Abstract: A drying apparatus comprises a drying vessel, a treatment liquid feeder-discharger for feeding pure water into the drying vessel, a vapor supplier for supplying an organic solvent vapor to the space over the pure water, inert gas suppliers for supplying an inert gas with which the organic solvent vapor is diluted, and a heated organic solvent supplier for forming a film of the organic solvent on a liquid level of the pure water. After the wafer is immersed in the pure water, the pure water is gradually discharged from the drying vessel by means of the treatment liquid feeder-discharger. Since the wafer passes through the organic solvent film as it is exposed above the liquid level, the organic solvent of the film adheres to the surface of the wafer, and the organic solvent vapor is condensed on the surface of the wafer that is exposed above the liquid level.

Abstract: A drying equipment includes an equipment body including a vapor bath, carrier for carring a semiconductor wafer, receiver tray, inert gas supply unit, cooling pipe, exhaust unit, transportation unit, control unit, etc. An air supply opening of a blower is opposite to a top opening of the vapor bath. The vapor bath contains an organic solvent therein. A vapor is generated by heating the organic solvent. A vapor phase boundary surface is formed on the boundary between the vapor and air overlying the same. When the wafer at low temperature is put into the vapor bath by means of the transportation unit, the organic solvent vapor condenses on the surface of the wafer. The inert gas supply unit supplies an inert gas to the vapor in the vapor bath. The wafer is pulled up slowly from the vapor by means of the transportation unit, and passes the vapor phase boundary surface on the way.

Abstract: A substrate drying apparatus comprises a treatment vessel for containing IPA in the form of liquid, an IPA source for supplying IPA into the treatment vessel, a first heat exchanger which is equipped with a heat exchanger tube dipped in IPA and allowing steam to pass therein, the first heat exchanger allowing the steam and IPA to perform heat exchange therebetween to thereby evaporate IPA, and a second heat exchanger provided on or above an upper portion of the treatment vessel and equipped with a heat exchanger tube for allowing a coolant to pass therein, the second heat exchanger allowing the coolant and the evaporated IPA to perform heat exchange therebetween to thereby condense the evaporated IPA.