the circuitry is fabricated either in or on the upper layer. In a preferred method of the present invention a first wafer assembly and a second wafer assembly are fabricated such that a MEMS sensor and the substrate of at least one semiconductive electrical circuit is formed.

Abstract: Described herein is a sensor assembly that can be calibrated after manufacture and a method for calibrating that assembly. The assembly comprises a sense element, microprocessor and a protection circuit. The assembly can use pins on the existing connector to input calibration data. The present invention also is a method of calibrating sensor outputs using an assembly that contains a protection circuit to prevent the sensor assembly from electrostatic discharge and high and reverse voltage.

Abstract: A method is disclosed for providing calibration of sensor signals in a sensor having a measuring sensor and a reference sensor. The method includes receiving a sensor signal and a reference signal from the measuring sensor and the reference sensor, respectively. The method further includes providing a first compensation signal to the sensor signal based on a gain characteristic and providing a second compensation signal to the reference signal based on the gain characteristic and an offset characteristic; combining the first compensation signal and the sensor signal, and the second compensation signal and the reference signal to create a compensated sensor signal; and, adjusting the compensated signal for temperature effects by coupling a component having a high thermal coefficient to the sensor. An apparatus is also described herein.

Abstract: Described herein is a housing comprising an inside and at least one sidewall, wherein the at least one sidewall comprises inner and outer surfaces. An etch stop deposit is disposed over at least a portion of the housing, and a diaphragm material deposit is disposed over at least a portion of the etch stop deposit.

Abstract: A method for monitoring pressure is described herein. The method includes the steps of performing an accurate measurement of pressure and performing an approximate measurement of pressure. Then, providing a notification signal if a difference between the approximate measurement and the accurate measurement is greater than a predetermined value. An apparatus for performing the method is also disclosed.

Abstract: A weight measurement system is disclosed for measuring the weight of an occupant in a vehicle seat. In a preferred embodiment, a sensor is positioned at the rear portion of the vehicle seat and a load transfer link is used to transfer the weight from the front portion of the vehicle seat to the rear portion, to be measured by the sensor. The transfer link is a selectively compliant beam having a first rigid section and a second rigid section connected to each other via a flexible area. The first and second rigid sections preferably include wing portions for increasing the rigidity of the sections. The flexible area is more compliant than the rigid sections. The load transfer link is configured to transition a load placed on the front portion of the link to the rear portion. In a more preferred embodiment of the invention, the load transfer link is made of a high strength, low alloy steel.

Abstract: A method for the singulation of hybrid circuits from a pre-scribed plate containing hybrid circuits or made of other brittle materials. The method includes the steps of providing a platen used to support the hybrid plate and which has a surface comprised of a series of sections each angled downward from its adjacent section, aligning the plate on the platen so that the scribe lines align with the surface discontinuities at the angles between the sections, securing the plate to the platen with vacuum pressure, creating a pressure differential between a space above the plate and a space below the plate, and applying the pressure differential to sequentially break the plate along the pre-scribed lines by forcing the plate against the angles.

Abstract: A method is disclosed for providing calibration of sensor signals in a sensor having a measuring sensor and a reference sensor. The method includes receiving a sensor signal and a reference signal from the measuring sensor and the reference sensor, respectively. The method further includes providing a first compensation signal to the sensor signal based on a gain characteristic and providing a second compensation signal to the reference signal based on the gain characteristic and an offset characteristic; combining the first compensation signal and the sensor signal, and the second compensation signal and the reference signal to create a compensated sensor signal; and, adjusting the compensated signal for temperature effects by coupling a component having a high thermal coefficient to the sensor. An apparatus is also described herein.

Abstract: The composition of a fluid is measured with a sensor with a tube having: (i) a cavity for holding contents therein; and (ii) at least one opening in the tube being in communication with the cavity of the tube and the content held therein. The sensor further includes a sensor body attached to the tube having: (i) a circuit board; and (ii) a header, the header comprising a plurality of contacts that are electrically coupled to the circuit board; wherein the plurality of contacts of the header are in communication with the cavity of the tube. A method for measuring the composition of the fluid using the sensor is also described.

Abstract: A preformed sensor housing including a conduit having an inside; a plug disposed within the conduit; and a deposit covering a portion of the plug and a portion of the conduit. A method is also disclosed for creating a thin film diaphragm on a housing including the step of inserting a sacrificial element into the housing; depositing a diaphragm material onto the sacrificial element and the housing; and removing the sacrificial element.