Patents Assigned to Keltech Engineering
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Patent number: 6149506Abstract: Lapping or polishing at high speeds with fine abrasive particles offer significant advantages in the speed of lapping, savings of time in lapping, and smoothness in the finished articles. An improved lapping system comprises a lapper platen system comprising: a) a frame (e.g., having a total weight of at least 200 kg) supporting a work piece holder b) a rotatable platen having an abrasive surface comprising an abrasive sheet secured to said platen, said platen being capable of providing surface feet per minute speeds on in outer edge of at least about 1,500 surface feet per minute; and c) a work piece holder which is movable on said frame.Type: GrantFiled: October 7, 1998Date of Patent: November 21, 2000Assignee: Keltech EngineeringInventor: Wayne O. Duescher
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Patent number: 6120352Abstract: Lapping or polishing at high speeds with fine abrasive particles offer significant advantages in the speed of lapping, savings of time in lapping, and smoothness in the finished articles.Type: GrantFiled: March 6, 1997Date of Patent: September 19, 2000Assignee: Keltech EngineeringInventor: Wayne O. Duescher
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Patent number: 6102777Abstract: A process for lapping a surface and providing a very smooth surface in short periods of time comprises:a) providing a work piece to be lapped, having at least one surface to be lapped,b) providing a rotating platen havingi) a back surface andii) a flat surface which can be adjusted to a position parallel to said at least one surface of said work piece,c) providing a sheet of abrasive material having an abrasive face and a back side, said back side being on said flat surface of said platen with the abrasive face of said sheet facing said at least one surface to be lapped,d) securing said sheet of abrasive material to said flat surface of said platen,e) rotating said platen at a rotational speed of at least 500 revolutions per minute, and a surface speed at an outside edge of said sheet of abrasive material of at least 1500 surface feet per minute, andf) contacting said abrasive face and said at least one surface of said workpiece to be lapped.Type: GrantFiled: March 6, 1998Date of Patent: August 15, 2000Assignee: Keltech EngineeringInventors: Wayne O. Duescher, Mark J. Luedtke, Gary A. Staus
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Patent number: 6048254Abstract: Lapping or polishing at high speeds with fine abrasive particles offer significant advantages in the speed of lapping, savings of time in lapping, and smoothness in the finished articles.Type: GrantFiled: March 6, 1997Date of Patent: April 11, 2000Assignee: Keltech EngineeringInventor: Wayne O. Duescher
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Patent number: 5993298Abstract: Lapping or polishing at high speeds with fine abrasive particles offer significant advantages in the speed of lapping, savings of time in lapping, and smoothness in the finished articles. An improved lapping system comprises a lapper platen system comprising:a) a frame having a total weight of at least 200 kg supporting a work piece holderb) a rotatable platen having an abrasive surface comprising an abrasive sheet secured to said platen;c) a work piece holder which is movable on said frame;d) a means for introducing a first amount of liquid onto said abrasive surface of said platen at a location before contact between a work piece held on said work piece holder and said abrasive surface on said platen;e) a means for introducing a second amount of liquid onto said abrasive surface of said platen after contact between said work piece and said abrasive surface; andf) means for directing air against said abrasive surface after introduction of said second amount of liquid.Type: GrantFiled: March 6, 1997Date of Patent: November 30, 1999Assignee: Keltech EngineeringInventor: Wayne O. Duescher
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Patent number: 5967882Abstract: An improved process for lapping a surface according to the present invention comprises:a) providing a work piece with two surfaces to be lapped,b) providing two rotatable platens, each having i) a back surface and ii) a front surface,c) providing a sheet of abrasive material having an abrasive face and a back side, the back side being on the front surface of each of the two rotatable platens with the abrasive faces of each sheet facing the other sheet,d) placing the work piece with two surfaces to be lapped between the two rotatable platens, so that each abrasive face faces only one of the two surfaces to be lapped,e) rotating the two platens at a rotational speed of at least 500 revolutions per minute,f) contacting each of the abrasive faces with the only one of the two surfaces to be lapped, andg) lapping said two surfaces of said work piece simultaneously.Type: GrantFiled: March 6, 1997Date of Patent: October 19, 1999Assignee: Keltech EngineeringInventor: Wayne O. Duescher
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Patent number: 5910041Abstract: Lapping or polishing at high speeds with fine abrasive particles offers significant advantages in the speed of lapping, savings of time in lapping, and smoothness in the finished articles. An improved lapping system comprises a lapper platen system comprising a rotatable platen having I) a back surface and ii) a front surface, wherein the front surface of the rotating platen facing a work piece has a flat plateau or raised area which is continuous around a perimeter of the front side of said platen and the plateau is elevated with respect to a central area on the front surface. The front surface optionally has vents for air, the platen optionally has a back side to which a shaft is connected (directly or through intermediate connections) to rotate the platen and there is a front side on the platen to which is secured an abrasive sheet by reduced air pressure conveyed through said vents.Type: GrantFiled: March 6, 1997Date of Patent: June 8, 1999Assignee: Keltech EngineeringInventor: Wayne O. Duescher