Patents Assigned to Knowles Elecronics, LLC
  • Microelectromechanical system assembly and method for manufacturing thereof
    Publication number: 20070215962
    Abstract: A microelectromechanical system (MEMS) assembly comprises a MEMS transducer, an integrated circuit (IC), and a substrate. The integrated circuit and the MEMS transducer are being electrically coupled to the substrate. The substrate may be a single layer or multiple layers. A coupling circuit resides in the substrate and may comprise a low pass filter (LPF) to provide a path to ground for undesirable co-propagating RF signals while allow direct current (DC) or low frequency signals to pass through the IC.
    Type: Application
    Filed: March 20, 2006
    Publication date: September 20, 2007
    Applicant: Knowles Elecronics, LLC
    Inventors: Anthony Minervini, Peter Loeppert, William Ryan