Abstract: A grinding tool includes a substrate and a plurality of abrasive particles. The substrate has a first and a second surface and a plurality of holes, each of the holes extending through the substrate and respectively having a first and a second opening on the first and second surface, the second opening being larger than the first opening. The abrasive particles are respectively disposed in the holes and attached to the substrate via a plurality of adhesive portions, each of the abrasive particles having a tip protruding outward from the first surface and a remaining part covered with one of the adhesive portions inside the corresponding hole, wherein the first openings of the holes are smaller than the abrasive particles, and the abrasive particles are respectively retained in the holes. Moreover, embodiments described herein include a method of fabricating a grinding tool.

Abstract: A grinding tool includes a substrate, and at least an abrasive particle affixed to the substrate. The abrasive particle has a base, and four tips adjacent to one another protruding from the base, the base having a cavity of a generally cross shape extending between the four tips, the cavity including a material discharge surface disposed between two adjacent ones of the four tips, the material discharge surface being located at an end of the cavity and adjacent to a side surface of the base, an inner material angle between the material discharge surface and the side surface being between about 120 degrees and about 160 degrees. Moreover, embodiments described herein include a method of manufacturing the grinding tool.

Abstract: A grinding tool includes a substrate having a working surface, and a plurality of abrasive particles distributed over the working surface and protruding outward from the working surface, wherein at least some of the abrasive particles are machined to form abrasive particles respectively having an obliquely truncated pyramid shape. Some embodiments described herein also include a method of manufacturing the grinding tool.

Abstract: A grinding tool includes a rigid support body and a carrier substrate. The carrier substrate is attached to the support body, and is supported by the support body. Two opposing surfaces of the carrier substrate respectively define a working surface and a non-working surface. A plurality of first abrasive particles are affixed on the working surface, and a plurality of second abrasive particles are affixed on the non-working surface. The first abrasive particles have a first average size, and the second abrasive particles have a second average size smaller than the first average size. The carrier substrate is attached to the support body at the non-working surface. Moreover, a method of manufacturing the grinding tool is described herein.

Abstract: A grinding tool includes a substrate having a working surface, and a plurality of abrasive particles distributed across the working surface and protruding outward from the working surface, wherein at least some of the abrasive particles are machined to form abrasive particles respectively having a pyramid shape, the pyramid shape being a right square pyramid or a right hexagonal pyramid.

Abstract: The present invention relates to a chemical mechanical polishing conditioner and manufacturing methods thereof. The chemical mechanical polishing conditioner comprises: a planar substrate having a leveling surface; a bonding layer disposed on the surface of the planar substrate; and a plurality of abrasive particles embedded in the surface of the bonding layer and fixed to the surface of the planar substrate by the binding layer; wherein the planar substrate is formed by a deformation compensation for the non-planar substrate during curing the binding layer, and thus the tips of the abrasive particles have a leveled height. Therefore, the present invention can effectively improve the problem of thermal deformation of the substrate of the chemical mechanical polishing conditioner during heating and curing process, and thereby enhancing the surface flatness of chemical mechanical polishing conditioner.

Abstract: The present invention relates to a patterned opto-electrical substrate, comprising a substrate, the substrate has a first patterned structure, a spacer region and a second patterned structure, wherein the second patterned structure is formed on one or both of the first patterned structure and the spacer region, and the first patterned structure is a micron-scale protruding structure or a micron-scale recessing structure, while the second patterned structure is a submicron-scale recessing structure. The present invention also relates to a method for manufacturing the aforementioned patterned opto-electrical substrate and light emitting diodes having the aforementioned patterned opto-electrical substrate.

Abstract: The present invention relates to a chemical mechanical polishing conditioner made from a woven preform, comprising: a substrate; a bonding layer disposed on the substrate; and a plurality of abrasive particles embedded in the bonding layer and fixed on the substrate by the bonding layer; wherein the bonding layer is formed by heat-curing a woven preform, and the abrasive particles are fixed to the woven preform in advance. Therefore, the present invention can provide the bonding layer with a better flexibility by the woven preform, and solve the conventional problem of resin residue in a powder-form bonding layer, or thermal cracking or thermal deformation of a sheet-form bonding layer during the heating and curing process, and thus improve the polishing performance and service time of the chemical mechanical polishing conditioner.

Abstract: The present invention relates to a diamond screening apparatus, comprising: a working platform comprising a working plane; a conveyer disposed on the working plane of the working platform for carrying a diamond matrix unit; an image capture device forming one or a plurality of captured images in different regions of the diamond matrix unit; a display device; and an image recognition module, which is electrically connected to the image capture device and the display device, performs a geometric feature parameter analysis on the captured images to determine one or a plurality of risk diamonds of the diamond matrix unit.

Abstract: The present invention relates to a detection apparatus of chemical mechanical polishing conditioner, comprising: a working platform with a working plane; a placement base disposed on the working plane of the working platform, for carrying a chemical mechanical polishing conditioner; an image capture device forming one or a plurality of captured images on different regions of the chemical mechanical polishing conditioner; a display device; an image recognition module, wherein the captured images are performed a color matching by the image recognition module to determine one or a plurality of risk diamonds on the chemical mechanical polishing conditioner, and the coordinate location of the risk diamonds are outputted into the display device; and a mobile platform for moving the risk diamonds to specified locations. A detection method of the above mentioned detection apparatus is also disclosed.

Abstract: The present invention relates to a detection method and apparatus for the tip of the chemical mechanical polishing conditioner, which comprises: providing a dyeing apparatus comprising a dyeing layer; providing a chemical mechanical polishing conditioner comprising a substrate, a binding layer, and a plurality of abrasive particles, the abrasive particles fixed on the substrate by the binding layer; making the abrasive particles of the chemical mechanical polishing conditioner toward the dyeing apparatus and provide a downward force, so that the chemical mechanical polishing conditioner is contacted with the dyeing layer; and separating the chemical mechanical polishing conditioner and the dyeing apparatus, so that the abrasive particles with a particular protruding height form dyeing abrasive particles adhered the dyeing layer on their surface, and the dyeing abrasive particles are determined as a defect of destroying the flatness of chemical mechanical polishing conditioner.

Abstract: The present invention relates to a segment-type chemical mechanical polishing conditioner and a method for manufacturing thereof. The segment-type chemical mechanical polishing conditioner comprises: a bottom substrate having a center protrusion; an abrasive unit binding layer disposed on the outside of the surface of the bottom substrate; and a plurality of abrasive units placed on the abrasive unit binding layer; wherein the abrasive units have a fan-shaped contour and are arrange along the center protrusion of the bottom substrate to form a discontinuous circular contour. Therefore, the present invention can utilize the center protrusion of the bottom substrate to adjust the arrangements of the abrasive units, and effectively improve the problem of thermal deformation of the surface of the chemical mechanical polishing conditioner during heat-hardening process, thereby enhancing the surface flatness of chemical mechanical polishing conditioner.

Abstract: The present invention relates to a chemical mechanical polishing conditioner and manufacturing methods thereof. The chemical mechanical polishing conditioner comprises: a planar substrate having a leveling surface; a bonding layer disposed on the surface of the planar substrate; and a plurality of abrasive particles embedded in the surface of the bonding layer and fixed to the surface of the planar substrate by the binding layer; wherein the planar substrate is formed by a deformation compensation for the non-planar substrate during curing the binding layer, and thus the tips of the abrasive particles have a leveled height. Therefore, the present invention can effectively improve the problem of thermal deformation of the substrate of the chemical mechanical polishing conditioner during heating and curing process, and thereby enhancing the surface flatness of chemical mechanical polishing conditioner.

Abstract: The present invention relates to a method for manufacturing a chemical mechanical polishing conditioner, comprising: (A) providing a non-planar substrate; (B) providing a binding layer disposed on the surface of the non-planar substrate; (C) providing a plurality of abrasive particles embedded in a surface of the binding layer, and (D) heat curing the binding layer, such that the non-planar substrate is deformed into a planar substrate during curing the binding layer, and the abrasive particles are fixed to a surface of the planar substrate by the binding layer; wherein, after step (D), tips of the abrasive particles have a leveled height. Therefore, the present can effectively improve the problem of thermal deformation of the substrate of the chemical mechanical polishing conditioner during a heat curing process, and enhance surface flatness of the chemical mechanical polishing conditioner.

Abstract: A diamond disc manufacturing process includes the following steps. Firstly, a container is provided, and an adhesion layer is formed in the container. A hollow member having a plurality of meshes is covered on the adhesion layer. A plurality of diamond particles is implanted on the hollow member and embedded into the meshes of the hollow member, so that the diamond particles are adhered onto the adhesion layer. Then, a resin material is infused into the container, so that the diamond particles are bonded on the resin material. Finally, the resin material together with the diamond particles is released from the container, so as to obtain a diamond disc base with the diamond particles having uniform distribution and orientation.

Abstract: An optical element and a manufacturing method thereof are described. An optical material is pressed in a holder through a mold, so as to form an optical element with an optical lens embedded in the holder. A groove in the holder has a guiding face, and the guiding face is obliquely disposed in a direction towards a mirror with a relatively smaller radius of curvature of the optical lens, so as to guide the optical material to truly enter the groove, thereby enhancing gas tightness and precision between the optical lens and the holder.

Abstract: The present invention relates a packaging carrier with high heat dissipation for packaging a chip, comprising: a carrier body, an interfacial metal layer, at least one diamond-like carbon thin film, a plated layer, and an electrode layer. Herein, the packaging carrier further comprises through holes. The present invention further discloses a method for manufacturing the aforementioned packaging carrier, comprising: providing a carrier body; forming an interfacial metal layer on the upper surface of the carrier body; forming a diamond-like carbon thin film on the interfacial metal layer; forming a plated layer on the diamond-like carbon thin film; forming an electrode layer on the lower surface of the carrier body; and forming through holes extending through all or part of the aforementioned elements. The present invention uses a diamond-like carbon thin film and through holes for heat dissipation in three dimensions to improve heat dissipation of an electronic device.

Abstract: A diamond disc manufacturing process includes the following steps. Firstly, a container is provided, and an adhesion layer is formed in the container. A hollow member having a plurality of meshes is covered on the adhesion layer. A plurality of diamond particles is implanted on the hollow member and embedded into the meshes of the hollow member, so that the diamond particles are adhered onto the adhesion layer. Then, a resin material is infused into the container, so that the diamond particles are bonded on the resin material. Finally, the resin material together with the diamond particles is released from the container, so as to obtain a diamond disc base with the diamond particles having uniform distribution and orientation.

Abstract: The present invention relates to a grinding tool and a method for fabricating the same. The method comprises: (A) providing a grinding plate having a working surface and a non-working surface, a mold having an adjustment surface, and a backplane; (B) getting the working surface of the grinding plate to fit precisely and be retained on the adjustment surface of the mold by a binder; (C) forming an adhesive layer on the non-working surface of the grinding plate; (D) disposing the backplane on a surface of the adhesive layer to retain the backplane over the non-working surface of the grinding plate by the adhesive layer; and (E) removing the binder to separate the mold from the grinding plate. Accordingly, the present invention can significantly improve the precision and lifetime of products, reduce the cost of production, and enhance the machining efficiency.

Abstract: A cutter wheel is disclosed, which comprises a cutter wheel body, a cutting unit, and a solder layer. The cutter wheel body consists of the first substrate and the second substrate, wherein each substrate has an inner surface and an outer surface. The inner surface of the first substrate is treated with surface modification. The cutting unit can be formed on a rough surface. The solder layer is formed between the cutting unit and the second substrate. The present invention also provides a method for manufacturing the cutter wheel as mentioned above.