Abstract: Ceiling-mounted radiating elements for heating or cooling rooms, comprising means for connecting the ceiling-mounted radiating elements together, wherein the ceiling-mounted radiating elements comprise at least one through-flow pipe for a heating or cooling medium, and radiating surfaces are arranged radially around said pipe, wherein to connect two ceiling-mounted radiating elements (1, 1?), at least one core piece (2) is provided which allows an operationally tight connection of the through-flow pipes (3) of two ceiling-mounted radiating elements (1, 1?) to be connected, and at least one mounting rail (4) for positioning at least one connecting part (5) is provided, which locks and secures the ceiling-mounted radiating elements (1, 1?) when a connection is produced.

Abstract: Ceiling-mounted radiating elements for heating or cooling rooms, comprising means for connecting the ceiling-mounted radiating elements together, wherein the ceiling-mounted radiating elements comprise at least one through-flow pipe for a heating or cooling medium, and radiating surfaces are arranged radially around said pipe, wherein to connect two ceiling-mounted radiating elements (1, 1?), at least one core piece (2) is provided which allows an operationally tight connection of the through-flow pipes (3) of two ceiling-mounted radiating elements (1, 1?) to be connected, and at least one mounting rail (4) for positioning at least one connecting part (5) is provided, which locks and secures the ceiling-mounted radiating elements (1, 1?) when a connection is produced.

Abstract: The invention relates to a cooling device (1) for an electronic component (3), especially for a microprocessor, with a heat sink (7, 9), which can be connected to the electronic component (3) to be cooled, such that the waste heat generated by the electronic component (3) is transferred and transported away via a thermal interface of the electronic component (3) on the heat sink (7, 9). According to the invention, the heat sink (7, 9) comprises a first heat sink part (7), which is formed for connection to the electronic component, and a second heat sink part (9), which is connected detachably to the first heat sink part (7), such that a low heat transfer resistance is given, wherein at least the predominant part of the waste heat is transferred to a coolant via the second heat sink part (9).