Abstract: An adsorption device for rotatable heating is provided with an adsorption heating plate, a support needle driving device, a rotary sliding ring, and a turning shaft. The adsorption heating plate is amounted at the top of the turning shaft, and a wafer is arranged at the top of the adsorption heating plate. The rotary sliding ring is connected to the turning shaft in which a vacuum channel and a connection wire channel are arranged. Support needles are connected to the output end of the support needle driving device, run through the adsorption heating plate, and are arranged at the bottom of the wafer uniformly. The adsorption device incorporates the wafer adsorption function, the wafer rotating function with controllable speed, and the heating function for heating the wafer to reach different temperatures, thereby providing adsorption and heating rotation at the same time.
Abstract: The present invention relates to developing and design a coater & developer with high throughput that in-line with lithograph equipment during integrated circuit production, which needs to reasonably set the quantity of processing modules and the transfer speed of robots in the coater & developer. The present invention provides a method for setting the quantity of the processing modules and the transfer speed of the robots in the coater & developer, including steps of determining the processing time parameter of the coater & developer according to the target throughput, and designing the processing periodic time parameter of each processing module and the transfer periodic time parameter of each wafer transfer robot in the coater & developer make the three time parameters tend to consistency.
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