Abstract: To provide a chip inductor, which can make magnetic loss of the inductor element reduced, excellent in electrical property such as high Q etc., and high reliability, which is demanded for use in vehicles. The chip inductor comprises a ferrite core (11) comprising an axial section (11a), flange portions (11b) disposed at both ends of the axial section, and concavities (11c) opened for direction of the axial section on at least one face of the flange section; an internal electrode (13) consisting of metallic plate having a notch portion at axial section side, the internal electrode fixed on the upper face of the flange section having the concavity; and a winding (12) wound around the axial section of the ferrite core; wherein an end portion of the winding (12a) comes in contact to a side of the concavity, which faces to the axial section, comes in contact to the notch portion of the internal electrode, and is fixed on upper face of the internal electrode.

Abstract: The resistor device is provided with a resistive plate (11) of metal plate material, which is used as a resistance body; a radiative plate (15) of metal plate material, which is spaced from the resistive plate and intercrossed on the resistive plate; a molded resin body (19), which encloses an intercrossing portion of the resistive plate and the radiative plate; terminal portions of the resistive plate (11a), which comprises so that both ends of the resistive plate extending from the molded resin body are bent along an end face and a bottom face of the molded resin body; and terminal portions of the radiative plate (15a), which comprises so that both ends of the radiative plate extending from the molded resin body are bent along an end face and a bottom face of the molded resin body. Accordingly, the surface-mountable resin-sealed metal plate resistor device is enabled to increase the power capacity drastically and to improve the reliability without changing most of the size.

Abstract: The chip resistor 10 includes a ceramic substrate 11 that is shaped like a rectangular parallelepiped. Mounted on the lower surface of the ceramic substrate 11 are a resistive element 12 that is made mainly of a low-resistance, low-TCR copper-nickel alloy, first and second electrode layers 13, 14 that form a two-layer structure and cover both longitudinal ends of the resistive element 12, and an insulating protective layer 15 for covering the remaining area of the resistive element 12. The resistive element 12 is positioned within a region inside the peripheral border of the lower surface of the ceramic substrate 11. The chip resistor 10 also includes end-face electrodes 17 that are positioned on both longitudinal end faces of the ceramic substrate 11. The second electrode layers 14 and end-face electrodes 17 are covered by plating layers 18-21. This chip resistor 10 is to be face-down mounted with both electrode layers 13, 14 positioned on a wiring pattern 31 of a circuit board 30.

Abstract: Disclosed is a chip resistor 1 that includes a ceramic substrate 2, a pair of bank-raising foundation sections 3 positioned on both longitudinal ends of the lower surface of the ceramic substrate 2, a pair of first electrode layers 4 that cover at least parts of the bank-raising foundation sections 3 and are positioned at a predetermined distance from each other, a resistive element 5 that is made mainly of a copper-nickel alloy to bridge the first electrode layers 4, a pair of second electrode layers 6 that cover the pair of first electrode layers 4, and an insulating protective layer 7 that covers the resistive element 5. Further, end-face electrodes 9 are positioned on both longitudinal end faces of the ceramic substrate 2. The second electrode layers 6 and end-face electrodes 9 are covered with plating layers 10-13. This chip resistor 1 is to be face-down mounted with the first and second electrodes 4, 6 positioned on a wiring pattern 21 of a circuit board 20.

Abstract: An LED driving circuit is provided for making it possible to economically drive a serially connected LED circuit by means of a switching device with a relatively low withstanding voltage even if the number of serially connected LED devices increases. In an LED driving circuit provided with a serially connected LED circuit (11) in which many LED devices are serially connected and a switching device (13) serially connected with the serially connected LED circuit (11) to control that an electrical current flowing through the serially connected LED circuit (11) is turned on or off, wherein a circuit device (15), which comprises a resistor, a constant voltage diode, a constant current diode, or the like, is connected in parallel with the switching device to make a minute current flow through the serially connected LED circuit (11) to the extent that the LED devices are not turned on when the switching device is turned off.

Abstract: [Problem] To provide a chip resistor and a method for manufacturing thereof, the chip resistor keeping easily soldering strength even if mounted in a horizontal position, and never projects from a holding recess of a positioning jig in a mounting process, and further does not hinder miniaturization thereof from being promoted, while keeping a good appearance thereof. [Means of Solution] In manufacturing a chip resistor 10, front-face electrodes 12 and resisters 13 are formed on the front face 20a of a large size substrate 20, and rear-face electrodes 16 are formed on the rear face 20b of the large size substrate 20. When the rear-face electrodes are formed, the rear-face electrodes 16 are extended to inclined faces of V-shaped grooves of second dividing grooves 22 on the rear face 20b and these extended parts are made to be side-face electrodes 16a.

Abstract: Provided is a method of manufacturing an electronic part in which a circuit element (3) is formed on a surface of a ceramic substrate (1) and conductive balls (2) are used as terminals of the electronic part. After the ceramic substrate (1) and the conductive balls (2) are fixed, the ceramic substrate (1) is appropriately divided. For this, the manufacturing method includes: a first step of forming the circuit element(s) (3) on the surface of a large ceramic substrate (1) including division grooves (4) longitudinally and laterally provided on the surface thereof; a second step of fixing the conductive balls (2) to terminal portion of the circuit element(s) (3); and a third step of applying stress to the large ceramic substrate (1) to open the division grooves (4), to divide the substrate (1), and the first, second, and third steps are performed in the stated order.

Abstract: The present invention provides a surface mount composite electronic component which can be made compact. The structure of the surface mount composite electronic component is one in which a circuit element is formed on each of a set of opposing surfaces of an insulating substrate composed of a hexahedron, with electrodes that make up the circuit elements also functioning as external terminals. For example, a pair of first electrodes disposed on both ends of a front surface of the insulating substrate composed of a hexahedron, a pair of second electrodes disposed on a rear surface of the insulating substrate opposite the first electrodes, a first resistor disposed so as to contact both of the first pair of electrodes, and a second resistor disposed so as to contact both of the second electrodes.

Abstract: To provide a glazed metal film resistor device excellent in TCR characteristics with using an economical base body containing glass by reducing affection to TCR characteristics caused by glass contained in the base body. The resistor device comprises base body 11 containing glass, first protective film 12, which does not contain glass, formed on a surface of base body 11, and thick film resistor 13 formed on first protective film 12. By forming first protective film 12 on a surface of base body 11 containing glass and insulating base body 11 containing glass against thick film resistor 13 of ruthenium oxide as primary component, affection of glass contained in base body 11 to thick film resistor 13 of ruthenium oxide can be suppressed, and change of TCR value from original value of thick film resistor itself can be suppressed.

Abstract: [Problem] To provide a chip resistor that is unlikely to suffer from mounting failure and capable of readily lowering its resistance. [Solution] Disclosed is a chip resistor 1 that includes a ceramic substrate 2, a pair of bank-raising foundation sections 3 positioned on both longitudinal ends of the lower surface of the ceramic substrate 2, a pair of first electrode layers 4 that cover at least parts of the bank-raising foundation sections 3 and are positioned at a predetermined distance from each other, a resistive element 5 that is made mainly of a copper-nickel alloy to bridge the first electrode layers 4, a pair of second electrode layers 6 that cover the pair of first electrode layers 4, and an insulating protective layer 7 that covers the resistive element 5. Further, end-face electrodes 9 are positioned on both longitudinal end faces of the ceramic substrate 2. The second electrode layers 6 and end-face electrodes 9 are covered with plating layers 10-13.

Abstract: [Problem] To provide a chip resistor that readily lowers its resistance and exhibits excellent manufacturing yield. [Solution] The chip resistor 10 includes a ceramic substrate 11 that is shaped like a rectangular parallelepiped. Mounted on the lower surface of the ceramic substrate 11 are a resistive element 12 that is made mainly of a low-resistance, low-TCR copper-nickel alloy, first and second electrode layers 13, 14 that form a two-layer structure and cover both longitudinal ends of the resistive element 12, and an insulating protective layer 15 for covering the remaining area of the resistive element 12. The resistive element 12 is positioned within a region inside the peripheral border of the lower surface of the ceramic substrate 11. The chip resistor 10 also includes end-face electrodes 17 that are positioned on both longitudinal end faces of the ceramic substrate 11. The second electrode layers 14 and end-face electrodes 17 are covered by plating layers 18-21.

Abstract: A thick film circuit component has a thick film electrode interconnect which allows an electrode on a semiconductor chip and an aluminum wire to be directly bonded to each other with a sufficient bonding strength. The thick film circuit component has an insulated substrate 11 and a thick film electrode interconnect 12 disposed on the substrate. The thick film electrode interconnect 12 includes a bonding area for an aluminum wire, the bonding area comprising an Ag-Pt thick film 12a disposed as a lower layer and an Ag-Pd thick film 12b disposed as an upper layer. The bonding area comprises the Ag-Pt thick film 12a and the Ag-Pd thick film 12b, which are fused together.

Abstract: A resistive element in the form of a bent metal plate is placed in a box-shaped case and has electrodes exposed out of the box-shaped case. A heat radiator in the form of a bent metal plate is also placed in the box-shaped case and has heat radiating electrodes exposed out of the box-shaped case. The resistive element and the heat radiator are held out of contact with each other and disposed in criss-cross relation to each other. The box-shaped case is filled with a cement material in surrounding relation to the resistive element and the heat radiator.

Abstract: A resistive element in the form of a bent metal plate is placed in a box-shaped case and has electrodes exposed out of the box-shaped case. A heat radiator in the form of a bent metal plate is also placed in the box-shaped case and has heat radiating electrodes exposed out of the box-shaped case. The resistive element and the heat radiator are held out of contact with each other and disposed in criss-cross relation to each other. The box-shaped case is filled with a cement material in surrounding relation to the resistive element and the heat radiator.

Abstract: A mounting structure for current detection resistor device has a feature that voltage detection terminal wiring is configured so as to extend along a current path in the resistor body first, and then, to bend at right angles to the current path, while maintaining electrical isolation from a resistor body of the current detection resistor device. The voltage detection terminal wiring connecting to the voltage detection terminals on the circuit board is disposed to extend for some distance in the same direction as the current path so as to cause mutual-inductance between that section of the voltage detection terminal wiring and the resistor body. This causes cancellation of induced voltage caused by the self-inductance of the resistor body, so that it is possible to nullify detection error generated by the voltage induced by the resistor body from the viewpoint of the measuring system.

Abstract: A metal plate resistor includes a resistive body comprising a metal plate, and at least a pair of electrodes joined respectively to opposite ends of the resistive body, the electrodes being made of a highly conductive metal conductor. The resistive body has a main section positioned between the electrodes and a pair of electrode sections progressively wider than the main section in directions away from the main section. The electrodes are disposed respectively beneath the electrode sections and identical in shape to the electrode sections.

Abstract: The low resistance value resistor 11 has two electrodes 12,13 of metal strips having a high electrical conductivity. The metal strips are affixed on the resistor body by means of rolling and/or thermal diffusion bonding. A fused solder layer is formed on a surface of each electrode comprised by the metal strip. Thus, sufficient bonding strength and superior current distribution in the resistor body is obtained. Further, a portion of the resistor body is trimmed by removing a portion of the body material along a direction of current flow between the electrodes to adjust a resistance value. Thus, a precise resistor value and superior characteristics of temperature coefficient of resistance (TCR) can be obtained.

Abstract: A metal plate resistor includes a resistive body comprising a metal plate, and at least a pair of electrodes joined respectively to opposite ends of the resistive body, the electrodes being made of a highly conductive metal conductor. The resistive body has a main section positioned between the electrodes and a pair of electrode sections progressively wider than the main section in directions away from the main section. The electrodes are disposed respectively beneath the electrode sections and identical in shape to the electrode sections.