Abstract: Provided is an a aramid-resin film laminate comprising an aramid paper comprising an aramid fibrid and an aramid short fiber, and a resin film laminated on each other. The aramid-resin film laminate is obtained by conducting a plasma treatment on a surface of the aramid paper, the surface having a skin layer portion whose heat of fusion measured with a differential scanning calorimeter (DSC) is 25 cal/g or less, and bonding the aramid paper and the resin film to each other by heating, pressing, or heating under pressure, with the plasma treated surface of the aramid paper and a plasma treated surface of the resin film facing each other. This laminate is an aramid-resin film laminate in which the aramid paper and the resin film are laminated on each other without using any adhesive agent and without impairing characteristics of both the aramid paper and the resin film, and is excellent in heat resistance, electrical characteristics, chemical resistance, mechanical characteristics, and the like.

Abstract: A low-temperature plasma treatment is applied to a surface of an aramid paper so as to allow the surface to have a compositional atomic ratio X (O/C) of the number of oxygen atoms (O) to the number of carbon atoms (C) ranging from 110% to 220% of a theoretical atomic ratio. The treatment is performed at an intensity ranging from 120 to 1500 W·min/m2 with a low-temperature plasma treatment apparatus of internal electrode system. The aramid paper is superposed with a nonhydrolyzable resin film and the resulting article is pressurized to give an aramid-resin film laminate. The laminate is inexpensive, has both superior electrical properties and high mechanical strength, excels in elasticity, and is useful as an insulation material.

Abstract: An insulation sheet for electric machine that forms slot insulation sheet is configured by an aramid paper and a PPS film directly pressure laminated without use of an adhesive. This means that no adhesive layer interposes the aramid paper and PPS film. PPS film is less costly as compared to a polyimide film and possesses better thermal properties such as higher heat emissivity and is highly resistant to heat. Thus, high strength is maintained even when subjected to high temperature over extensive time. Further, because the aramid paper and PPS film are laminated directly without an adhesive layer, the laminate is reduced in thickness. This allows further thinning of the laminate.

Abstract: Disclosed is a biaxially oriented film laminated board having a thickness of 0.5 mm or more, wherein biaxially oriented films composed of a resin composition having a melting point of 240° C. or higher are laminated at a multi-layer condition without interposing an adhesive therebetween. This biaxially oriented film laminated board is characterized in that the minimum value among the elongation at break in the longitudinal direction and that in the transverse direction is 25% or more when the board is punched into a rectangular form. Also disclosed are various electrical insulation boards and machine parts each using the laminated board. A laminated board having properties of a biaxially oriented film including thermal resistance, electrical insulation, mechanical strength, flexibility and workability can be obtained.

Abstract: A laminate comprising aramid paper containing aramid fiber and aramid pulp and polyester film, the aramid paper and polyester film having been subjected to plasma surface treatment before laminating, wherein the aramid paper and polyester film are continuously bonded to each other. The disclosure is concerned with a process for manufacturing the laminate and an apparatus for manufacturing the laminate.

Abstract: An aramid paper made from aramid fibrid and short fiber and formed into a paper shape has two sides and a surface and includes a thermal bonding face located in at least one of the sides of the aramid paper, the thermal bonding face having such a property as to be directly thermally bondable with another sheet of aramid paper of the same material or a polyester film at a thermal bonding temperature ranging from 90° C. to 200° C. when a plasma treatment is applied to the surface of the aramid paper. The plasma treatment has an intensity ranging from 30 W·min/m2 to 1500 W·min/m2, and the thermal bonding face has a composition ratio (O/C) of the number of oxygen atoms (O) to the number of carbon atoms (C) ranging between 150% and 230% of a theoretical value of an atom number ratio.

Abstract: An electrostatic chucking device having a laminated structure formed by sequentially laminating a first insulation layer, an electrode layer, and a second insulation layer on a metal substrate. The first and second insulation layers are formed from polyimide films. At least one adhesion layer is provided between the metal substrate and the first insulation layer, and is a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 ?m.

Abstract: An aramid paper is made from aramid fibrids and short fibers both as main constituents and formed into a paper shape. The aramid paper has two sides and a surface and includes a thermal bonding face formed on at least one of the sides of the aramid paper, the thermal bonding face having such a property as to be directly thermally bondable with a material of another sheet of aramid paper of the same material or a polyester film at a thermal bonding temperature ranging from 90° C. to 200° C. when the surface of the aramid paper is treated by a low-temperature plasma treatment.

Abstract: An electrostatic chucking device having a laminated structure formed by sequentially laminating a first insulation layer, an electrode layer, and a second insulation layer on a metal substrate. The first and second insulation layers are formed from polyimide films. At least one adhesion layer is provided between the metal substrate and the first insulation layer, and, preferably, between the first insulation layer and the electrode layer, and between the electrode layer and the second insulation layer. The adhesion layer is a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 &mgr;m. The electrostatic chucking device may be manufactured by a low-temperature compression bonding process under pressure at a temperature of 100 to 250° C. between the metal substrate and the first insulation layer, between the first insulation layer and the electrode layer, and between the electrode layer and the second insulation layer using thermoplastic polyimide-based adhesion films.

Abstract: An electrostatic chucking device having a laminated structure formed by sequentially laminating a first insulation layer, an electrode layer, and a second insulation layer on a metal substrate. The first and second insulation layers are formed from polyimide films. At least one adhesion layer is provided between the metal substrate and the first insulation layer, and is a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 &mgr;m.

Abstract: A new method and apparatus for moving an excimer laser beam relative to a workpiece to control the wall profile of laser machined features, such as holes and grooves. An excimer laser beam is displaced relative to a workpiece in a substantially circular motion and the substantially circular motion is further displaced relative to the workpiece to correspond to a desired shape.