Patents Assigned to Keng-Hung Lin
  • Pre-molded Cavity 3D Packaging Module with Layout
    Publication number: 20130329374
    Abstract: A pre-molded cavity 3D packaging module with layout is disclosed. The 3D packaging module includes a pre-molded cavity. A wall and a vertical plane of the pre-molded cavity form an inclined angle of more than 3°. An intersecting region between a bottom and a sidewall of the 3D packaging module has a curved profile to facilitate smooth circuit layout.
    Type: Application
    Filed: July 6, 2012
    Publication date: December 12, 2013
    Applicants: Keng-Hung Lin, CMSC, Inc.
    Inventors: Keng-Hung Lin, Ming-Lun Chang, Yu-Min Lin