Abstract: A small test piece polishing apparatus is provided which is less likely to bend or damage a small test piece, which is superior in working efficiency, and which ensures uniform quality for the small test pieces produced. The small test piece polishing apparatus 1 for polishing a surface of a small test piece 3 having a circular cross section using a string-type member 13 includes string-type member delivery/recovery means 10, abrasive applying means 20, holding/rotating means 30, and pressing/scanning means 40. The abrasive applying means 20 applies an abrasive to the string-type member delivered by the string-type member delivery/recovery means 10. Thereafter, the pressing/scanning means 40 presses the string-type member 13 applied with the abrasive against the small test piece 3 held and rotated by the holding/rotating means 30 to perform scanning, to thereby polish the small test piece 3.
Type:
Grant
Filed:
August 24, 2007
Date of Patent:
June 5, 2012
Assignee:
Kobe Material Testing Laboratory Co., Ltd.
Abstract: A material piece scooping device, which extracts a material piece from a surface of an object to be scooped by cutting electric discharges between an electric discharge electrode and the object to be scooped, includes a rotation drive section 40, an arm portion 30 driven by the rotation drive section to rotate around a rotational axis X, an electrode holder 20 supported by the arm portion, and an electric discharge electrode 10 detachably mounted on the electrode holder. A sliding section for sliding the arm portion in a direction perpendicular to the rotational axis and an arm length adjusting section for adjusting a length of the arm portion from the rotational axis thereof are provided, so as to adjust a trajectory of the electric discharge electrode as the arm portion rotates. The material piece can be scooped from the object along a line of the trajectory gnawing into the object.
Type:
Grant
Filed:
March 14, 2006
Date of Patent:
May 31, 2011
Assignees:
Minatogawa Kinzoku Test Piece Manufacturing Co., Ltd., Kobe Material Testing Laboratory Co., Ltd, Kyushu Electric Power Co., Inc.
Abstract: A small test piece polishing apparatus is provided which is less likely to bend or damage a small test piece, which is superior in working efficiency, and which ensures uniform quality for the small test pieces produced. The small test piece polishing apparatus 1 for polishing a surface of a small test piece 3 having a circular cross section using a string-type member 13 includes string-type member delivery/recovery means 10, abrasive applying means 20, holding/rotating means 30, and pressing/scanning means 40. The abrasive applying means 20 applies an abrasive to the string-type member delivered by the string-type member delivery/recovery means 10. Thereafter, the pressing/scanning means 40 presses the string-type member 13 applied with the abrasive against the small test piece 3 held and rotated by the holding/rotating means 30 to perform scanning, to thereby polish the small test piece 3.
Type:
Application
Filed:
August 24, 2007
Publication date:
April 8, 2010
Applicant:
Kobe Material Testing Laboratory Co. Ltd