Patents Assigned to Komatsuseiki Kosakusho Co., Ltd
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Publication number: 20220226548Abstract: Aspects of the invention relate to a metal material and product made from the metal material having biological properties, such as antibiotic properties.Type: ApplicationFiled: September 27, 2019Publication date: July 21, 2022Applicant: KOMATSUSEIKI KOSAKUSHO CO., LTD.Inventors: Fumie Yusa, Thomas J. Webster, Takafumi Komatsu
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Publication number: 20220010417Abstract: Aspects of the invention relate to a metal material and article made from the metal material having biological properties, such as antibiotic properties.Type: ApplicationFiled: March 20, 2020Publication date: January 13, 2022Applicant: KOMATSUSEIKI KOSAKUSHO CO., LTD.Inventors: Fumie Yusa, Thomas J. Webster, Takafumi Komatsu
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Publication number: 20210298320Abstract: Provided is a metal material capable of optimizing a response of a fermentative microorganism, a method of controlling a response of a fermentative microorganism, and a method of producing a fermented food product. A metal material includes a crystal grain having an average crystal grain size for controlling a response of a fermentative microorganism. The average crystal grain size of the crystal grain is preferably 100 nm or more and 10 ?m or less. The metal material is preferably stainless steel. It is preferable that the response of the fermentative microorganism is adsorption or growth of the fermentative microorganism on the metal material.Type: ApplicationFiled: September 27, 2019Publication date: September 30, 2021Applicant: KOMATSUSEIKI KOSAKUSHO CO., LTD.Inventors: Takafumi Komatsu, Fumie Yusa
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Patent number: 10549380Abstract: A method for bonding stainless steel members includes: contacting a first stainless steel member with a second stainless steel member that has a strain exceeding 50% reduction; and heating the first and second stainless steel members to a re-crystallization initiation temperature or higher, after the contacting.Type: GrantFiled: March 28, 2017Date of Patent: February 4, 2020Assignees: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY, KOMATSUSEIKI KOSAKUSHO CO., LTD.Inventors: Masahito Katoh, Tomomi Shiratori
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Patent number: 10449629Abstract: A method for bonding stainless steel members includes: contacting a first stainless steel member with a second stainless steel member that has a strain exceeding 50% reduction; and heating the first and second stainless steel members to a re-crystallization initiation temperature or higher, after the contacting.Type: GrantFiled: November 22, 2016Date of Patent: October 22, 2019Assignees: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY, KOMATSUSEIKI KOSAKUSHO CO., LTD.Inventors: Masahito Katoh, Tomomi Shiratori
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Publication number: 20170197276Abstract: A method for bonding stainless steel members includes: contacting a first stainless steel member with a second stainless steel member that has a strain exceeding 50% reduction; and heating the first and second stainless steel members to a re-crystallization initiation temperature or higher, after the contacting.Type: ApplicationFiled: March 28, 2017Publication date: July 13, 2017Applicants: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY, KOMATSUSEIKI KOSAKUSHO CO., LTD.Inventors: Masahito KATOH, Tomomi SHIRATORI
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Publication number: 20170197275Abstract: A method for bonding stainless steel members includes: contacting a first stainless steel member with a second stainless steel member that has a strain exceeding 50% reduction; and heating the first and second stainless steel members to a re-crystallization initiation temperature or higher, after the contacting.Type: ApplicationFiled: March 28, 2017Publication date: July 13, 2017Applicants: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY, KOMATSUSEIKI KOSAKUSHO CO., LTD.Inventors: Masahito KATOH, Tomomi SHIRATORI
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Publication number: 20170072503Abstract: A method for bonding stainless steel members includes: contacting a first stainless steel member with a second stainless steel member that has a strain exceeding 50% reduction; and heating the first and second stainless steel members to a re-crystallization initiation temperature or higher, after the contacting.Type: ApplicationFiled: November 22, 2016Publication date: March 16, 2017Applicants: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY, KOMATSUSEIKI KOSAKUSHO CO., LTD.Inventors: Masahito KATOH, Tomomi SHIRATORI
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Publication number: 20160031035Abstract: A method for bonding stainless steel members includes: contacting a first stainless steel member with a second stainless steel member that has a strain exceeding 50% reduction; and heating the first and second stainless steel members to a re-crystallization initiation temperature or higher, after the contacting.Type: ApplicationFiled: October 13, 2015Publication date: February 4, 2016Applicants: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY, KOMATSUSEIKI KOSAKUSHO CO., LTD.Inventors: Masahito KATOH, Tomomi SHIRATORI
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Patent number: 8631579Abstract: A lead hole is formed in a base material of an injection hole member with a straight punch, and then, a taper hole is formed in the base material by widening the lead hole with a taper punch. An intersection line between a virtual plane perpendicular to a central axis of the lead hole and an inner peripheral surface of the lead hole is elliptic in shape, whose major axis is directed along an intersection line between a virtual plane, which includes the central axis of the lead hole and a thickness direction axis of the base material, and the virtual plane perpendicular to the central axis of the lead hole. An intersection line between a virtual plane perpendicular to a central axis of the taper punch and an outer peripheral surface of the taper punch is round in shape.Type: GrantFiled: February 14, 2011Date of Patent: January 21, 2014Assignees: Denso Corporation, Komatsuseiki Kosakusho Co., Ltd.Inventors: Masanori Miyagawa, Tsunehiro Uehara
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Publication number: 20110138628Abstract: A lead hole is formed in a base material of an injection hole member with a straight punch, and then, a taper hole is formed in the base material by widening the lead hole with a taper punch. An intersection line between a virtual plane perpendicular to a central axis of the lead hole and an inner peripheral surface of the lead hole is elliptic in shape, whose major axis is directed along an intersection line between a virtual plane, which includes the central axis of the lead hole and a thickness direction axis of the base material, and the virtual plane perpendicular to the central axis of the lead hole. An intersection line between a virtual plane perpendicular to a central axis of the taper punch and an outer peripheral surface of the taper punch is round in shape.Type: ApplicationFiled: February 14, 2011Publication date: June 16, 2011Applicants: DENSO CORPORATION, KOMATSUSEIKI KOSAKUSHO CO., LTD.Inventors: Masanori Miyagawa, Tsunehiro Uehara
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Patent number: 7908733Abstract: A lead hole is formed in a base material of an injection hole member with a straight punch, and then, a taper hole is formed in the base material by widening the lead hole with a taper punch. An intersection line between a virtual plane perpendicular to a central axis of the lead hole and an inner peripheral surface of the lead hole is elliptic in shape, whose major axis is directed along an intersection line between a virtual plane, which includes the central axis of the lead hole and a thickness direction axis of the base material, and the virtual plane perpendicular to the central axis of the lead hole. An intersection line between a virtual plane perpendicular to a central axis of the taper punch and an outer peripheral surface of the taper punch is round in shape.Type: GrantFiled: September 4, 2008Date of Patent: March 22, 2011Assignees: Denso Corporation, Komatsuseiki Kosakusho Co., LtdInventors: Masanori Miyagawa, Tsunehiro Uehara
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Patent number: 7827691Abstract: A method for manufacturing a nozzle plate, which has a nozzle hole, includes radiating of a plurality of laser beams. The method further includes applying of the plurality of laser beams to at least one axial end surface of a plate member substantially throughout an inner circumferential periphery, which defines a boundary between a small hole defining the nozzle hole and the plate member.Type: GrantFiled: June 27, 2007Date of Patent: November 9, 2010Assignees: Denso Corporation, Komatsuseiki Kosakusho Co., LtdInventors: Masanori Miyagawa, Tsunehiro Uehara
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Publication number: 20090007411Abstract: A lead hole is formed in a base material of an injection hole member with a straight punch, and then, a taper hole is formed in the base material by widening the lead hole with a taper punch. An intersection line between a virtual plane perpendicular to a central axis of the lead hole and an inner peripheral surface of the lead hole is elliptic in shape, whose major axis is directed along an intersection line between a virtual plane, which includes the central axis of the lead hole and a thickness direction axis of the base material, and the virtual plane perpendicular to the central axis of the lead hole. An intersection line between a virtual plane perpendicular to a central axis of the taper punch and an outer peripheral surface of the taper punch is round in shape.Type: ApplicationFiled: September 4, 2008Publication date: January 8, 2009Applicants: DENSO CORPORATION, KOMATSUSEIKI KOSAKUSHO CO., LTD.Inventors: Masanori Miyagawa, Tsunehiro Uehara
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Publication number: 20080000085Abstract: A method for manufacturing a nozzle plate, which has a nozzle hole, includes radiating of a plurality of laser beams. The method further includes applying of the plurality of laser beams to at least one axial end surface of a plate member substantially throughout an inner circumferential periphery, which defines a boundary between a small hole defining the nozzle hole and the plate member.Type: ApplicationFiled: June 27, 2007Publication date: January 3, 2008Applicants: DENSO CORPORATION, KOMATSUSEIKI KOSAKUSHO CO., LTD.Inventors: Masanori Miyagawa, Tsunehiro Uehara