Patents Assigned to Kingspan Industrial Insulation Limited
  • Patent number: 6746759
    Abstract: A resin mixture for forming a stable closed cell foam contains a phenolic resole, a chain extending agent, and as curing agents, a base, and an ester and/or an aliphatic carbonate. The chain extending agent is especially an epoxy resin and/or a phenolic novalak resin.
    Type: Grant
    Filed: April 12, 2002
    Date of Patent: June 8, 2004
    Assignee: Kingspan Industrial Insulation Limited
    Inventors: Mark Stanley Harris, Vincent Coppock, Norman Ryder, Graham Morgan Edgerley
  • Patent number: 6472444
    Abstract: A closed cell phenolic foam is formed from a phenolic resin, a blowing agent such as HCFC141b, a catalyst and less than 2.5% by weight relative to the resin of at least one hydrofluoroether or an azeotrope formulation thereof. 1-methoxy-nonafluorobutane and especially an azeotrope formulation thereof with trans-1,2-dichloroethylene are preferred hydrofluoroethers. The phenolic foam has a stable closed cell content of greater than 90% and a stable thermal conductivity.
    Type: Grant
    Filed: September 27, 2001
    Date of Patent: October 29, 2002
    Assignee: Kingspan Industrial Insulation Limited
    Inventors: Mark Stanley Harris, Graham Morgan Edgerley
  • Publication number: 20020061935
    Abstract: A closed cell phenolic foam is formed from a phenolic resin, a blowing agent such as HCFC141b, a catalyst and less than 2.5% by weight relative to the resin of at least one hydrofluoroether or an azeotrope formulation thereof 1-methoxy-nonafluorobutane and especially an azeotrope formulation thereof with trans-1,2-dichloroethylene are preferred hydrofluoroethers. The phenolic foam has a stable closed cell content of greater than 90% and a stable thermal conductivity.
    Type: Application
    Filed: September 27, 2001
    Publication date: May 23, 2002
    Applicant: Kingspan Industrial Insulation Limited
    Inventors: Mark Stanley Harris, Graham Morgan Edgerley