Abstract: The present invention relates to an antenna device and, particularly, the antenna device comprises: a printed board assembly (hereinafter, referred to as “PBA”) having a plurality of antenna-related components mounted on one surface thereof, and having a plurality of filters mounted on the other surface thereof, an antenna board which is arranged to be stacked on one surface side of the PBA, and which has a plurality of antenna elements mounted on one surface thereof and connected to construct electrical signal lines with the filters in close contact with the other surface thereof, and clamshell units interposed between the other surface of the PBA and one surface of the filters to perform a signal shielding function, wherein the insides of the clamshell units include strip line connectors which absorb the assembly tolerance between the clamshell units while being partially deformed by means of the adhesion of the filters during close-coupling of the filters, and which shield a signal by means of ground surfa

Abstract: A PCB assembly is disclosed herein. An embodiment of the present disclosure provides a printed circuit board (PCB) assembly on which a plurality of devices is mounted, including: a power supply area disposed at one side of a main printed circuit board; a first area positioned in another direction of the main printed circuit board from the power supply area and including the plurality of devices; a second area positioned in another direction of the main printed circuit board from the first area and including the plurality of devices; a third area positioned in another direction of the main printed circuit board from the second area and including the plurality of devices; and a bridge printed circuit board receiving power from the power supply area and disposed vertically to the main printed circuit board, wherein the bridge printed circuit board crosses the first area, the second area, and the third area, and transmits power and a signal to at least one area.

Abstract: The present invention relates to an antenna device, and especially, comprises: a printed board assembly (PBA hereinafter) which has a plurality of antenna-related components mounted to one surface, and has a plurality of filters mounted to the other surface; and an antenna board which is stacked and disposed on the one surface side of the PBA, has a plurality of antenna elements mounted to one surface, and is connected to the filters tightly adhering to the other surface, so as to establish an electrical signal line with the filters, wherein the filters are spaced apart from the other surface of the PBA and have clamshell parts integrally formed so as to prevent a signal leakage from the electrical signal line, and thus an advantage is provided of enabling the improvement of the overall heat dissipation performance and filter performance of the filters.

Abstract: The present invention relates to a connector for preventing a characteristic impedance mismatch, the connector including a stationary module fixed, by soldering, to any one (hereinafter, referred to as a ‘first panel’) of two panels disposed in parallel with each other, the stationary module having therein an impedance matching space (hereinafter, referred to as a ‘matching space’), a moving module disposed to move to the inside or outside of the matching space of the stationary module and provided to be in contact with the other (hereinafter, referred to as a ‘second panel’) of the two panels, and an elastic member disposed in the matching space of the stationary module and configured to elastically support the moving module on the second panel, in which the elastic member, together with an external conductor part of the moving module, performs a function of blocking static electricity, which makes it possible to manufacture a product with a reduced size and prevent a characteristic impedance mismatch.

Abstract: An RF connector is disclosed herein.

Abstract: A heat dissipation apparatus and antenna assembly using the same is disclosed herein. According to an embodiment of the present disclosure, a heat dissipation apparatus configured to cool a circuit board including at least one heat generation element is provided, the heat dissipation apparatus including: a plate disposed to face the circuit board; a plurality of first heat dissipation fins disposed in a first direction on one surface of the plate spaced apart from the circuit board; and a blowing unit disposed to face the one surface of the plate, the blowing unit including at least one fan configured to discharge air toward the one surface of the plate, wherein a space between two adjacent first heat dissipation fins defines a side flow path configured to guide the air discharged from the at least one fan.

Abstract: The present invention relates to a connecting apparatus including a fixed terminal part having a hollow portion and fixed in a predetermined space between a first substrate, on which electrical components are mounted, and a second substrate disposed in parallel with the first substrate, one terminal part fixed to one end of the fixed terminal part and configured to be elastically supported on the first substrate, one terminal part being configured to slip and come into contact with an inner surface of the first substrate, and the other terminal part fixed to the other end of the fixed terminal part and configured to be elastically supported on the second substrate, the other terminal part being configured to slip and come into contact with an inner surface of the second substrate, in which one terminal part and the other terminal part are elastically supported by an elastic member installed in the hollow portion of the fixed terminal part and configured to be extended or contracted, thereby providing an advan

Abstract: The present invention relates to a cavity filter and a connecting structure included therein. The cavity filter includes: an RF signal connecting portion spaced apart, by a predetermined distance, from an outer member having an electrode pad provided on a surface thereof; and a terminal portion configured to electrically connect the electrode pad of the outer member and the RF signal connecting portion so as to absorb assembly tolerance existing at the predetermined distance and to prevent disconnection of the electric flow between the electrode pad and the RF signal connecting portion, wherein the terminal portion includes: a first side terminal contacted with the electrode pad; and a second side terminal having a housing space in which a part of the first side terminal is housed, and connected to the RF signal connecting portion, wherein the first side terminal is provided as an elastic deformable body whose part is radially widened or narrowed against an assembly force provided by an assembler.

Abstract: The present invention relates to a filter and a method of manufacturing the same, the filter including an RF connector configured to have a predetermined electrical signal line, a filter body having at least one impedance matching space in which the RF connector is installed, a relevant PCB on which one end of the RF connector is fixedly mounted, the relevant PCB coupled to be in close contact with one side surface of the filter body, and an annular gasket interposed between one side surface of the filter body and the relevant PCB to block a signal leak, in which a concave-convex portion is processed on a surface of one side surface of the filter body to which the annular gasket is attached to increase an attachment area, thereby providing an advantage of improving a bonding force of an attachment portion to which the gasket is attached.

Abstract: A dual-polarized antenna and a dual-polarized antenna assembly including the same are provided. A dual-polarized antenna includes a base board, feeding unit supported on the base board, and radiation plate supported on the feeding unit. The feeding unit includes a first and a second feeding boards arranged to cross each other on the base board. The first feeding board includes a first feed line configured to supply a first reference-phase signal to a first point on the radiation plate and supply a first antiphase signal having an antiphase relative to the first reference-phase signal to a second point on the radiation plate. The second feeding board includes a second feed line configured to supply a second reference-phase signal to a third point on the radiation plate and supply a second antiphase signal having an antiphase relative to the second reference-phase signal to a fourth point on the radiation plate.

Abstract: The present invention relates to a heat dissipation device for an electronic element, the heat dissipation device including a first chamber in which a printed circuit board having heating elements mounted thereon is disposed, a second chamber configured to exchange heat with heat transferred from the first chamber and configured such that an injection part configured to inject a refrigerant and a refrigerant supply part configured to supply the refrigerant to the injection part are disposed in the second chamber, a heat transfer part disposed between the first chamber and the second chamber and configured to receive heat from the heating elements of the first chamber and supply the heat to the second chamber, and a condensing part configured to condense the refrigerant injected into the second chamber, in which a plurality of evaporation-inducing ribs is provided on a surface of the heat transfer part exposed to the second chamber and allows the liquid refrigerant injected by the injection part to be adsorbed

Abstract: The present invention relates to a cavity filter including: an RF signal connecting portion spaced apart, by a predetermined distance, from an outer member having an electrode pad provided on a surface thereof; and a terminal portion configured to electrically connect the electrode pad of the outer member and the RF signal connecting portion so as to absorb assembly tolerance existing at the predetermined distance and to prevent disconnection of the electric flow between the electrode pad and the RF signal connecting portion, wherein a part of the terminal portion, positioned between the electrode pad and the RF signal connecting portion, is elastically deformed to absorb assembly tolerance existing in a terminal insertion port. Therefore, the cavity filter can efficiently absorb assembly tolerance which occurs through assembly design, and prevent disconnection of an electric flow, thereby preventing degradation in performance of an antenna device.

Abstract: Disclosed is a multi-band transmitter for transmitting a multi-band signal. The multi-band transmitter comprises: a pre-distortion unit including a first digital pre-distorter (DPD) which pre-distorts a first band signal and a second DPD which pre-distorts a second band signal discontinuous from the first band signal; a conversion unit which analog-converts the pre-distorted first band signal and the pre-distorted second band signal; an amplification unit including a first power amplifier (PA), which amplifies the analog-converted first band signal, and a second PA, which amplifies the analog-converted second band signal; and a feedback unit which digital-converts the amplified first band signal to feed the digital-converted first band signal back to the first DPD and digital-converts the amplified second band signal to feed the digital-converted second band signal back to the second DPD.

Abstract: The present invention relates to a cavity filter and a method of manufacturing the same, and particularly, to a cavity filter including one side cavity and the other side cavity required to have capacitive cross-coupling design, resonant bars respectively provided at centers of one side cavity and the other side cavity, and a vertical post for a notch extending from any one of the resonant bars and extending in a vertical direction in an inner wall that is a boundary between one side cavity and the other side cavity, in which the resonant bar, which is connected to the vertical post for a notch among the resonant bars, is integrated with the vertical post for a notch, thereby providing an advantage of easily manufacturing the cavity filter and easily performing capacitive cross-coupling design.

Abstract: The present invention relates to a cavity filter and, in particular, provides an advantage of preventing performance deterioration of an antenna device by efficiently absorbing an assembly tolerance which may occur due to assembly design and preventing an interruption of an electrical flow, by comprising: an RF signal connecting part provided to be spaced apart at a predetermined distance from an external member having an electrode pad formed on one surface thereof; a terminal part which electrically connects the electrode pad of the external member to the RF signal connecting part, while absorbing an assembly tolerance existing within the predetermined distance and simultaneously preventing an interruption of an electrical flow between the electrode pad and the RF signal connecting part; a dielectric body which is inserted into a terminal insertion hole so as to surround the outside of the terminal part; and an elastic member which has a portion of the edge supported by the dielectric body and which elastica

Abstract: Provided is an antenna device capable of ensuring an installation space for components related to an antenna and eliminating a dead zone of a signal transmitted or received by the antenna by tilting an antenna unit.

Abstract: Provided is a heat dissipating apparatus for electronic elements which has the minimum size but has improved heat dissipating performance. To this end, the heat dissipating apparatus for electronic elements, according to the present invention, comprises: a heat dissipating housing having an internal space; a shield case formed of a thermally conductive material, wherein the shield case is disposed in the heat dissipating housing and partitions the internal space into a first chamber which is a vacuum space to be filled with a refrigerant and a second chamber which is a non-vacuum space; and a printed circuit board which is disposed in the shield case and has a heat dissipating element. The shield case evaporates the refrigerant by using sensible heat transferred from the heat dissipating element to the shield case and latent heat transferred from the shield case to the first chamber.

Abstract: Disclosed is a frequency-division duplexing (FDD) type antenna device for implementing spatial-polarization separation of beams using a quad-polarized antenna module array. There is provided an antenna device including first radiating elements, second radiating elements, third radiating elements, and fourth radiating elements, a filter unit including first, second, third, and fourth filters that filter signals of first, second, third, and fourth signal paths, respectively, and a phase setting module configured to set phases of the filtered signals so that a first beam and a second beam radiated through the first and second radiating elements and the third and fourth radiating elements, respectively, are separated in space, wherein the first beam and the second beam have different polarization directions.

Abstract: The present invention relates to a cavity filter and a connecting structure included therein. The cavity filter includes: an RF signal connecting portion spaced apart, by a predetermined distance, from an outer member having an electrode pad provided on a surface thereof; and a terminal portion configured to electrically connect the electrode pad of the outer member and the RF signal connecting portion so as to absorb assembly tolerance existing at the predetermined distance and to prevent disconnection of the electric flow between the electrode pad and the RF signal connecting portion, wherein the terminal portion includes: a first side terminal contacted with the electrode pad; and a second side terminal having a housing space in which a part of the first side terminal is housed, and connected to the RF signal connecting portion, wherein the first side terminal is provided as an elastic deformable body whose part is radially widened or narrowed against an assembly force provided by an assembler.

Abstract: Provided is a cooling apparatus for an electronic element having improved heat dissipation performance while minimizing the size.