Patents Assigned to Kidd, Inc.
  • Die-bonding electroconductive paste
    Patent number: 4574056
    Abstract: A die-bonding electroconductive paste containing at least one element having the same valence as the valence of a semiconductor element to be die-bonded or a compound of said element and a reducing substance and permitting ohmic contact to be effected at a temperature of not less than 100.degree. C.
    Type: Grant
    Filed: December 5, 1984
    Date of Patent: March 4, 1986
    Assignee: Kidd, Inc.
    Inventor: Shoichi Kimura