Abstract: Disclosed is a biaxially oriented film laminated board having a thickness of 0.5 mm or more, wherein biaxially oriented films composed of a resin composition having a melting point of 240° C. or higher are laminated at a multi-layer condition without interposing an adhesive therebetween. This biaxially oriented film laminated board is characterized in that the minimum value among the elongation at break in the longitudinal direction and that in the transverse direction is 25% or more when the board is punched into a rectangular form. Also disclosed are various electrical insulation boards and machine parts each using the laminated board. A laminated board having properties of a biaxially oriented film including thermal resistance, electrical in sulation, mechanical strength, flexibility and workability can be obtained.