Patents Assigned to KONINKLILKE PHILIPS ELECTRONICS N.V.
  • Surface-mounted device with leads
    Publication number: 20060258058
    Abstract: A surface-mounted device comprising a semiconductor chip (5) encapsulated in a package (1) and leads (2) projecting from the package so as to bring the semiconductor chip into contact with a substrate (3), which leads are provided at their surface, at the location of one of the pads provided for surface mounting, with a three-dimensional contact pattern.
    Type: Application
    Filed: August 17, 2004
    Publication date: November 16, 2006
    Applicant: KONINKLILKE PHILIPS ELECTRONICS N.V.
    Inventor: Bernd Offermann