Patents Assigned to Kinpo Electronics
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Publication number: 20180186095Abstract: A 3D printing device and a printing correction method are provided. The 3D printing device includes a printing nozzle, a printing platform and a controller. The printing nozzle is controlled to move on the movement plane. The printing platform includes a first tilt sensor to sense a tilting state of the printing platform. The controller is coupled to the first tilt sensor. The printing correction method adapted to the 3D printing device includes following steps: sensing the tilting state of the printing platform; controlling the printing nozzle to be depressed in a first position on the printing platform to change the tilting state of the printing platform; and, correcting the relative position of the print platform with the movement plane by the first position and the changes of tilting state of the printing platform sensed by the tilt sensor.Type: ApplicationFiled: March 20, 2017Publication date: July 5, 2018Applicants: XYZprinting, Inc., Kinpo Electronics, Inc.Inventor: Yu-Jie Yang
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Publication number: 20180192195Abstract: A sound source apparatus for receiving an audio signal and displaying the audio signal is provided. The sound source apparatus includes at least two sound source output devices, at least two distance sensors, and a processor. Each distance sensor is installed respectively corresponding to each sound source output device, and is configured to respectively detect at least one target to generate sensing signals. The processor receives the audio signal, and when the processor determines that the at least one target meets a sensing range through respectively receiving the sensing signals generated by each distance sensor, the processor calculates output volume of each sound source output device respectively according to a relative distance between each distance sensor and the at least one target.Type: ApplicationFiled: February 15, 2017Publication date: July 5, 2018Applicant: Kinpo Electronics, Inc.Inventor: Yung-Rung Du
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Publication number: 20180169967Abstract: The invention provides a 3-D printing method including: providing a liquid-state forming material in a 3-D printing apparatus; detecting a temperature of the liquid-state forming material; and adjusting corresponding curing parameters according to the temperature and curing characteristics of the liquid-state forming material to cure the liquid-state forming material layer by layer, so as to form and stack multiple cured layers to form a 3-D object. The invention can ensure consistency of a molded object printed by the 3-D printing apparatus using the liquid-state forming material and thus, solve the issue of inconsistent quality occurring to the molded object printed by the 3-D printing apparatus using the liquid-state forming material due to the curing speed of the liquid-state forming material varying with temperatures.Type: ApplicationFiled: January 18, 2017Publication date: June 21, 2018Applicants: XYZprinting, Inc., Kinpo Electronics, Inc.Inventors: Cheng-Kuan Chang, Meng-Chwen Lee
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Publication number: 20180162068Abstract: A three-dimensional printing apparatus and a three-dimensional printing method are provided. The three-dimensional printing apparatus includes a tank, an injection module, a platform movably disposed above the bottom of the tank, a curing module, and a control module. The tank has a forming area and a separating area in a stepped manner on a bottom thereof, and the forming area is higher than the separating area. The injection module includes a storage tank and an injection pipe connected thereto, and a forming material is filled therein to be applied to the forming area. The curing module is disposed beside the tank or the platform to cure the forming material between the platform and the forming area to be a curing layer. The control module is electrically connected to the injection module, the curing module, and at least one of the tank and the platform to perform a relative movement.Type: ApplicationFiled: January 19, 2017Publication date: June 14, 2018Applicants: XYZprinting, Inc., Kinpo Electronics, Inc.Inventor: Peng-Yang Chen
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Publication number: 20180154587Abstract: The invention relates to a 3-D printing apparatus including a tank, a platform, a fixture, a solidifying module and a control module. The tank is flexible and filled with a liquid-state forming material. The platform is disposed in the tank. The control module drives the fixture to deform the tank, so as to form a first gap between the platform and a bottom of the tank for the liquid-state forming material to flow in. The solidifying module in controlled by the control module to solidify the liquid-state forming material between the platform and the bottom of the tank, so as to form a solidified layer. The invention can effectively reduce a processing time for manufacturing each solidified layer, such that an overall processing time can be reduced to achieve preferable molding efficiency.Type: ApplicationFiled: February 15, 2017Publication date: June 7, 2018Applicants: XYZprinting, Inc., Kinpo Electronics, Inc.Inventor: Peng-Yang Chen
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Patent number: 9987802Abstract: A method for adjusting a printing head usage amount of a 3D printer and a control device are provided. The method is adapted to control the control device of the 3D printer. The method includes following steps. At least one printing head of the 3D printer is divided into a plurality of sections. An accumulated printing point number of each of the sections is obtained. At least one specific section used for printing a 3D object is selected from the sections according to the accumulated printing point number of each of the sections. The method for adjusting the printing head usage amount of the 3D printer and the control device can avoid excessively high usage amount of some nozzles.Type: GrantFiled: September 22, 2015Date of Patent: June 5, 2018Assignees: XYZprinting, Inc., Kinpo Electronics, Inc., Cal-Comp Electronics & Communications Company LimitedInventors: Hsueh-Kuan Shih, I-Feng Wu
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Patent number: 9981427Abstract: A sensing device of a three dimensional object being printed is provided. The sensing device includes a roller, a ring shape equipment, a sensor, and a processor. The roller is utilized to perform planarization of the 3D printing object. The ring shape equipment has the same axial as the roller and rotates with the roller. The sensor is utilized to detect rotational speed of the ring shape equipment. The processor determines whether the roller is in contact with the 3D printing object according to the rotational speed of the ring shape equipment. Thereby, contact between the roller and the 3D printing object may be determined without disposed sensor on the roller.Type: GrantFiled: October 11, 2015Date of Patent: May 29, 2018Assignees: XYZprinting, Inc., Kinpo Electronics, Inc., Cal-Comp Electronics & Communications Company LimitedInventor: Yao-Te Huang
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Publication number: 20180133978Abstract: A three-dimensional printing apparatus including a body, a rotation module, a tank, an elevating module, a forming platform, a curing module, and a control module is provided. The rotation module and the elevating module are disposed on the body. The tank is disposed on the rotation module. The forming platform is disposed on the elevating module. The curing module disposed in the body and under the tank. The control module is electrically connected to the rotation module, the elevating module, and the curing module. The forming platform dips into the forming material in liquid in the tank and the curing module cures the forming material between the forming platform and an inner bottom of the tank to form a solidification layer. Then the elevating module and the rotation module respectively drive the forming platform to rise and rotate relatively to the tank simultaneously.Type: ApplicationFiled: January 16, 2017Publication date: May 17, 2018Applicants: XYZprinting, Inc., Kinpo Electronics, Inc.Inventors: Chao-Yu Yen, Chen-Fu Huang, An-Hsiu Lee, Tsai-Yi Lin
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Publication number: 20180133981Abstract: A printing head module for a 3-D printing apparatus includes a 3-D print head, an ink-jet print head and a baking module. The 3-D print head includes a melting module and a base-material nozzle to print a plurality of staking layers. The ink-jet print head is connected to the 3-D print head and includes an ink nozzle to dispense ink on each stacking layer. The baking module is disposed between the 3-D print head and the ink-jet print head and includes a fan, a discharge casing and a heating module. The fan includes an air-discharge side facing the base to provide an air flow. The discharge casing is disposed on the air-discharge side. The heating module is disposed between the fan and the discharge casing to heat the air flow and the heated air flow being blown out via the discharge casing for drying the ink layer.Type: ApplicationFiled: March 21, 2017Publication date: May 17, 2018Applicants: XYZprinting, Inc., Kinpo Electronics, Inc.Inventors: Chia-Hung Huang, Ming-En Ho, Chun-Hsiang Huang, Jia-Yi Juang, Yang-Teh Lee
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Publication number: 20180133984Abstract: A three-dimensional (3D) printing apparatus includes a tank containing a forming material in liquid, a platform dipped into or moved away the forming material, a curing device disposed besides the tank or the platform, and a control device electrically connected to at least one of the tank and the platform and the curing device. An inner bottom of the tank includes a forming area and a peeling area in a stepped shape, and the forming area is higher than the peeling area. A 3D printing method includes providing the 3D printing apparatus, then the liquid-state forming material between the platform and the forming area is cured to form a solidification layer. Afterwards, a position and an occupied proportion of the solidification layer corresponding to the inner bottom, and a movement range of a relative movement is determined according thereto so as to completely peel off the solidification layer.Type: ApplicationFiled: February 15, 2017Publication date: May 17, 2018Applicants: XYZprinting, Inc., Kinpo Electronics, Inc.Inventors: Ting-Yu Lu, Peng-Yang Chen
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Publication number: 20180093427Abstract: A three dimensional printing apparatus including a tank containing a liquid forming material, a platform movably disposed in the tank to be immersed in or moved out of the liquid forming material, a curing device disposed next to the tank or the platform, and a controlling device electrically connected to the curing device and at least one of the tank and the platform is provided. An inner bottom of the tank has a first portion and a second portion in step manner, the first portion is higher than the second portion. The controlling device drives the tank and the platform to move relative to each other. A solidified layer is formed by curing the liquid forming material between the platform and the first portion and peeled off by rotating the tank relative to the platform. A three dimensional printing method is also disclosed.Type: ApplicationFiled: September 30, 2016Publication date: April 5, 2018Applicants: XYZprinting, Inc., Kinpo Electronics, Inc.Inventor: Bo Pang
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Publication number: 20180061793Abstract: A package structure includes a substrate, a patterned solder resist layer, a plurality of solders, a chip and a polymer gel. The substrate includes a plurality of solder pads. The patterned solder resist layer is disposed on the substrate and includes a plurality of stepped openings. The stepped openings expose the solder pads respectively. The solders are disposed on the solder pads and located in the stepped openings respectively. The chip is disposed on the substrate and includes an active surface and a plurality of bond pads. The bond pads are disposed on the active surface and connected to the solder pads by the solders. The polymer gel fills between a top surface of the patterned solder resist layer and the active surface. The polymer gel at least surrounds a disposing region of the solders and fills between two adjacent solders.Type: ApplicationFiled: October 14, 2016Publication date: March 1, 2018Applicant: Kinpo Electronics, Inc.Inventor: Yu-Wei Cheng
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Patent number: 9906895Abstract: A sound source device is provided. The sound source device includes a wireless communication module, a memory, an audio player, an audio processor and a microprocessor. The wireless communication module receives first digital audio data and generates second digital audio data and a first operation command, and the microprocessor generates a second operation command in response to the first operation command. The audio processor receives the second digital audio data, and converts the second digital audio data to analogy audio data; and the audio processor receives the second operation command, and converts the second digital audio data to an audio compressed file. The audio player receives and plays the analogy audio data, and the memory receives and stores the audio compressed file.Type: GrantFiled: February 13, 2017Date of Patent: February 27, 2018Assignee: Kinpo Electronics, Inc.Inventor: Yung-Rung Du
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Patent number: 9895872Abstract: A 3-D printing apparatus includes a base and a printing head disposed above the base. The base includes an adjustment platform having an adjustment side and a top surface, a first-adjustment mechanism, second-adjustment mechanisms and a printing bed. The first-adjustment mechanism includes an adjustment shaft, first and second gears and a linkage rod. The first gear disposed under the adjustment platform is engaged with the adjustment shaft to drive it to move along a normal direction of the top surface. The second gear is engaged with the first gear to drive it to rotate. The linkage rod extended to the adjustment side connects the second gear to drive it to rotate. The second-adjustment mechanisms arranged along the adjustment side are adapted to move along the normal direction. The printing bed disposed on the adjustment platform is engaged with the adjustment shaft and the second adjustment mechanisms to move therewith.Type: GrantFiled: July 31, 2014Date of Patent: February 20, 2018Assignees: XYZprinting, Inc., Kinpo Electronics, Inc., Cal-Comp Electronics & Communications Company LimitedInventors: Shih-Jer Din, Jui-Feng Chang, Shy-Huey Yee
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Patent number: 9862150Abstract: A three-dimensional printing apparatus and a printing method thereof are provided. The three-dimensional printing apparatus includes a tank, a movable platform, a light source module, and a controller. The bottom of the tank includes an irradiated area and a non-irradiated area. The movable platform is movably disposed above the tank. The light source module is disposed under the tank and only provides light to the irradiated area to irradiate a liquid-formation material. The controller controls the movable platform to move along a first axis direction, such that at least one layer object of a three-dimensional object is cured on the movable platform layer by layer. The layer object is composed of object sections. During a period of forming one layer object, the controller controls the movable platform to move on a horizontal plane, such that the object sections of the layer object are cured sequentially above the irradiated area.Type: GrantFiled: December 3, 2014Date of Patent: January 9, 2018Assignees: XYZprinting, Inc., Kinpo Electronics, Inc., Cal-Comp Electronics & Communications Company LimitedInventors: Peng-Yang Chen, Ming-Hsiung Ding
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Patent number: 9862139Abstract: A three dimensional printing apparatus including a tank filled with liquid forming material, a platform disposed in the tank and immersed in the liquid forming material, and a curing tool disposed next to the tank is provided. The tank has at least two forming areas in step manner. The tank and the platform are controlled to generate a relative planer motion, wherein the platform moves from a forming area in higher step towards another forming area in lower step. When the platform moves to one of the forming areas, the curing tool cures the liquid forming material between the platform and the forming area to form a solidification layer on the platform. As the platform moves by at least two forming areas to form at least two solidification layers, the solidification layers are stacked to form a three dimensional object.Type: GrantFiled: March 15, 2016Date of Patent: January 9, 2018Assignees: XYZprinting, Inc., Kinpo Electronics, Inc.Inventor: Bo Pang
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Publication number: 20180005137Abstract: An emotion analysis method and an electronic apparatus thereof are provided. The emotion analysis method is adapted to the electronic apparatus having a database or connected to the database in order to analyze an emotion of an examinee. The emotion analysis method includes: obtaining a heart rate signal of the examinee; defining a plurality of candidate emotions from the database; analyzing the heart rate signal to obtain a plurality of target emotion parameters; and analyzing the target emotion parameters to determine one of the candidate emotions corresponding to the heart rate signal by applying an emotion analysis model.Type: ApplicationFiled: August 10, 2016Publication date: January 4, 2018Applicants: Cal-Comp Electronics & Communications Company Limited, Kinpo Electronics, Inc.Inventors: Han-Wen Guo, Jen-Chien Chien
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Patent number: 9855708Abstract: A three-dimensional printing device including a processing unit and a mixing unit is provided. The processing unit formats a sliced file into a printing head signal file, wherein the sliced file and the printing head signal file correspond to a three-dimensional structure, the sliced file includes layer data corresponding to a plurality of layers of the three-dimensional structure, and the print head signal file includes layer printing data corresponding to the layers of the three-dimensional structure. The mixing unit combines part of the layer data in the sliced file and part of the layer printing data in the printing head signal file to derive a hybrid file, and stores the hybrid file in a storing unit of the electronic device, wherein the layer data and the layer printing data in the hybrid file correspond to different layers of the three-dimensional structure.Type: GrantFiled: October 1, 2015Date of Patent: January 2, 2018Assignees: XYZprinting, Inc., Kinpo Electronics, Inc., Cal-Comp Electronics & Communications Company LimitedInventors: Tien-I Kao, Ting-Yu Lu
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Patent number: D809574Type: GrantFiled: February 10, 2017Date of Patent: February 6, 2018Assignees: XYZprinting, Inc., Kinpo Electronics, Inc.Inventor: Yu-Hao Lin
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Patent number: D810747Type: GrantFiled: October 7, 2015Date of Patent: February 20, 2018Assignees: XYZprinting, Inc., Kinpo Electronics, Inc., Cal-Comp Electronics & Communications Company LimitedInventors: Chieh Kao, Yu-Hao Lin, Che-Wei Chang