Patents Assigned to King Shing Industrial Co., Ltd
  • Circuit board assembly using metal plates as conducting medium embedded therein
    Patent number: 9307628
    Abstract: A circuit board assembly includes metal plates to be used as conducting medium, an encapsulation enclosing therein the metal plates and provided with holes defined in the encapsulation to allow extension of the metal plates out of the encapsulation for electrical connection and electronic components securely mounted on the encapsulation and electrically connected to the metal plates to form a closed loop.
    Type: Grant
    Filed: April 23, 2013
    Date of Patent: April 5, 2016
    Assignee: KING SHING INDUSTRIAL CO., LTD.
    Inventor: Chun-Chin Shin
  • CIRCUIT BOARD ASSEMBLY USING METAL PLATES AS CONDUCTING MEDIUM EMBEDDED THEREIN
    Publication number: 20140233189
    Abstract: A circuit board assembly includes metal plates to be used as conducting medium, an encapsulation enclosing therein the metal plates and provided with holes defined in the encapsulation to allow extension of the metal plates out of the encapsulation for electrical connection and electronic components securely mounted on the encapsulation and electrically connected to the metal plates to form a closed loop.
    Type: Application
    Filed: April 23, 2013
    Publication date: August 21, 2014
    Applicant: King Shing Industrial Co., Ltd
    Inventor: Chun-Chin SHIN