Patents Assigned to Kemet Electronics Corporation
  • Capacitor with volumetrically efficient hermetic packaging
    Patent number: 10861652
    Abstract: An improved method of forming a capacitor, and capacitor formed thereby, is described. The method comprises forming an anode with an anode lead extending therefrom, forming a dielectric on the anode, forming a solid cathode layer on the dielectric and forming a hermetic encasement on the capacitor wherein the hermetic encasement comprises a conformal non-conductive layer.
    Type: Grant
    Filed: April 4, 2016
    Date of Patent: December 8, 2020
    Assignee: KEMET Electronics Corporation
    Inventors: Antony Chacko, Randolph S. Hahn, David Jacobs, Brandon Summey
  • Multilayered ceramic capacitor structures for use at high power
    Patent number: 10840023
    Abstract: An improved multilayered ceramic capacitor is provided wherein the capacitor has improved heat dissipation properties. The capacitor comprises first internal electrodes and second internal electrodes wherein the first internal electrodes are parallel with, and of opposite polarity, to the second internal electrodes. Dielectric layers are between the first internal electrodes and second internal electrodes and a thermal dissipation channel is in at least one dielectric layer. A thermal transfer medium is in the thermal dissipation channel.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: November 17, 2020
    Assignee: KEMET Electronics Corporation
    Inventors: John Bultitude, Philip M. Lessner, Abhijit Gurav
  • Method of forming a leadless stack comprising multiple components
    Patent number: 10790094
    Abstract: A method of forming a leadless stack comprising multiple components is provided. The method comprises forming an MLCC comprising a first capacitor external termination and a second capacitor external termination and forming an electronic element is formed comprising a first element external termination and a second element external termination. The MLCC and electronic component are are arranged in a stack with a TLPS bond between the first capacitor external termination and the first element external termination.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: September 29, 2020
    Assignee: KEMET Electronics Corporation
    Inventors: John E. McConnell, Garry L. Renner, John Bultitude, R. Allen Hill, Galen W. Miller
  • Method to reduce anode lead wire embrittlement in capacitors
    Patent number: 10777362
    Abstract: An improved capacitor, and method of manufacturing the improved capacitor, is provided. The method includes deoxygenating and leaching the anode wire to produce a capacitor comprising an anode having a surface area of at least 4.0 m2/g or a charge density of at least 200,000 CV/g with the anode wire having an equivalent diameter of less than 0.30 mm extending from said anode. A dielectric is on the anode and a cathode is on the dielectric.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: September 15, 2020
    Assignee: KEMET Electronics Corporation
    Inventors: Steven C. Hussey, Yuri Freeman, Christian Guerrero, Chris Stolarski, Jeffrey N. Kelly, Philip M. Lessner, Siva Jyoth Lingala, Javaid Qazi
  • Hybrid capacitor and method of manufacturing a capacitor
    Patent number: 10777361
    Abstract: An improved capacitor is described herein. The capacitor comprises a working element wherein the working element comprises an anode comprising a dielectric thereon and an anode conductive polymer layer on the dielectric. The capacitor also includes a cathode comprising a cathode conductive polymer layer and a conductive separator between the anode and said cathode. An anode lead is in electrical contact with the anode and a cathode lead is in electrical contact with the cathode.
    Type: Grant
    Filed: March 1, 2018
    Date of Patent: September 15, 2020
    Assignee: KEMET Electronics Corporation
    Inventors: Darius Toader, Victor Andoralov, Ralf Deisenhofer
  • Hybrid capacitor and method of manufacturing a capacitor
    Patent number: 10770240
    Abstract: An improved capacitor is described wherein the capacitor comprises a working element. The working element comprises a first dielectric and an anode conductive polymer layer on the first dielectric. The working element also comprises a cathode and a separator between the anode conductive polymer layer and the cathode wherein the separator comprises a separator conductive polymer layer wherein at least one of the anode conductive polymer layer or the separator conductive polymer layer is crosslinked. The working element also comprises a liquid electrolyte.
    Type: Grant
    Filed: July 18, 2018
    Date of Patent: September 8, 2020
    Assignee: KEMET Electronics Corporation
    Inventors: Victor Andoralov, Débora Sá, Alexandre Guerreiro Fonseca, Antony P. Chacko, Yaru Shi, Philip M. Lessner
  • Cathode materials containing core shell nanoparticles
    Patent number: 10755864
    Abstract: Provided herein is a capacitor, and method for forming a capacitor, comprising an anode, a dielectric over the anode; a cathode over the dielectric; and the cathode comprises core shell particles.
    Type: Grant
    Filed: July 1, 2019
    Date of Patent: August 25, 2020
    Assignee: KEMET Electronics Corporation
    Inventors: Antony P Chacko, John Joseph Ols
  • High density multi-component packages
    Patent number: 10757810
    Abstract: Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: August 25, 2020
    Assignee: KEMET Electronics Corporation
    Inventors: John Bultitude, Galen Miller, John E. McConnell
  • Higher density multi-component and serial packages
    Patent number: 10757811
    Abstract: A high density multi-component package is provided. The package has at least two electronic components wherein each electronic component comprises a first external termination and a second external termination. At least one first adhesive is between adjacent first external terminations of adjacent electronic components. At least one second adhesive is between the adjacent electronic component and at least two adjacent electronic components are connected serially. The first adhesive and second adhesive are independently selected from a high temperature conductive adhesive and a high temperature insulating adhesive.
    Type: Grant
    Filed: December 6, 2018
    Date of Patent: August 25, 2020
    Assignee: KEMET Electronics Corporation
    Inventors: James A. Burk, John Bultitude, Galen W. Miller
  • Component stability structure
    Patent number: 10729051
    Abstract: An electronic component assembly is described which comprises a stack of electronic components wherein each electronic component comprises a face and external terminations. A component stability structure is attached to at least one face. A circuit board is provided wherein the circuit board comprises circuit traces arranged for electrical engagement with the external terminations. The component stability structure mechanically engages with the circuit board and inhibits the electronic device from moving relative to the circuit board.
    Type: Grant
    Filed: June 20, 2016
    Date of Patent: July 28, 2020
    Assignee: KEMET Electronics Corporation
    Inventors: John E. McConnell, John Bultitude
  • Method for making a multilayered ceramic capacitor
    Patent number: 10714259
    Abstract: A method for forming an MLCC with an identification mark consisting of non-active internal electrodes which can be used to determine chip orientation for mounting or reeling. The method includes printing layers, forming a stack of the layers, sintering the stack, dicing the stack and forming external terminations.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: July 14, 2020
    Assignee: KEMET Electronic Corporation
    Inventors: Randal J. Vaughan, Gregory L. Crosby
  • High density multi-component packages
    Patent number: 10707145
    Abstract: Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially.
    Type: Grant
    Filed: November 6, 2017
    Date of Patent: July 7, 2020
    Assignee: KEMET Electronics Corporation
    Inventors: John Bultitude, Galen Miller, John E. McConnell
  • High density multi-component packages
    Patent number: 10681814
    Abstract: Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially.
    Type: Grant
    Filed: September 8, 2017
    Date of Patent: June 9, 2020
    Assignee: KEMET Electronics Corporation
    Inventors: John Bultitude, Galen W. Miller, John McConnell
  • Process for forming a solid electrolytic capacitor
    Patent number: 10658121
    Abstract: A capacitor and process for forming the capacitor, is provided wherein the capacitor comprises a conductive polymer layer. The conductive polymer comprises first particles comprising conductive polymer and polyanion and second particles comprising the conductive polymer and said polyanion wherein the first particles have an average particle diameter of at least 1 micron to no more than 10 microns and the second particles have an average particle diameter of at least 1 nm to no more than 600 nm.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: May 19, 2020
    Assignee: KEMET Electronics Corporation
    Inventors: Ajaykumar Bunha, Antony P. Chacko, Qingping Chen, Yaru Shi, Philip M. Lessner
  • Conductive polymer dispersion for improved reliability
    Patent number: 10650980
    Abstract: A capacitor and process for forming the capacitor, is provided wherein the capacitor comprises a conductive polymer layer. The conductive polymer comprises first particles comprising conductive polymer and polyanion and second particles comprising the conductive polymer and said polyanion wherein the first particles have an average particle diameter of at least 1 micron to no more than 10 microns and the second particles have an average particle diameter of at least 1 nm to no more than 600 nm.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: May 12, 2020
    Assignee: KEMET Electronics Corporation
    Inventors: Ajaykumar Bunha, Antony P. Chacko, Qingping Chen, Yaru Shi, Philip M. Lessner
  • Conductive polymer dispersion with enhanced coverage
    Patent number: 10643796
    Abstract: An improved process for forming an electrolytic capacitor is provided. The process comprises: providing an anode with an anode wire extending from the anode body; forming a dielectric on the anode to form an anodized anode; applying a first slurry wherein the first slurry comprises conducting polymer and polyanion, wherein the polyanion and conducting polymer are in a first weight ratio thereby forming a first slurry layer; and applying a second slurry on the first slurry layer wherein the second slurry comprises the conducting polymer and said polyanion and wherein the polyanion and the conducting polymer are in a second weight ratio wherein the second weight ratio is lower than the first weight ratio.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: May 5, 2020
    Assignee: KEMET Electronics Corporation
    Inventors: Antony P. Chacko, Philip M. Lessner, John Joseph Ols, Yaru Shi, Qingping Chen
  • Multilayer ceramic structure
    Patent number: 10622157
    Abstract: An improved multilayer ceramic capacitor is described. The multilayered ceramic capacitor comprises first internal electrodes and second internal electrodes. The first internal electrodes and said second internal electrodes are parallel with dielectric there between. A first external termination is in electrical connection with the first internal electrodes and a second external termination is in electrical contact with the second internal electrodes. A closed void layer, comprising at least one closed void, is between electrodes.
    Type: Grant
    Filed: July 30, 2019
    Date of Patent: April 14, 2020
    Assignee: KEMET Electronics Corporation
    Inventor: John Bultitude
  • Multilayer ceramic structure
    Patent number: 10593483
    Abstract: An improved multilayer ceramic capacitor is described. The multilayered ceramic capacitor comprises first internal electrodes and second internal electrodes. The first internal electrodes and said second internal electrodes are parallel with dielectric there between. A first external termination is in electrical connection with the first internal electrodes and a second external termination is in electrical contact with the second internal electrodes. A closed void layer, comprising at least one closed void, is between electrodes.
    Type: Grant
    Filed: January 28, 2019
    Date of Patent: March 17, 2020
    Assignee: KEMET Electronics Corporation
    Inventor: John Bultitude
  • Preparation of conjugated dimer and products formed therefrom
    Patent number: 10570520
    Abstract: An improved process for forming a conjugated thiophene precursor is described as in the formation of an improved polymer prepared from the conjugated thiophene and an improved capacitor formed from the improved polymer. The improved process includes forming a thiophene mixture comprising thiophene monomer, unconjugated thiophene oligomer, optionally a solvent and heating the thiophene mixture at a temperature of at least 100° C. to no more than the lower of 250° C. or the boiling point of a component of said thiophene mixture with the lowest boiling point temperature.
    Type: Grant
    Filed: February 15, 2018
    Date of Patent: February 25, 2020
    Assignee: KEMET Electronics Corporation
    Inventors: Yang Jin, Qingping Chen
  • Capacitor with charge time reducing additives and work function modifiers
    Patent number: 10522296
    Abstract: A capacitor, and method for making the capacitor, is provided with improved charging characteristics. The capacitor has an anode, a cathode comprising a conductive polymer layer and a work function modifier layer adjacent the conductive polymer layer and a dielectric layer between the anode and the cathode.
    Type: Grant
    Filed: January 2, 2019
    Date of Patent: December 31, 2019
    Assignee: KEMET Electronics Corporation
    Inventors: Antony P. Chacko, Yaru Shi, Robert Ramsbottom, John T. Kinard, John Joseph Ols