Abstract: A retainer includes a pair of housings having opening surfaces; a connecting portion connecting outer peripheral surfaces of the pair of housings. The retainer is configured to be at a closed state with the opening surfaces of the pair of housing put together and to be at an open state with the opening surfaces of the pair housings separated. Parts of wall surfaces, constituting the housings, are structured as flexible walls capable of deforming, and the connecting portion is connected to the flexible walls.

Abstract: A soft hexagonal ferrite sintered material includes crystal particles of M-type hexagonal ferrite corresponding to a general chemical formula MFe12O19 wherein M is at least one element selected from the group consisting of Ba, Sr and Pb. Crystal particles having particle diameters of 5 ?m to 100 ?m are extracted from a sintered material produced from a precursor powder mixture. The extracted particles as seed crystals are mixed with a calcined powder comprising fine crystals having the above composition and particle diameters of 0.5 ?m to 3 ?m, then is sintered until the intended particle growth of the crystal particles in the sintered material is achieved to give an average particle diameter of 30 ?m to 500 ?m.

Abstract: Proper grounding of a printed circuit board to a grounding conductor by solving the problems in soldering a grounding terminal to a printed circuit board by reflow soldering, relating to a mounting structure of a grounding terminal on a printed circuit board formed by soldering a grounding terminal to the printed circuit board. Two joint surfaces having different surface areas are formed within the joint part of the grounding terminal, and the grounding terminal is soldered to the conductive pattern on the printed circuit board corresponding to the joint surfaces by using the solder having an amount corresponding to the surface area of each joint surface. Also the bending area as the center of elastic deformation of the contact part of the grounding terminal is formed at a predetermined distance away from the relatively small joint surface of the joint part.

Abstract: An electric noise absorber for clamping to a cord of an electronic device comprises a holding case composed of two box-shaped case members. Each case member contains a magnet having a hemi-cylindrical groove at the upper part of the magnet for receiving the cord. It is possible to easily and securely attach and detach the electric noise absorbing magnet to the cord by simply closing and opening the case members.

Abstract: In a conductive member 1, an arm part 21 is bent back from an end of a joint part 11, and a contact part 31 is formed from a portion of the arm part 21, thereby reducing displacement of a contact area between the contact part 31 and a grounding conductor 60 at the time of elastic deformation of the contact part 31. As a result, a desirable grounding condition can be ensured. Also, in such structure, no parts other than the joint part 11 abut on a printed circuit board 50. Consequently, the conductive member 1 can be used on a densely integrated printed circuit board. Furthermore, the contact part 31 is received within a receiving hole of the arm part 21 when elastically deformed. Slippage of the contact part 31 is thus restricted within a predetermined range.

Abstract: The present invention realizes proper grounding of a printed circuit board to a grounding conductor by solving the problems in soldering a grounding terminal to a printed circuit board by reflow soldering, relating to a mounting structure of a grounding terminal on a printed circuit board formed by soldering a grounding terminal to the printed circuit board. Two joint surfaces having different surface areas are formed within the joint part of the grounding terminal, and the grounding terminal is soldered to the conductive pattern on the printed circuit board corresponding to the joint surfaces by using the solder having an amount corresponding to the surface area of each joint surface. Also, the bending area as the center of elastic deformation of the contact part of the grounding terminal is formed at a predetermined distance away from the relatively small joint surface of the joint part.

Abstract: A heat conductor used by being disposed between a heat sink and electronic parts mounted on a printed circuit board. The heat conductor is layered by a heat conductive layer, made of silicone gel with alumina as a heat conductive filler dispersed therein, and a potentially adhesive layer. The potentially adhesive layer consists of a hot melt layer, with alumina as a heat conductive filler dispersed therein, and a heat resistant film, to facilitate formation of the hot melt layer, adhered to the heat conductive layer on one face of the heat resistant film. The heat conductor is set on the electronic parts so that the potentially adhesive layer abuts them, and is made to adhere to the electronic parts due to heating by means of reflow soldering to reach the phase change temperature of the adhesive.

Abstract: Proposed is a reduction of variance in electromagnetic noise eliminating effect with signal conductors arranged in a flat cable to which an electromagnetic noise absorber is attached. The electromagnetic noise absorber is provided with a plate magnetic body and a U-shaped magnetic body. Since the width of the plate magnetic body is smaller than the interval between the side walls of the U-shaped magnetic body, the plate magnetic body can be accommodated in the U-shaped magnetic body, with a clearance formed between the end portions of the plate magnetic body and the side walls of the U-shaped magnetic body. The impedance in the vicinity of the clearance is decreased, and the difference in impedance between the end portions and the middle portion of the electromagnetic noise absorber is decreased. Therefore, a variance in the electromagnetic noise eliminating effect with signal conductors of the flat cable is made small.

Abstract: An electronic component provided with a heat radiative ceramic plate that is protected from cracks. Such a heat radiative electronic component is composed of an electronic device, such as a semiconductor device with an integrated circuit built therein, having a heat radiative plate bonded on its upper surface. The heat radiative plate is formed by a ceramic plate coated with a resin layer. The ceramic plate is a 1 mm to 2 mm thick quadrangular plate prepared by sintering cordierite powder, which has a high emissivity of far-infrared rays. The resin layer entirely or partly covers the surface of the ceramic plate, thereby preventing the plate from breaking and/or chipping and scattering ceramic powder to the surrounding area.