Abstract: A chip-scale sensor package structure includes a sensor chip, a first package body surrounding and connected to an outer lateral side of the sensor chip, a ring-shaped support disposed on a top side of the first package body, a light permeable member disposed on the ring-shaped support, and a redistribution layer (RDL) disposed on a bottom surface of the sensor chip and a bottom side of the first package body. The sensor chip includes a sensing region arranged on the top surface thereof, a plurality of internal contacts, and a plurality of conductive paths respectively connected to the internal contacts and electrically coupled to the sensing region. The sensing region is spaced apart from the ring-shaped support by a distance less than 300 ?m. A bottom surface of the RDL has a plurality of external contacts electrically coupled to the internal contacts.

Abstract: A sensor package structure is provided and includes a substrate, a sensor chip disposed on the substrate, a padding layer disposed on the substrate, a plurality of wires, a support, and a light-permeable layer disposed on the support. A top side of the padding layer is coplanar with a top surface of the sensor chip, the support is disposed on the top side of the padding layer and the top surface of the sensor chip, and the wires are embedded in the support. Terminals at one end of the wires are connected to the top surface of the sensor chip, and terminals at the other end of the wires are connected to the top side of the padding layer, so that the sensor chip can be electrically coupled to the substrate through the wires and the padding layer.

Abstract: A sensor package structure includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, an opaque support (e.g., a ring-shaped solder mask) disposed on the sensor chip, and a light permeable layer disposed on the opaque support. The sensor chip includes a sensing region. The opaque support surrounds the sensing region, and inner lateral sides of the opaque support form a light-scattering loop wall. The light permeable layer, the light-scattering loop wall of the opaque support, and the sensor chip jointly define an enclosed space therein. When light passes through the light permeable layer and impinges onto the light-scattering loop wall at an incident angle, the light-scattering loop wall scatters the light into multiple rays at angles different from the incident angle.

Abstract: An image sensor package includes a substrate, a sensor chip, a light-permeable cover, and a particle blocking dam. The substrate has a chip accommodating space, and the sensor chip is disposed in the chip accommodating space and electrically connected to the substrate. The light-permeable cover is disposed on the substrate and disposed above the sensor chip. The particle blocking dam is disposed above the sensor chip and extends from the light-permeable cover toward the sensor chip so as to be in contact with or close to the sensor chip.

Abstract: A sensor package structure and a sensing module thereof are provided. The sensor package structure includes a substrate, a sensor chip disposed on the substrate, a light-curing layer disposed on the sensor chip, a light-permeable layer arranged above the sensor chip through the light-curing layer, and a shielding layer disposed on a surface of the light-permeable layer. The light-curing layer has an inner lateral side and an outer lateral side opposite to the inner lateral side, and the inner lateral side is separated from the outer lateral side by a first distance. In a transverse direction parallel to a top surface of the sensor chip, the outer lateral side is separated from an outer lateral edge by a second distance which is within a range of ½ to ? of the first distance.

Abstract: A defect inspection method for a sensor package structure includes: using an image capture device to separately focus on and take pictures of at least three to-be-inspected regions of the sensor package structure along a height direction, so as to respectively obtain a defect image from one of the to-be-inspected regions, wherein the defect images are aligned with each other along the height direction and have different grayscale values; determining the defect image having a maximum grayscale value as a reference defect image, and defining any of the remaining defect images as a to-be-confirmed defect image; multiplying the maximum grayscale value by a predetermined grayscale ratio to obtain a predicted grayscale value, and confirming whether a difference between the to-be-confirmed and predicted grayscale values falls within an error range.

Abstract: A chip-scale sensor package structure includes a sensor chip, a ring-shaped support disposed on a top surface of the sensor chip, a light permeable member disposed on the ring-shaped support, a package body, and a redistribution layer (RDL). The package body surrounds outer lateral sides of the sensor chip, the ring-shaped support and the light permeable member. A bottom surface of the sensor chip and a surface of the light permeable member are exposed from the package body. The RDL is directly formed on the bottom surface of the sensor chip and a bottom side of the package body. The RDL includes a plurality of external contacts arranged on a bottom surface thereof and electrically coupled to the sensor chip. A portion of the external contacts are arranged outside of a projection region defined by orthogonally projecting the sensor chip onto the bottom surface of the RDL.

Abstract: A method for reducing warpage occurred to a substrate strip after a molding process is provided. First, several dies are mounted on a top surface of a substrate strip. Then, a base having a top surface with a surface curvature is provided, and the top surface of the base is contacted against a bottom surface of the substrate strip to bend the substrate strip. Next, under the status that the top surface of the base is contacted against the bottom surface of the substrate strip, a molding compound is wrapped around each die. Finally, the molding compound is cooled to a room temperature. Accordingly, the molding process is performed on the substrate strip reversely bent in a direction opposite to a warpage direction. Therefore, the warpage originally caused by the molding process is offset by the reverse bending.

Abstract: A sensor package structure includes a substrate, a sensor chip on the substrate, a ring-shaped support, a light permeable board on the ring-shaped support, and an opaque package body formed on the substrate. A top surface of the sensor chip includes a spacing region and a carrying region surrounding the spacing region. The support is disposed on the carrying region. The light permeable board has a ring-shaped notch recessed from an upper surface thereof, and the notch includes a platform surface at least partially located above the support and a wall surface connected to the platform surface and located above the spacing region. A portion of the opaque package body fills the notch and is defined as a light shielding portion. An inner lateral side of the support is arranged in a projection area formed by orthogonally projecting the platform surface onto the top surface.

Abstract: A sensor package structure includes a substrate, a sensor chip disposed on the substrate, a plurality of metal wires electrically connecting the substrate and the sensor chip, a glass cover disposed on the sensor chip, and an adhesive layer connecting the glass cover to the substrate. The substrate is made of a material having a coefficient of thermal expansion (CTE) that is less than 10 ppm/° C. The glass cover includes a board body and an annular supporting body connected to the board body. The annular supporting body of the glass cover is fixed onto the substrate through the adhesive layer, so that the glass cover and the substrate jointly surround an enclosed accommodating space. The sensor chip and the metal wires are arranged in the accommodating space, and the sensing region of the sensor chip faces the light-permeable portion of the board body.

Abstract: A package component includes a base layer, a sensing layer, a photo-curable adhesive, a cover layer and a first filter structure. The photo-curable adhesive and the sensing layer are disposed on the base layer. The sensing layer includes a sensing unit surrounded by the photo-curable adhesive. The cover layer is disposed on the sensing layer. The first filter structure faces the photo-curable adhesive and is disposed on the cover layer. The first filter structure is configured for transmitting a curing light which is used to cure the photo-curable adhesive, and for reflecting a detectable light which is to be sensed by the sensing unit, where the wavelength of the curing light is different from the wavelength of the detectable light.

Abstract: An inspection apparatus includes a focus assistant loader and a camera assembly. The focus assistant loader includes a fetching member and a focus member connected to the fetching member. The focus member includes a plurality of focus portions respectively located at different levels. The camera assembly includes a plurality of cameras. The cameras may face the focus assistant loader and respectively focus on the focus portions. Thus, by using the cameras to focus on the focus portions, the inspection apparatus may find out tiny defects on a tested device held by the focus assistant loader. In addition, the present disclosure also discloses a focus assistant loader of an inspection apparatus and a method for inspecting a sensor package structure.

Abstract: A sensor package structure includes a substrate, an electronic chip fixed on the substrate by flip-chip bonding, a sealant disposed on the substrate and embedding the electronic chip therein, a sensor chip with a size larger than that of the electronic chip, a light-permeable sheet, a plurality of metal wires electrically connected to the substrate and the sensor chip, and a package body. A bottom surface of the sensor chip is disposed on the sealant to be spaced apart from the electronic chip. A lateral surface of the sensor chip is horizontally spaced apart from that of the sealant by a distance less than or equal to 3 mm. The package body is disposed on the substrate and covers the metal wires as well as the lateral sides of the sealant and the sensor chip. The light-permeable sheet is fixed above the sensor chip through the package body.

Abstract: Disclosed is an optical sensor including a substrate, a redistribution chip structure disposed on the substrate, a sensor chip disposed on the redistribution chip structure, a light-permeable sheet arranged above the sensor chip, metal wires electrically connecting the substrate and the sensor chip, and a package body disposed on the substrate. The redistribution chip structure includes an insulating body, a first electronic chip embedded in the insulating body, and a redistribution layer (RDL) connected to bottoms of the insulating body and the first electronic chip. The RDL is fixed onto the substrate in a flip-chip manner. A projected region defined by orthogonally projecting a sensing area of the sensor chip onto the redistribution chip structure is located inside outer edges of the redistribution chip structure. The redistribution chip structure, the sensor chip, a part of the light-permeable sheet, and the metal wires are embedded in the package body.

Abstract: A sensor package structure includes a substrate, a sensor chip disposed on the substrate, a plurality of metal wires electrically connecting the sensor chip to the substrate, a light-permeable layer, a combining layer connecting a portion of the light-permeable layer onto the sensor chip, and a packaging compound covering lateral sides of the sensor chip, the light-permeable layer, and the combining layer. Each of the metal wires is embedded in the combining layer and the packaging compound, and has a diameter within a range of 0.8-1.1 mil. Each of the metal wires includes a first segment connected to the substrate and a second segment connected to the sensor chip. In each of the metal wires, the second segment integrally and curvedly extends from the first segment, and the second segment and a top surface of the sensor chip have a sloping angle within a range of 5-45 degrees.

Abstract: The present disclosure provides a package base core and a sensor package structure. The package base core includes a substrate and at least one stopper, or the package base core includes a substrate, at least one stopper, and a compound. The sensor package structure includes a substrate, a first stopper, a second stopper, a sensing member, a first compound, a second compound, and a translucent member. The stopper (or the first and second stoppers) of the present disclosure is provided to form with a protruding portion on the substrate, so that an overflowing of the compound can be avoided, thereby increasing the reliability of the package base core.

Abstract: A sensor package structure includes a substrate, a sensor chip disposed on the substrate, a plurality of wires electrically connected to the substrate and the sensor chip, a transparent layer facing the sensor chip, a support disposed on the substrate, and a packaging compound disposed on the substrate and covering side edges of the support and the transparent layer. A part of each wire is embedded in the support. A height from the upper surface of the substrate to the top of the support is larger than a height from the upper surface of the substrate to the top of any of the wires. The bottom surface of the transparent layer has a central region facing the sensor chip and a ring-shaped supporting region surrounded by the central region. The support is arranged outside the sensor chip and abuts against the supporting region.

Abstract: A sensor package structure includes a substrate, a sensor chip, a plurality of wires, a supporting frame, a transparent cover, and a molding compound. The substrate includes a chip bonding region and a plurality of first pads outside the chip bonding region. The sensor chip is disposed on the chip bonding region, and includes a sensing region and a plurality of second pads. Each wire has two opposite ends respectively connected to one of the first pads and one of the second pads. The supporting frame is arranged above the substrate and/or the sensor chip and includes a positioning portion. The transparent cover is fixed in position above the sensor chip by the positioning portion so as to maintain a vertical distance there-between. The molding compound fills the space in-between the substrate and the supporting frame and covers a part of an upper surface of the supporting frame.

Abstract: A stack type sensor package structure includes a substrate, a semiconductor chip disposed on the substrate, a frame disposed on the substrate and aside the semiconductor chip, a sensor chip disposed on the frame, a plurality of wires electrically connecting the sensor chip and the substrate, a transparent layer being of its position corresponding to the sensor chip, a support maintaining the relative position between the sensor chip and the transparent layer, and a package compound disposed on the substrate and partially covering the frame, the support, and the transparent layer. Thus, through disposing a frame within the stack type sensor package structure, the structural strength of the overall sensor package structure is reinforced, and the stability of the wiring of the sensor chip is effectively increased.

Abstract: A sensor package structure includes a substrate, a sensor chip disposed on the substrate, several metal wires electrically connected to the substrate and the sensor chip, a translucent layer corresponding in position to the sensor chip, a combining layer firmly fixing the translucent layer to the sensor chip, and a packaging compound. A top surface of the sensor chip has a sensing region and a spacing region around the sensing region. The sensor chip includes several connecting pads arranged on the top surface between at least part of the edges thereof and the spacing region. The translucent layer has a fixing region arranged outside a portion thereof adhered to the combining layer. The packaging compound covers the fixing region and the external sides of the sensor chip, the combining layer, and the translucent layer. Each metal wire is embedded in the combining layer and the packaging compound.