Patents Assigned to KOHMIX Co., Ltd.
  • Water-soluble, film-forming inorganic compounds, fireproof and fire-resistance composites and fire-resistance, flexible, sheet composite covering materials formed by the use of the compounds, and fire-resistance-covering process
    Patent number: 5368950
    Abstract: Water-soluble film-forming inorganic compounds having a specific gravity of 1.1 or more and capable of being formed into a film at ordinary temperature or by heating. The compounds are formed by a reaction of a metal, a hydroxide of an alkali metal, and hydrofluoric acid or boric acid and their salts or their submineral acid salts. The water-soluble film-forming inorganic compounds are superior in refractory, heat-resistant and heat-insulating properties, also have rust-inhibitory properties. The compounds are useful as heat-resistant adhesives in fireproof and heat-resistant layered composites made of metal, wood, and the like. A process of coating materials with a layer of these compounds is also provided.
    Type: Grant
    Filed: May 25, 1993
    Date of Patent: November 29, 1994
    Assignee: Kohmix Co., Ltd.
    Inventors: Naoto Kokuta, Kenji Kokuta, Katsuhiro Kokuta, Hiroshi Kokuta
  • Fireproof or refractory materials containing fire-resistant, water soluble, film-forming inorganic compounds
    Patent number: 5234631
    Abstract: Water-soluble film-forming inorganic compounds having a specific gravity of 1.1 or more and capable of being formed into a film at ordinary temperature or by heating. The compounds are formed by a reaction of a metal, a hydroxide of an alkali metal, and hydrofluoric acid or boric acid and their salts or their submineral acid salts. The water-soluble film-forming inorganic compounds are superior in refractory, heat-resistant and heat-insulating properties, also have rust-inhibitory properties. The compounds are useful as heat-resistant adhesives in fireproof and heat-resistant layered composites made of metal, wood, and the like. A process of coating materials with a layer of these compounds is also provided.
    Type: Grant
    Filed: April 30, 1991
    Date of Patent: August 10, 1993
    Assignee: Kohmix Co., Ltd.
    Inventors: Naoto Kokuta, Kenji Kokuta, Katsuhiro Kokuta, Hiroshi Kokuta
  • Water-soluble, film-forming inorganic compounds, fireproof and fire-resistant composites and fire-resistant, flexible, sheet composite covering materials formed by the use of the compounds, and process for preparing fire-resistant coverings
    Patent number: 5049316
    Abstract: Water-soluble film-forming inorganic compounds having a specific gravity of 1.1 or more and capable of being formed into a film at ordinary temperature or by heating. The compounds are formed by a reaction of a metal, a hydroxide of an alkali metal, and hydrofluoric acid or boric acid and their salts or their submineral acid salts. The water-soluble film-forming inorganic compounds are superior in refractory, heat-resistant and heat-insulating properties, also have rust-inhibitory properties. The compounds are useful as heat-resistant adhesives in fireproof and heat-resistant layered composites made of metal, wood, and the like. A process of coating materials with a layer of these compounds is also provided.
    Type: Grant
    Filed: June 12, 1989
    Date of Patent: September 17, 1991
    Assignee: KOHMIX Co., Ltd.
    Inventors: Naoto Kokuta, Kenji Kokuta, Katsuhiro Kokuta, Hiroshi Kokuta