Abstract: An electrical thick-layer fuse 10 and a method of manufacturing such a fuse is described. Here a conductive paste is printed onto a substrate 12 for the manufacture of a resistive layer 24. A dielectric layer 22 is however expediently first applied to the substrate in the manner of a podium to which the resistive layer 24 is then applied in overlapping manner. Two electrodes 14, 16 having a spacing d from one another are then applied onto this resistive layer 24, with a web of the resistive layer 24 forming a thick-film fuse being left between the two electrodes. The web width is set by laser treatment.
Type:
Grant
Filed:
July 7, 1993
Date of Patent:
November 22, 1994
Assignee:
Roederstein Spezialfabriken fuer Bauelemente der Elektronik und Kondensatoren der Starkstromtechnik GmbH
Abstract: A temperature responsive electric overcurrent protection module incorporated in an electric circuit on a circuitboard has a PTC resistor which heats up when subjected to an excessive current. Its resistance rises with its temperature to control the current and protect the circuit, including electric components thereof. To protect the circuit against occasionally encountered, large overcurrents, which could damage the circuits and/or cause a burn-out, a thermal switch or overcurrent fuse is provided which comprises an electrically and thermally conductive contact plate, and an associate thermal switch formed by a planar frame secured to the substrate and a spring arm protruding therefrom.
Type:
Grant
Filed:
June 11, 1993
Date of Patent:
November 8, 1994
Assignee:
Roederstein Spezialfabriken fuer Bauelemente der Elektronik und Kondensatoren der Starkstromtechnik GmbH.
Abstract: A thermal overload fuse (1) for fixation to a circuit substrate (17) comprising at least one spring arm (13) which is solderable, under fixed pre-stressed, to a contact location on the substrate, characterized in that the spring arm (13), which is fixed to an at least substantially planar frame part (2), adopts, in its relaxed state, a position which is spaced in a perpendicular direction relative to the substrate (17), in particular relative to the contact location (16); and in that the free end of the spring arm (13) is held down by at least one auxiliary web (7) onto the substrate (17), in particular onto the contact location (16); and in that the auxiliary web (7) is detachable from the frame part (2) along a predetermined line.
Type:
Grant
Filed:
March 19, 1993
Date of Patent:
January 18, 1994
Assignee:
Roederstein Spezialfabriken fur Bauelemente der Elektronik und Kondensatoren der Starkstromtechnik GmbH
Abstract: A method of adjusting the values of resistors is described wherein regions of a resistive layer provided on a substrate are removed by means of a laser in dependence on the resistance that is required and/or by cutting marks of a specific shape into the resistive layer. In order to obtain resistors with values which are defined as accurately as possible, and which are free of disturbing inductivity, a point raster is formed in the resistive layer by means of single shots of the laser, with the extent and position of the raster, and/or the spacing between its individual points, and/or the size of the individual points being chosen in relation to the total area of the resistive layer in dependence on the required resistance and further physical values.
Type:
Grant
Filed:
September 18, 1984
Date of Patent:
May 12, 1987
Assignees:
Roederstein Spezialfabriken fur Bauelemente der Elektronik, Kondensatoren der Starkstromtechnik GmbH