Abstract: A test system for testing numerous parts simultaneously. A stack of test boards is provided in a test chamber. Each of the test boards has a region of contactors on it. To perform a test, trays are inserted between the boards in the stack and aligned with the regions of contactors. A mechanism is then activated to press the trays towards the boards, thereby making contact between the contactors and devices on the trays. The test system is described in conjunction with a burn-in oven. Processing time is reduced because individual handling of chips is significantly reduced.

Abstract: A semiconductor device handler with a temperature controlled test area. Temperature control is provided in part through the use of temperature controlled air forced across the test area. For heating the test area, electrical resistance heaters are uniformly distributed through the test area and are controlled to provide the desired temperature. The handler has a close pitch between adjacent sockets such that is not possible to distribute refrigeration elements over the test area. Instead, a refrigeration element is placed on one side of the test area. To prevent formation of an undesirable temperature gradient, heat is injected at a specific location in the test area.

Abstract: A transport tray for semiconductor devices that includes a retention mechanism. The tray is formed with molded plastic inserts positioned in a tray. Each insert includes a contact surface that is designed to have two stable points, one corresponding to a latched state and one corresponding to an unlatched state. The retention mechanism includes elements that allow the contact surface to rotate and translate relative to the surface of a semiconductor component being inserted or removed from the tray. Rotation across the surface, as opposed to sliding, significantly reduces the wear of the retention mechanism.

Abstract: An electrical contact element that solves many problems associated with making electrical connections to integrated circuit chips. The contact element fits in small areas, but in some configurations can provide compliance in multiple directions to provide the required compliance. The contacts are shaped to provide relatively large stroke and also large force for good electrical contact. Contact elements according to the invention are incorporated into contactors for making electrical contact to Ball Grid Arrays for testing. Contact elements according to the invention are also incorporated into Ball Grid Array packages, and used as a mounting point for solder balls. The contact elements make the electrical connection withstand stress associated with differential thermal expansion.

Abstract: A novel flexible laminated beam contractor interface package for applications between chips and the like and test equipment therefor, containing a flexible core beam contractor laminated within outer ground shield beam coverings and provided with an exposed contact tip for connecting with test equipment externally to the package; and with contacts adapted flexibly to engage the chip terminals when the chip is temporarily applied to the package for testing; the laminated beam contactor preferably being shaped as bent flexible cantilever or curved beams.

Abstract: A ball grid array package for integrated circuit chips that is designed to facilitate testing. The balls are planarized with high precision to make electrical contact more accurate for testing. Contact, even on fine pitched arrays, can be readily made. A machine for planarizing the solder balls is disclosed. Also, a contact array, as well as a method of making the contact array are disclosed.

Abstract: An expandable gripper for semiconductor processing equipment that allows the pitch between semiconductor chips to be adjusted. To adjust the pitch, several pick and place mechanisms are mounted around a shaft using nuts. The threads of the nuts have variable leads, causing each to travel a different amount as the shaft rotates. All of the threads engage the shaft because a compliant layer is attached to the shaft.

Abstract: A semiconductor chip tray holding chips in individual bins that can each be independently moved with six degrees of freedom. The bins are held in the tray with a flexural bearing system. The flexural bearing system centers the chips at a nominal position allows compliant motion of the bins. The flexural bearing system is made of four beams, with pairs joined at right angles through flexural bearings.