Abstract: A binding tool having a main member and a lateral member for clamping a bundle of cables between a bottom portion of the main member and a lateral bar of the lateral member. A first guide groove and a second guide groove are provided on a first arm portion of the main member and a first insertion hole into which the first arm portion can be inserted is provided on the lateral bar of the lateral member. On portions of the inner face of the first insertion hole corresponding to the first guide groove and the second guide groove, a first engaging protrusion and a second engaging protrusion extending longitudinally are provided, respectively. Both left and right faces of the first engaging protrusion and both left and right faces of the second engaging protrusion are guided in the first guide groove and the second guide groove, respectively.

Abstract: An automatically mountable heat sink for effectively conducting and dissipating heat of an electronic part comprises a heat dissipation plate formed by bending a rectangular metal plate of aluminum, copper or the like by means of pressing along the lines perpendicular to its longitudinal direction and a phase changing member made of a mixture of paraffin and epoxy resin having alumina as a heat conductive filler dispersed therein and applied to a ceiling surface of the heat dissipation plate. When the heat sink and the electronic parts are soldered on a printed wiring board by heating of reflow soldering, the phase changing member made of the mixture of paraffin and epoxy resin is softened and partly moves downward by the action of gravity to abut the upper surface of the electronic part, then is solidified, thereby connecting the heat dissipation plate and the electronic part with each other.