Abstract: A continuous dry coating method and an apparatus therefor which are capable of removing cut chips and burrs from and smoothing inner walls of small-diameter holes in a substrate material and, then, successively performing a cold coating on these small holes in a short period of time. The continuous dry process coating method comprises the steps of: arranging electrodes on opposite sides of a substrate material; performing a plasma discharge to surface-treat small holes made in the substrate material; and then performing an electron cyclotron resonance plasma (ECR plasma) coating on the surfaces of these holes.

Abstract: A plasma process utilizing an electron cyclotron resonance (ECR) phenomenon caused by generating a magnetic field either parallel or perpendicular to, or both parallel and perpendicular to, a microwave propagation direction, characterized in that an ion beam is made to converge by applying a pulse voltage to a rotating magnetic field, a pulse voltage is applied to deflection plates, and an accelerating pulse voltage is further applied to a plasma.

Abstract: A method for boring small holes in a substrate by disposing electrodes on both sides of a substrate to be machined and applying a voltage between the electrodes so as to perform plasma discharge treatment at a pressure of 10 to 2.times.10.sup.3 Torrs. In another method, the gap of the two electrodes is set to 0.01 to 50 mm and a peak voltage to 10 V to 50,000 V in accordance with the electrode gap within the range of .tau..sub.ON the voltage waveform of 5 .mu.s to 20 seconds. The methods make it possible to quickly and reliably accomplish removal of chips causing clogging, smoothing of the inner walls of the holes and removal of fins in the holes.