Patents Assigned to KEN AUTOMATION, INC.
  • Patent number: 10242436
    Abstract: A non-destructive inspection apparatus is configured to perform non-destructive inspection of a bonded place between a base material and a bonding material of a gas turbine engine part formed by bonding the bonding material formed of a metal material to the base material formed of a fiber-strengthened material, and includes a moving apparatus configured to move the gas turbine engine part, a light source apparatus configured to emit a laser beam, an infrared imaging apparatus configured to image the gas turbine engine part to which the laser beam is radiated, and a control and arithmetic processing apparatus configured to store form data of the gas turbine engine part, control the moving apparatus such that the laser beam is radiated to the bonded place based on the form data, and obtain a result showing a state of the bonded place based on imaging data obtained by the infrared imaging apparatus.
    Type: Grant
    Filed: November 1, 2016
    Date of Patent: March 26, 2019
    Assignees: IHI Corporation, KEN AUTOMATION, INC.
    Inventors: Koichi Inagaki, Kunihiko Takao
  • Publication number: 20170046831
    Abstract: A non-destructive inspection apparatus is configured to perform non-destructive inspection of a bonded place between a base material and a bonding material of a gas turbine engine part formed by bonding the bonding material formed of a metal material to the base material formed of a fiber-strengthened material, and includes a moving apparatus configured to move the gas turbine engine part, a light source apparatus configured to emit a laser beam, an infrared imaging apparatus configured to image the gas turbine engine part to which the laser beam is radiated, and a control and arithmetic processing apparatus configured to store form data of the gas turbine engine part, control the moving apparatus such that the laser beam is radiated to the bonded place based on the form data, and obtain a result showing a state of the bonded place based on imaging data obtained by the infrared imaging apparatus.
    Type: Application
    Filed: November 1, 2016
    Publication date: February 16, 2017
    Applicants: IHI Corporation, KEN AUTOMATION, INC.
    Inventors: Koichi INAGAKI, Kunihiko TAKAO