Abstract: The device etches semiconductors with a large surface area in a trough-shaped receptacle containing a liquid electrolyte. A sample head is mounted inside the etching trough, and is provided with a device for holding at least one semiconductor wafer. The device is tilted to promote turbulent electrolyte flow in a space between a bottom surface of the semiconductor wafer and top surface of the trough-shaped receptacle.
Type:
Grant
Filed:
July 24, 2003
Date of Patent:
April 24, 2007
Assignee:
Kiel University
Inventors:
Marc Christophersen, Jörg Bahr, Jürgen Carstensen, Kay Steen, Georgi Popkirov, Helmut Föll