Abstract: A device for testing integrated circuits utilizing a compression spring that has one longitudinal centerline that is concentric to the housing of the test probe and terminates in a number of reduced diameter coil windings that are non-concentric to the housing so as to provide a side load to the probe.
Type:
Grant
Filed:
April 24, 2015
Date of Patent:
March 6, 2018
Assignee:
KITA USA
Inventors:
Larre H. Nelson, John M. Winter, Yoshihide Kimura