Abstract: A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to a device's printed circuit board and for making electrical connections between the microphone package and the device's circuit board. The surface mount microphone package has a cover, and the MEMS microphone die is substrate-mounted and acoustically coupled to an acoustic port provided in the surface mount package. The substrate and the cover are joined together to form the MEMS microphone, and the substrate and cover cooperate to form an acoustic chamber for the substrate-mounted MEMS microphone die.

Abstract: Systems and methods for voice authentication are provided. An example method starts with dynamically generating authentication information and a prompt associated therefor. The authentication information is generated to emphasize differences between an authorized user and others. The authentication information may be generated based on at least one of a user profile, an acoustic environment in which a mobile device is located, and a history of interactions with the mobile device. The authentication information may be an answer to a question which the authorized user would uniquely be able to provide, or it may be a distinctive password. The prompt, for the authentication information, is provided to a user attempting to use the mobile device. The method proceeds with capturing an acoustic sound of a speech of the user and detecting the authentication information in the speech. Based on the detection, a confidence score is determined.

Abstract: Systems, apparatuses, and methods for manufacturing a microelectromechanical system (MEMS) device. The MEMS device includes a substrate, a cap, a microelectromechanical component, and a tag. The cap is coupled to the substrate such that the substrate and the cap cooperatively define an interior cavity. One of the substrate or the cap defines a port. The microelectromechanical component is disposed within the interior cavity. The tag is coupled to the substrate and an exterior surface of the cap to secure the cap to the substrate.

Abstract: A microphone assembly includes an acoustic sensor configured to produce an electrical signal and an electrical circuit including a voice activity detector coupled to an output of the acoustic sensor. The microphone assembly further includes an internal clock signal generator and a host interface coupled to the electrical circuit. The host interface has external connections including an external clock signal and a data connection. The microphone assembly includes an acoustic activity detection mode of operation when the electrical circuit is clocked by the internal clock signal generator in the absence of an external clock signal at the host interface. The microphone assembly has a plurality of operating modes controlled by an external clock signal received in response to an interrupt signal provided by the electrical circuit. The electrical circuit is configured to provide data representing the electrical signal at the host interface when the external clock signal is received.

Abstract: Systems and methods for multiplying a sparse matrix by a vector using a single instruction multiple data (SIMD) architecture are provided. An example method includes sorting rows of the sparse matrix by a number of non-zero elements in the rows to generate sorted rows. The sorted rows are split to generate groups of the sorted rows. The number of rows in each group of the sorted rows is equal to the number of rows updated in parallel. The method allows for packing the sorted rows in each of the groups to generate packed rows. Each of the packed rows within the same group has the same length. Per clock cycle, C elements of the packed rows and data for selecting elements of the vector are provided to computational units in the SIMD architecture, where C is the number of computational units.

Abstract: A sensor device includes a substrate having a front surface and an opposing back surface. The back surface defines an indented region having an indented surface. The substrate defines a bottom port extending between the front surface and the indented surface. The sensor further includes a microelectromechanical systems (MEMS) transducer mounted on the front surface of the substrate over the bottom port. The sensor also includes a filtering material disposed on the indented surface and covering the bottom port. The filtering material provides resistance to ingression of solid particles or liquids into the sensor device. The filtering material is configured to provide high acoustic permittivity and have low impact on a signal-to-noise ratio of the sensor device.

Abstract: A microphone includes a base and a microelectromechanical system (MEMS) die and an integrated circuit (IC) disposed on the base. The microphone also includes a cover mounted on the base and covering the MEMS die and the IC. The cover includes an indented region or an inwardly drawn region that define a top port through which acoustic energy can enter the microphone and be incident on the MEMS die. The microphone also includes a filtering material disposed on the top port on an outside surface of the cover and within the indented region or the inwardly drawn region. The filtering material provides resistance to ingression of solid particles or liquids into the microphone.

Abstract: An acoustic apparatus includes a back plate, a diaphragm, and at least one pillar. The diaphragm and the back plate are disposed in spaced relation to each other. At least one pillar is configured to at least temporarily connect the back plate and the diaphragm across the distance. The diaphragm stiffness is increased as compared to a diaphragm stiffness in absence of the pillar. The at least one pillar provides a clamped boundary condition when the diaphragm is electrically biased and the clamped boundary is provided at locations where the diaphragm is supported by the at least one pillar.

Abstract: Systems and apparatuses for a MEMS device. The MEMS device includes a diaphragm and a backplate spaced a distance from the diaphragm forming an air gap therebetween. The backplate includes a first surface facing toward the diaphragm and an opposing second surface facing away from the diaphragm. The first surface and the opposing second surface of the backplate cooperatively define a plurality of through-holes that extend through the backplate allowing air from the air gap to flow therethrough. Each of the plurality of through-holes include a first aperture disposed along the first surface, a second aperture disposed along the opposing second surface, and a sidewall extending between the first surface and the opposing second surface. The first aperture and the second aperture have different dimensions.

Abstract: The disclosure relates to a microphone assembly including a multibit analog-to-digital converter configured to generate N-bit samples representative of a microphone signal. The microphone assembly also includes a first digital-to-digital converter configured to generate a corresponding M-bit digital signal based on N-bit digital samples, wherein N and M are positive integers and N>M. The microphone assembly may include a data interface configured to repeatedly receive samples of the M-bit digital signal and write bits of the M-bit digital signal to a data frame.

Abstract: A method for reducing noise within an acoustic signal includes receiving at least a primary acoustic signal from a primary microphone and a secondary acoustic signal from a different, secondary microphone, wherein the primary acoustic signal includes a speech component emanating from a user and a noise component. The method also includes measuring a first value of a first coefficient based on the primary and secondary signals and performing a noise cancellation process based on the measured first value of the first coefficient to produce a set of noise-cancelled primary sub-bands. The method also includes generating, by the processor, a set of multiplicative gain mask values, the multiplicative gain mask values having a frequency dependency that is based at least in part on a pre-indicated approximate sound pressure level of the speech component.

Abstract: A microphone assembly includes an acoustic transducer element configured to convert sound into a microphone signal in accordance with a transducer frequency response including a first highpass cut-off frequency. The microphone assembly additionally includes a processing circuit including a signal amplification path configured to receive, sample and digitize the microphone signal to provide a digital microphone signal. A frequency response of the signal amplification path includes a second highpass cut-off frequency which is higher than the first highpass cut-off frequency of the acoustic transducer element.

Abstract: Systems and methods for stereo separation and directional suppression are provided. An example method includes receiving a first audio signal, representing sound captured by a first microphone associated with a first location, and a second audio signal, representing sound captured by a second microphone associated with a second location. The microphones comprise omni-directional microphones. The distance between the first and second microphones is limited by the size of a mobile device. A first channel signal of a stereo signal is generated by forming, based on the first and second audio signals, a first beam at the first location. A second channel signal of the stereo signal is generated by forming, based on the first and second audio signals, a second beam at the second location. First and second directions, associated respectively with the first and second beams, are fixed relative to a line between the first and second locations.

Abstract: A microphone device comprises a microphone die including a microphone motor, an acoustic integrated circuit structured to process signals produced by the microphone motor, and a sensor die stacked on top of the acoustic integrated circuit, wherein the sensor die comprises a pressure sensor. Another microphone comprises a microphone die including a microphone motor and an integrated circuit die. The integrated circuit die comprises an acoustic integrated circuit structured to process signals produced by the microphone motor, a pressure sensor, and a pressure integrated circuit structured to press signals produced by the pressure sensor.

Abstract: A micro electro mechanical system (MEMS) microphone includes a base including a port extending through the base, a shim assembly, an ingress protection element, and a MEMS device. The shim assembly is disposed on the base and over the port. The shim assembly has a plurality of walls that form a hollow interior cavity. The shim assembly also has a top surface and a bottom surface coupled to the base. The ingress protection element extends over and is coupled to the top of the shim assembly to enclose the cavity of the shim assembly. The shim assembly elevates the ingress protection element above the base and is effective to prevent the passage of contaminants there through. The MEMS device includes a diaphragm and a back plate and is disposed over the ingress protection element.

Abstract: An audio system includes an array of microphones and an audio processing system. The array of microphones includes a plurality of microphones configured to record a plurality of sound signals based on sound waves emanating from a sound source. The audio processing system includes a direction of arrival (DOA) estimator configured to generate an estimation of a DOA of the sound waves emanating from the sound source based on the plurality of sound signals, a statistical subset selector configured to select a subset of the plurality of microphones based on the estimation of the DOA, and a spatial filter configured to modify and combine a set of sound signals associated with the selected subset of the plurality of microphones to produce an audio output associated with the sound source.

Abstract: An integrated circuit includes a first amplifier and a second amplifier. A first impedance matching circuit is coupled to the first amplifier, a first charge pump, and a single MEMS transducer. A second impedance matching circuit is coupled to the second amplifier, a second charge pump, and to the single MEMS transducer. A first capacitive load as measured at an input of first amplifier, and a second capacitive load as measured at an input of the second amplifier exist. The first capacitive load and the second capacitive load are balanced with respect to each other. A single pressure change causes the single MEMS transducer to create a first electrical signal and a second electrical signal. Both the first electrical signal and the second electrical signal are matched or approximately matched in magnitude, and 180 degrees or approximately 180 degrees out of phase with respect to each other.

Abstract: A digital microphone device includes circuitry that can reduce the risk of noise caused due to an idle tone frequency component in a digital signal output by the digital microphone device. In stereo mode and other applications where interference occurs between two or more such microphones, each microphone device includes a digital output having a corresponding idle tone frequency, one of which is offset to shift noise components outside of a desired frequency range.

Abstract: Systems, apparatuses, and methods for manufacturing a microelectromechanical system (MEMS) device. The MEMS device includes a substrate, a cap, a microelectromechanical component, and a tag. The substrate defines a port. The cap is coupled to the substrate. The substrate and the cap cooperatively define an interior cavity. The microelectromechanical component is disposed within the interior cavity and coupled to the substrate such that the microelectromechanical component is positioned over the port to at least partially isolate the port from the interior cavity. The tag is coupled to the substrate and the cap. The tag is positioned to secure the cap to the substrate.

Abstract: A microphone includes a microelectromechanical system (MEMS) die configured to sense an acoustic signal, a base, and a lid. The base has a top surface and a bottom surface. The bottom surface includes a first electrical pad and a second electrical pad. The first electrical pad and the second electrical pad are configured to transmit an electrical signal indicative of the acoustic signal. The lid has a top surface and a bottom surface. The lid includes a cavity that surrounds the MEMS die. The top surface of the lid includes a third electrical pad and a fourth electrical pad. The first electrical pad and the third electrical pad are electrically connected, and the second electrical pad and the fourth electrical pad are electrically connected.