Patents Assigned to Kobe Leadmikk Co., Ltd.
  • Method for forming plating film
    Patent number: 7087315
    Abstract: A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining the object to be plated at a second current density lower than the first current density. According to the present invention, it is possible to improve solderability of a plating film for conventional lead-free solder by a simple method, which allows the productivity to further enhanced, resulting in a plating film with reduced production costs.
    Type: Grant
    Filed: September 21, 2004
    Date of Patent: August 8, 2006
    Assignees: Sharp Kabushiki Kaisha, Kobe Leadmikk Co., Ltd.
    Inventors: Yoshihiko Matsuo, Ryukichi Ikeda, Kimihiko Yoshida, Fumio Okuda
  • METHOD FOR FORMING PLATING FILM
    Publication number: 20050042868
    Abstract: A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining the object to be plated at a second current density lower than the first current density. According to the present invention, it is possible to improve solderability of a plating film for conventional lead-free solder by a simple method, which allows the productivity to further enhanced, resulting in a plating film with reduced production costs.
    Type: Application
    Filed: September 21, 2004
    Publication date: February 24, 2005
    Applicants: Sharp Kabushiki Kaisha, Kobe Leadmikk Co., LTD
    Inventors: Yoshihiko Matsuo, Ryukichi Ikeda, Kimihiko Yoshida, Fumio Okuda
  • Method for forming plating film and electronic component having plating film formed theron by same method
    Patent number: 6811672
    Abstract: A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining the object to be plated at a second current density lower than the first current density. According to the present invention, it is possible to improve solderability of a plating film for conventional lead-free solder by a simple method, which allows the productivity to further enhanced, resulting in a plating film with reduced production costs.
    Type: Grant
    Filed: June 25, 2002
    Date of Patent: November 2, 2004
    Assignees: Sharp Kabushiki Kaisha, Kobe Leadmikk Co., Ltd.
    Inventors: Yoshihiko Matsuo, Ryukichi Ikeda, Kimihiko Yoshida, Fumio Okuda