Abstract: The invention relates to a method for producing a multilayer structure comprising an organic barrier layer, adhesive layer and substrate, comprising the following steps (a) providing a carrier film, (b) wherein a major part of the surface of the carrier film is provided with a release agent chosen from (i) an organic release layer, which organic release layer has the capacity to effect a releasable bond from the surface of the carrier film and a non-releasable bond with the surface of an organic barrier layer to be applied on the release layer and/or (ii) a metal layer on the carrier film which adheres stronger to the carrier film than to the organic barrier layer, (c) providing an organic barrier layer on the release agent, (d) providing an adhesive layer on the organic barrier layer, and bonding the organic barrier layer with said adhesive to a substrate, and (e) stripping said carrier film from the multilayer structure.

Abstract: The invention relates to a process for preparing a composite layer, by applying an oligomeric organic compound layer on a substrate with a metal or metal oxide layer by vapour deposition, comprising the steps of (a) providing a substrate layer, (b) applying a metal or metal oxide layer under reduced pressure on said substrate, and (c) vapour depositing the oligomeric organic compound on the metal or metal oxide layer while the film remains at reduced pressure, wherein the oligomeric compound is evaporated from an oligomeric or polymeric compound comprising a stabiliser, or wherein the oligomeric compound is amorphous, or has a high solubility in certain solvents.