Abstract: Resins (5, 6) are interposed as insulating layers between heat radiation side and heat absorption side heat exchange bodies (2, 3) and heat radiation side and heat absorption side electrodes (41, 42) of a thermoelectric conversion element module (4). The resin (5) is fusion bonded to the heat radiation side heat exchange body (2), and the resin (6) is fusion bonded to the heat radiation side heat exchange body (3). The material of the resins (5, 6) is, for example, a thermosetting plastic. The thermosetting plastic becomes soft when heated and then cures. At the time of fusion bonding of the resins (5, 6) to the heat exchange bodies (2, 3), the heat exchange bodies (2, 3) and the resins (5, 6) are heated and pressed. Then, the resins (5, 6) become soft and enter the cavities and flaws formed in the surfaces of the heat exchange bodies (2, 3). The resins (5, 6) having entered the cavities and flaws cure to fill the cavities in the surfaces of the heat exchange bodies (2, 3).

Abstract: A fluid temperature control device, which includes: a main body block having a passage channel formed in a surface thereof; a thermal conducting plate that is provided on the surface of the main body block, and covers the passage channel to form a passage for passing a fluid to be temperature controlled; and temperature control means that carries out heat exchanging (heating/cooling), by way of the thermal conducting plate, with the fluid passing through the passage, in which the passage abutting on the thermal conducting plate connects a fluid inlet and a fluid outlet formed in the main body block, and is a single passage having an approximately constant passage cross-sectional area over its entire length.

Abstract: Between a characteristic a of a process chamber 21a having a large pressure loss and a characteristic b of a process chamber 21b having a small pressure loss, threshold value A (flow rate value Q3, pressure value P3) is set on the characteristic a. The threshold value A is set on a controller 9. When a rotation speed of a pump 3 is increased by an electric motor 8, the flow rate of a fluid flowing through pipelines 1, 2 and a flow path of a process chamber 21 increases. At the time, the flow rate of the fluid is measured by a flowmeter 4 and a pressure of the fluid is measured by a pressure switch 5. If the pressure reaches the pressure value P3 when the flow rate of the fluid reaches the flow rate value Q3, the pressure switch 5 operates. At the time, the controller 9 judges that the process chamber 21a having a large pressure loss is connected to the pipelines 1, 2.

Abstract: A film-like temperature sensor for more accurately measuring the temperatures at plural locations on the surface of a semiconductor wafer comprises a base film made of an insulating material; plural thin-film thermal elements for sensing temperature; plural thin-film leads, connected to the thermal elements; and plural thin-film terminals connected to the ends of the leads. The thermal elements, leads, and terminals are integrally formed either on the surface or in the thickness of the base film. The base film has a flat shape like a paddle, and comprises a head portion to be attached to the surface of a semiconductor wafer, and a strip-shaped tail portion extending outwardly of the semiconductor wafer. The plural thermal elements are arranged on the head portion in the form of either a concentric circle, spiral, matrix, or raster, and the plural terminals are arranged on the tail portion.

Abstract: A heat exchanger for executing heat exchange between heat exchange between heat exchange bodies (6) on a heat radiation side and heat exchange bodies (3) on a heat absorption side, having low thermal resistance and high performance of heat conduction includes heat exchange bodies 6 on a heat radiation side and heat exchange bodies 3 on a heat absorption side, each being disposed hierarchically, thermoelectric conversion element modules 2 interposed between the heat exchange body 6 on the heat radiation side and the heat exchange body 3 on the heat absorption side through an insulating coat 16, and having a plurality of thermoelectric conversion elements 12, 13, wherein the insulating coat 16 is formed integrally on a surface of at least one of the heat exchange body 6 on the heat radiation side and the heat exchange body 3 on the heat absorption side, and a metal coat 17 keeping electric contact with a surface of the thermoelectric conversion elements 12, 13 on either the heat radiation side or the heat absor