Abstract: A method for adjusting process temperature measurements used to monitor zone conditions in a reflow oven selects values for exclusion from correlation with the predicted part temperature profile. During the thermal process, a plurality of process temperatures over intervals may be measured along the reflow oven. Over a time period for the thermal process, a measured process temperature of this plurality may be evaluated for the maximum and minimum extremities, from which a difference for that interval may be calculated. This difference may be compared to a qualifier for the plurality, and be excluded from part temperature prediction if the difference for the interval exceeds the qualifier. In an alternative embodiment, the maximum and/or minimum extremities from the plurality of process temperature measurements may be incorporated to produce a process temperature profile for correlation with the part temperature profile.

Abstract: A method and apparatus for controlling a part temperature profile by optimizing response characteristics based on control parameters acquires part temperature response characteristics at selected conditions to form an index value and calculates linear relationships between the index and its corresponding control parameters. The method searches for the minimum index thereby determining its corresponding optimal control parameters for thermal processing of parts in order that the part temperature profile responds within the target specification range with the greatest margin available. The apparatus determines the minimum index value and its corresponding the optimum control parameters.

Abstract: A method for maximizing throughput for thermal processing of a part searches for the maximum conveyor speed while calculating a Process Window Index that is less than a required value. The best Process Window Index associated with the maximum conveyor speed corresponds to a maximum throughput control series with which to set the control parameters of the thermal processor.

Abstract: A method and apparatus for controlling the temperature response profile of a part being exposed to heating and/or cooling conditions in a thermal processor incorporates measured data from the part to adjust the thermal processor control settings by closed loop feedback.

Abstract: A method for aligning a boundary condition temperature in a thermal processor utilizes an air temperature measurement. During the thermal process, air temperature measured along an interval series forms an air profile and provides a reference to which the boundary condition temperature may be aligned. A method for aligning a part temperature profile to the processor temperature profile uses the measured air temperature to adjust the part temperature profile, so as to be synchronized with the air temperature profile. These procedures may be used in conjunction with setpoint parameter prediction for attaining a target part temperature response.