Patents Assigned to Koninkljike Philips Electronics N.V.
  • Method for forming metal interconnects in a dielectric material
    Patent number: 8138082
    Abstract: A semiconductor device includes an interconnect having electrically conductive portions and a dielectric layer made of a first dielectric material. A trench is formed in the dielectric layer. The exposed portions of the dielectric layer which form the side walls of the trench are removed. A dielectric liner is then deposited on the side walls of the trench, the liner being made of a second dielectric material.
    Type: Grant
    Filed: February 26, 2007
    Date of Patent: March 20, 2012
    Assignees: STMicroelectronics (Crolles 2) SAS, Koninkljike Philips Electronics N.V.
    Inventors: Joaquin Torres, Vincent Arnal, Laurent-Georges Gosset, Wim Besling