Abstract: A capacitive micromachined ultrasound transducer (cMUT) is provided. The cMUT has a first layer having a first electrode and a second layer having a second electrode opposing the first electrode to define a gap width therebetween. At least one of the first layer and the second layer includes a flexible layer having a contact area in contact to a support, such that the first electrode and the second electrode are movable relative to each other to cause a change of the gap width. The support has two substantially continuous shoulder sides each extending along with the flexible layer, each shoulder side making graduated contact with more contact area of the flexible layer as the flexible layer deforms toward the shoulder side, causing the flexible layer to have a dynamically changing spring strength.

Abstract: In some examples, a capacitive micromachined ultrasonic transducer (CMUT) apparatus includes one or more CMUTs formed on a CMUT substrate to have an operational direction facing away from the CMUT substrate. A first layer of a first material is disposed over the one or more CMUTs for passing acoustic energy to or from the one or more CMUTs in the operational direction. The first layer may be a solid, liquid, gel, or colloid. Further, a second layer of a second material may be disposed over the first layer and may be a different material from the first material. In some cases, the second layer may be a solid with an inner surface having a curvature facing the first layer. Additionally, or alternatively, in some cases, the acoustic impedance of the first material and the second material may be between 1 and 2 MRayl.

Abstract: A method for a capacitive micromachined ultrasound transducer (cMUT) is provided. The method grows and patterns a diffusion barrier layer over a surface of a base layer. The diffusion barrier layer have different areas that allow different levels of diffusion penetration. A diffusion process is performed over the diffusion barrier layer such that a diffusion reactivated material reaches different depths into the base layer below the different areas. A anchor is formed using the diffusion reactivated material. The anchor has a lower portion below a major surface of the base layer and an upper portion above the major surface of the base layer. A cover layer is placed over the anchor and the base layer. At least one of the cover layer and the base layer includes a flexible layer, such that the cMUT electrodes are movable relative to each other to cause a change of the gap width.

Abstract: In some examples, a capacitive micromachined ultrasonic transducer (CMUT) apparatus includes one or more CMUTs formed on a CMUT substrate to have an operational direction facing away from the CMUT substrate. As one example, the one or more CMUTs may include a plurality of CMUT cells arranged in groups to form CMUT elements, and a plurality of the CMUT elements may be configured as an array on the CMUT substrate. An acoustic window is disposed over the one or more CMUTs and may contact an external medium. For instance, the acoustic window may be positioned to pass acoustic energy to or from the one or more CMUTs in the operational direction. A coupling medium may be disposed between the CMUTs and the acoustic window to couple acoustic energy between the one or more CMUTs and the acoustic window.

Abstract: A method as disclosed makes a capacitive micromachined ultrasonic transducer (cMUT). The method forms a pattern of standing features on a substrate to serve as support walls in the cMUT being made, and further makes a patterned trench from the front side into the substrate at selected locations where separation boundaries of neighboring elements of the cMUT are located. In the process of completing the transducer elements of the cMUT, the method forms a covering layer over the patterned trench to at least temporarily cover the patterned trench. The covering layer seals the patterned trench to prevent other materials from entering during at least a part of the fabrication process.

Abstract: Ultrasonic scanners and methods of manufacturing ultrasonic scanners. One embodiment of a method includes integrating a flexible electronic device (e.g. an IC) and a flexible ultrasonic transducer (e.g. a portion of a circular CMUT array) with a flexible member. The IC, the transducer, and the flexible member can form a flexible subassembly which is rolled up to form an ultrasonic scanner. The integration of the IC and the transducer can occur at the same time. In the alternative, the integration of the electronic device can occur before the integration of the transducer. Moreover, the integration of the transducer can include using a semiconductor technique. Furthermore, the rolled up subassembly can form a lumen or can be attached to a lumen. The method can include folding a portion of the flexible subassembly to form a forward looking transducer. The flexible member of some subassemblies can include a pair of arms.

Abstract: A capacitive micromachined ultrasound transducer (cMUT) and fabrication method of the same are provided. The cMUT has a substrate, a curved membrane disposed on top of the substrate, and a flexible membrane disposed on top of the curved membrane. The curved membrane has a raised portion which is higher than a recessed portion relative to the substrate, and is supported by a support standing on a major surface of the substrate. The flexible membrane includes a first region mounted to the raised portion of the curved membrane, and a second region extending over the recessed portion of the curved member. Methods for fabricating the cMUT are also disclosed.

Abstract: A through-wafer interconnect and a method for fabricating the same are disclosed. The method starts with a conductive wafer to form a patterned trench by removing material of the conductive wafer. The patterned trench extends in depth from the front side to the backside of the wafer, and has an annular opening generally dividing the conductive wafer into an inner portion and an outer portion whereby the inner portion of the conductive wafer is insulated from the outer portion and serves as a through-wafer conductor. A dielectric material is formed or added into the patterned trench mechanical to support and electrically insulate the through-wafer conductor. Multiple conductors can be formed in an array.

Abstract: In some implementations, a capacitive micromachined ultrasonic transducer (CMUT) apparatus includes one or more CMUTs or CMUT arrays, an acoustic window, a coupling medium, and a packaging substrate. The acoustic window may have various configurations, such as for reducing acoustic reflectance or increasing mechanical properties. In some examples, at least one of the CMUTs, the acoustic window or the coupling medium may include a focusing capability for focusing acoustic energy to or from the CMUT.

Abstract: An electrostatic actuator/transducer has a comb driver and can be adapted for a variety of applications, particularly as a capacitive micromachined ultrasonic transducer. The comb driver has two electrodes each connected to a set of comb fingers. The two sets of comb fingers interdigitate with each other, and in one embodiment each has a saw-toothed shape. One electrode is connected to a spring structure and movable along a vertical direction to engage and disengage the two sets of comb fingers. The movable portion is adapted to perform an actuation function and/or a sense of function. Fabrication methods for making the electrostatic actuator/transducer are also disclosed.

Abstract: A capacitive micromachined ultrasound transducer (cMUT) is provided. The cMUT has a first layer having a first electrode and a second layer having a second electrode opposing the first electrode to define a gap width therebetween. At least one of the first layer and the second layer includes a flexible layer having a contact area in contact to a support, such that the first electrode and the second electrode are movable relative to each other to cause a change of the gap width. The support has two substantially continuous shoulder sides each extending along with the flexible layer, each shoulder side making graduated contact with more contact area of the flexible layer as the flexible layer deforms toward the shoulder side, causing the flexible layer to have a dynamically changing spring strength.

Abstract: A capacitive micromachined ultrasound transducer (cMUT) and fabrication method of the same are provided. The cMUT has a substrate, a curved membrane disposed on top of the substrate, and a flexible membrane disposed on top of the curved membrane. The curved membrane has a raised portion which is higher than a recessed portion relative to the substrate, and is supported by a support standing on a major surface of the substrate. The flexible membrane includes a first region mounted to the raised portion of the curved membrane, and a second region extending over the recessed portion of the curved member. Methods for fabricating the cMUT are also disclosed.

Abstract: A method for a capacitive micromachined ultrasound transducer (cMUT) is provided. The method grows and patterns a diffusion barrier layer over a surface of a base layer. The diffusion barrier layer have different areas that allow different levels of diffusion penetration. A diffusion process is performed over the diffusion barrier layer such that a diffusion reactivated material reaches different depths into the base layer below the different areas. A anchor is formed using the diffusion reactivated material. The anchor has a lower portion below a major surface of the base layer and an upper portion above the major surface of the base layer. A cover layer is placed over the anchor and the base layer. At least one of the cover layer and the base layer includes a flexible layer, such that the cMUT electrodes are movable relative to each other to cause a change of the gap width.

Abstract: A micro-electro-mechanical transducer (such as a cMUT) having a non-flat surface is disclosed. The non-flat surface may include a variable curve or slope in an area where a spring layer contacts a support, thus making a variable spring model as the spring layer vibrates. The non-flat surface may be that of a non-flat electrode optimized to compensate the dynamic deformation of the other electrode during operation and thus enhance the uniformity of the dynamic electrode gap during operation. Methods for fabricating the micro-electro-mechanical transducer are also disclosed. The methods may be used in both conventional membrane-based cMUTs and cMUTs having embedded springs transporting a rigid top plate.

Abstract: Some examples include at least one capacitive micro-electro-mechanical transducer (cMUT). For instance, the cMUT may include a substrate, a plate, and a resilient structure therebetween. In some examples, an integrated circuit may be formed on or integrated with the plate or other portion of the cMUT. Furthermore, in some examples, two cMUTs may be arranged in a stacked configuration. For instance, one cMUT may be operable for transmission, while a second cMUT may be operable for reception.

Abstract: A curved or bendable micro-electro-mechanical transducer (such as the cMUT) is disclosed. The transducer has a plurality of transducer elements built on a substrate. The substrate has a slot below every two neighboring device elements. Each slot is at least at least partially filled with a flexible material to allow bending of the substrate. A bending actuator may be included to facilitate the bending of the substrate. An exemplary bending actuator uses a nonuniformly shrinkable material to bend the substrate. A curved or bendable cMUT of the present invention can be configured to be an intravascular ultrasound (IVUS) device.

Abstract: Embodiments of a method for packaging cMUT arrays allow packaging multiple cMUT arrays on the same packaging substrate introduced over a side of the cMUT arrays. The packaging substrate is a dielectric layer on which openings are patterned for depositing a conductive layer to connect a cMUT array to VO pads interfacing with external devices. Auxiliary system components may be packaged together with the cMUT arrays. Multiple cMUT arrays and optionally multiple auxiliary system components can be held in place by a larger support structure for batch production. The support structure can be made of an arbitrary size using inexpensive materials.

Abstract: A micro-electro-mechanical transducer (such as a cMUT) having two electrodes separated by an insulator with an insulation extension is disclosed. The two electrodes define a transducing gap therebetween. The insulator has an insulating support disposed generally between the two electrodes and an insulation extension extending into at least one of two electrodes to increase the effective insulation without having to increase the transducing gap. Methods for fabricating the micro-electro-mechanical transducer are also disclosed. The methods may be used in both conventional membrane-based cMUTs and cMUTs having embedded springs transporting a rigid top plate.

Abstract: Implementations of a cMUT have a telemetric antenna operative to telemetrically transmit an output signal generated by the cMUT in reception mode (RX). The cMUT generates the output signal by converting a received energy applied on the cMUT. The received energy may be an acoustic wave or a low-frequency pressure signal. The acoustic wave may be generated by a separate acoustic energy source. The cMUT may form a modulated signal using a carrier signal modulated with the output signal, and telemetrically transmit the modulated signal carrying the output signal to increase efficiency. The antenna may also receive an input signal from outside to telemetrically power on the cMUT.

Abstract: In some implementations, a capacitive micromachined ultrasonic transducer (CMUT) apparatus includes one or more CMUTs or CMUT arrays, an acoustic window, a coupling medium, and a packaging substrate. The acoustic window may have various configurations, such as for reducing acoustic reflectance or increasing mechanical properties. In some examples, at least one of the CMUTs, the acoustic window or the coupling medium may include a focusing capability for focusing acoustic energy to or from the CMUT.