Abstract: A layered microencapsulation structure and a method of preparation of the layered structure are provided herein. The layered microcapsules comprises different coating layers having a specific arrangement order where each layer is composed of at least one phase change material which is able to absorb heat from surroundings and still to keep constant temperature or an insignificant increase in temperature via a fusion process occurring at a specific temperature (e.g. melting point) and a core substrate that has a heat-sensitive component which is entrapped therein. The layered microencapsulation structure is designed in such a way that the layers are arranged with increasing order of the melting point from inside to outside. The method of microencapsulation comprises the step of dry cold granulation of a sensitive active material using a melt material resulting in a core substrate and layering using heat absorbing materials having increasing melting points.