Patents Assigned to Kinsus Interconnect Technology
  • Structure and method for fine pitch flip chip substrate
    Patent number: 6969674
    Abstract: The present invention relates to a Fine Pitch flip chip substrate. A black oxide dam is made on the metal circuit between bump pads to replace the conventional solder resist so that the bump pads will not be buried in the solder resist. A small via is drilled by laser drilling and plated filled with copper to be used as the connection between the circuits. By this way, the density and the flexibility of routing could be improved. A mesh pattern can be made in the limited space to increase the stiffness of the substrate.
    Type: Grant
    Filed: September 1, 2004
    Date of Patent: November 29, 2005
    Assignee: Kinsus Interconnect Technology
    Inventors: Chien-Wei Chang, Sheng-Chuan Huang